Shinobu Ishii

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method, wire bonding apparatus, and wire bonding contr...
- Patent number 8,042,725
- Issue date Oct 25, 2011
- Kaijo Corporation
- Toru Arahata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method, wire bonding apparatus, and wire bonding contr...
- Patent number 7,748,599
- Issue date Jul 6, 2010
- Kaijo Corporation
- Toru Arahata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method, method of forming bump and bump
- Patent number 6,715,666
- Issue date Apr 6, 2004
- Kaijo Corporation
- Rei Imai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTR...
- Publication number 20100206940
- Publication date Aug 19, 2010
- KAIJO CORPORATION
- Toru ARAHATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING METHOD, WIRE BONDING APPARATUS, AND WIRE BONDING CONTR...
- Publication number 20100059574
- Publication date Mar 11, 2010
- KAIJO CORPORATION
- Toru ARAHATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING METHOD, METHOD OF FORMING BUMP AND BUMP
- Publication number 20040026480
- Publication date Feb 12, 2004
- KAIJO CORPORATION
- Rei Imai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR