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Satoshi Tomita
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Tochigi-ken, JP
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last 30 patents
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Patent Grant
Layered solder material for bonding different species of electrodes...
Patent number
9,669,493
Issue date
Jun 6, 2017
Senju Metal Industry Co., Ltd.
Koji Watanabe
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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last 30 patents
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LAYERED SOLDER MATERIAL FOR BONDING DISSIMILAR ELECTRODES, AND METH...
Publication number
20150314396
Publication date
Nov 5, 2015
SENJU METAL INDUSTRY CO., LTD
Koji WATANABE
B32 - LAYERED PRODUCTS