Sheila Marie L. Alvarez

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package heat spreader
- Patent number 8,207,598
- Issue date Jun 26, 2012
- ST Assembly Test Services Ltd.
- Virgil Cotoco Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system employing device stacking
- Patent number 8,174,127
- Issue date May 8, 2012
- Stats Chippac Ltd.
- Frederick Rodriguez Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system employing device stacking and met...
- Patent number 8,120,187
- Issue date Feb 21, 2012
- Stats Chippac Ltd.
- Frederick Rodriguez Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system employing device stacking
- Patent number 7,830,020
- Issue date Nov 9, 2010
- Stats Chippac Ltd.
- Frederick Rodriguez Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for semiconductor package heat spreaders
- Patent number 7,575,956
- Issue date Aug 18, 2009
- ST Assembly Test Services Ltd.
- Virgil Cotoco Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit encapsulation system with vent
- Patent number 7,482,683
- Issue date Jan 27, 2009
- Stats Chippac Ltd.
- Antonio B. Dimaano, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with downset lead
- Patent number 7,443,015
- Issue date Oct 28, 2008
- Stats Chippac Ltd.
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched leadframe flipchip package system
- Patent number 7,414,318
- Issue date Aug 19, 2008
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with controlled solder bump wetting
- Patent number 7,352,055
- Issue date Apr 1, 2008
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader for thermally enhanced semiconductor package
- Patent number 7,327,025
- Issue date Feb 5, 2008
- ST Assembly Test Services Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched leadframe flipchip package system
- Patent number 7,250,685
- Issue date Jul 31, 2007
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with selective underfill and fabrication meth...
- Patent number 7,169,641
- Issue date Jan 30, 2007
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strip-fabricated flip chip in package and flip chip in system heat...
- Patent number 7,153,725
- Issue date Dec 26, 2006
- ST Assembly Test Services Ltd.
- Tie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with controlled solder bump wetting and fabri...
- Patent number 7,148,086
- Issue date Dec 12, 2006
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING
- Publication number 20110147899
- Publication date Jun 23, 2011
- Frederick Rodriguez Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FLIP CHIP PACKAGE HAVING SUBSTANTIALLY NON-COLLAPSIBL...
- Publication number 20110108970
- Publication date May 12, 2011
- Jae Soo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING AND MET...
- Publication number 20110012270
- Publication date Jan 20, 2011
- Frederick Rodriguez Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HEAT SPREADER
- Publication number 20090273062
- Publication date Nov 5, 2009
- Virgil Cotoco Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING
- Publication number 20080315411
- Publication date Dec 25, 2008
- Frederick Rodriguez Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PERIMETER PADDLE
- Publication number 20080284038
- Publication date Nov 20, 2008
- Antonio B. Dimaano, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS
- Publication number 20080272487
- Publication date Nov 6, 2008
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ENCAPSULATION SYSTEM WITH VENT
- Publication number 20070262423
- Publication date Nov 15, 2007
- STATS ChipPAC Ltd.
- Antonio B. Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHED LEADFRAME FLIPCHIP PACKAGE SYSTEM
- Publication number 20070108565
- Publication date May 17, 2007
- STATS ChipPAC Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader for thermally enhanced semiconductor package
- Publication number 20050242428
- Publication date Nov 3, 2005
- ST ASSEMBLY TEST SERVICES LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Strip-fabricated flip chip in package and flip chip in system heat...
- Publication number 20050161780
- Publication date Jul 28, 2005
- ST ASSEMBLY TEST SERVICES LTD.
- Tie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreaders, heat spreader packages, and fabrication methods for...
- Publication number 20040075987
- Publication date Apr 22, 2004
- ST ASSEMBLY TEST SERVICES LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Sheila Marie L. Alvarez

Person

Patents Grantslast 30 patents

Semiconductor package heat spreader

Integrated circuit package system employing device stacking

Integrated circuit package system employing device stacking and met...

Integrated circuit package system employing device stacking

Fabrication method for semiconductor package heat spreaders

Integrated circuit encapsulation system with vent

Integrated circuit package system with downset lead

Etched leadframe flipchip package system

Semiconductor package with controlled solder bump wetting

Heat spreader for thermally enhanced semiconductor package

Etched leadframe flipchip package system

Semiconductor package with selective underfill and fabrication meth...

Strip-fabricated flip chip in package and flip chip in system heat...

Semiconductor package with controlled solder bump wetting and fabri...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING

SEMICONDUCTOR FLIP CHIP PACKAGE HAVING SUBSTANTIALLY NON-COLLAPSIBL...

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING AND MET...

SEMICONDUCTOR PACKAGE HEAT SPREADER

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PERIMETER PADDLE

SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS

INTEGRATED CIRCUIT ENCAPSULATION SYSTEM WITH VENT

ETCHED LEADFRAME FLIPCHIP PACKAGE SYSTEM

Heat spreader for thermally enhanced semiconductor package

Strip-fabricated flip chip in package and flip chip in system heat...

Heat spreaders, heat spreader packages, and fabrication methods for...