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Wuhan, CN
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last 30 patents
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Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM AND...
Publication number
20240379473
Publication date
Nov 14, 2024
Yangtze Memory Technologies Co., Ltd.
Peng CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATION
Publication number
20240371716
Publication date
Nov 7, 2024
Yangtze Memory Technologies Co., Ltd.
Li TAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20240363460
Publication date
Oct 31, 2024
Yangtze Memory Technologies Co., Ltd.
Li TAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MEMORY SYSTEM
Publication number
20240347406
Publication date
Oct 17, 2024
Yangtze Memory Technologies Co., Ltd.
Shanshan ZHAO
H01 - BASIC ELECTRIC ELEMENTS