Sangmin Lee

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Santa Barbara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and system for bonding a semiconductor chip onto a carrier u...
- Patent number 7,326,637
- Issue date Feb 5, 2008
- Research Foundation of State University of New York
- Sangmin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for bonding a semiconductor chip onto a carrier u...
- Patent number 7,064,432
- Issue date Jun 20, 2006
- The Research Foundation of State University of New York
- Sangmin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method and system for bonding a semiconductor chip onto a carrier u...
- Publication number 20060186541
- Publication date Aug 24, 2006
- Sangmin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and system for bonding a semiconductor chip onto a carrier u...
- Publication number 20040038496
- Publication date Feb 26, 2004
- Sangmin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR