SeungDae SEOK

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate alignment device and a semiconductor substr...
- Patent number 12,027,401
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Gwanghee Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding apparatuses
- Patent number 11,443,965
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Kyeongbin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 10,784,130
- Issue date Sep 22, 2020
- Samsung Electronics Co., Ltd.
- Joong-Ha Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
- Publication number 20240234215
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Donggap SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20240153906
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Byeongtak PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
- Publication number 20240136231
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Donggap SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFE...
- Publication number 20240038536
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- YONGIN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS, SUBSTRATE BONDING SYSTEM INCLUDING THE...
- Publication number 20230215698
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Inhwa Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE ALIGNMENT DEVICE AND A SEMICONDUCTOR SUBSTR...
- Publication number 20220068688
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Gwanghee JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TO WAFER BONDING APPARATUS, WAFER TO WAFER BONDING SYSTEM, AN...
- Publication number 20210143030
- Publication date May 13, 2021
- Samsung Electronics Co., Ltd.
- Kyeongbin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TO WAFER BONDING METHODS AND WAFER TO WAFER BONDING APPARATUSES
- Publication number 20210005475
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Kyeongbin LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20180174871
- Publication date Jun 21, 2018
- Samsung Electronics Co., Ltd.
- Joong-Ha LEE
- H01 - BASIC ELECTRIC ELEMENTS

SeungDae SEOK

Person

Patents Grantslast 30 patents

Semiconductor substrate alignment device and a semiconductor substr...

Wafer to wafer bonding apparatuses

Bonding apparatus

Patents Applicationslast 30 patents

APPARATUS FOR MEASURING AN ADHESION FORCE

SUBSTRATE BONDING APPARATUS

APPARATUS FOR MEASURING AN ADHESION FORCE

PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFE...

PLASMA PROCESSING APPARATUS, SUBSTRATE BONDING SYSTEM INCLUDING THE...

SEMICONDUCTOR SUBSTRATE ALIGNMENT DEVICE AND A SEMICONDUCTOR SUBSTR...

WAFER TO WAFER BONDING APPARATUS, WAFER TO WAFER BONDING SYSTEM, AN...

WAFER TO WAFER BONDING METHODS AND WAFER TO WAFER BONDING APPARATUSES

BONDING APPARATUS