SHENG-YANG PENG

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Process of fabricating chip
- Patent number 8,501,579
- Issue date Aug 6, 2013
- Advanced Semiconductor Engineering, Inc.
- Sheng-Yang Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer sawing method
- Patent number 7,611,967
- Issue date Nov 3, 2009
- Advanced Semiconductor Engineering, Inc.
- Sheng-Yang Peng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor packaging structure having electromagnetic shielding...
- Patent number 7,573,124
- Issue date Aug 11, 2009
- Advanced Semiconductor Engineering, Inc.
- Meng-Jen Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure compatible with cooling system
- Patent number 7,071,553
- Issue date Jul 4, 2006
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yueh Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure compatible with cooling system
- Patent number 6,801,429
- Issue date Oct 5, 2004
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yueh Tsai
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
CHIP STRUCTURE AND WAFER STRUCTURE
- Publication number 20130292803
- Publication date Nov 7, 2013
- Sheng-Yang Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGES AND METHODS OF MAKING
- Publication number 20130161670
- Publication date Jun 27, 2013
- Sheng-Yang Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, WAFER STRUCTURE AND PROCESS OF FAABRICATING CHIP
- Publication number 20100230788
- Publication date Sep 16, 2010
- Advanced Semiconductor Engineering, Inc.
- SHENG-YANG PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE, APPLICATIONS THEREOF AND MANUFACTU...
- Publication number 20090140413
- Publication date Jun 4, 2009
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Meng-Jen WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER SAWING METHOD
- Publication number 20080261351
- Publication date Oct 23, 2008
- Advanced Semiconductor Engineering, Inc.
- Sheng-Yang Peng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CHIP HERMETIC PACKAGE DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20080230885
- Publication date Sep 25, 2008
- Advanced Semiconductor Engineering, Inc.
- Meng-jen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE HAVING ELECTROMAGNETIC SHIELDING...
- Publication number 20080087987
- Publication date Apr 17, 2008
- Meng-Jen Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20070252261
- Publication date Nov 1, 2007
- Meng-Jen Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE COMPATIBLE WITH COOLING SYSTEM
- Publication number 20050006756
- Publication date Jan 13, 2005
- Tsung-Yueh Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[PACKAGE STRUCTURE COMPATIBLE WITH COOLING SYSTEM]
- Publication number 20040165351
- Publication date Aug 26, 2004
- TSUNG-YUEH TSAI
- G06 - COMPUTING CALCULATING COUNTING

SHENG-YANG PENG

Person

Patents Grantslast 30 patents

Process of fabricating chip

Wafer sawing method

Semiconductor packaging structure having electromagnetic shielding...

Package structure compatible with cooling system

Package structure compatible with cooling system

Patents Applicationslast 30 patents

CHIP STRUCTURE AND WAFER STRUCTURE

LIGHT EMITTING DIODE PACKAGES AND METHODS OF MAKING

CHIP STRUCTURE, WAFER STRUCTURE AND PROCESS OF FAABRICATING CHIP

SEMICONDUCTOR PACKAGE STRUCTURE, APPLICATIONS THEREOF AND MANUFACTU...

WAFER SAWING METHOD

CHIP HERMETIC PACKAGE DEVICE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR PACKAGING STRUCTURE HAVING ELECTROMAGNETIC SHIELDING...

SEMICONDUCTOR DEVICE PACKAGE

PACKAGE STRUCTURE COMPATIBLE WITH COOLING SYSTEM

[PACKAGE STRUCTURE COMPATIBLE WITH COOLING SYSTEM]