Sixin JI

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Nan Tong, CN

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Patents Grantslast 30 patents

Information Patent Grant
Module with substrate recess for conductive-bonding component
- Patent number 12,354,930
- Issue date Jul 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Leo Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with substrate recess for conductive-bonding component
- Patent number 11,776,871
- Issue date Oct 3, 2023
- Semiconductor Components Industries, LLC
- Leo Gu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH LEAD FRAME CLIP
- Publication number 20250157893
- Publication date May 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES
- Publication number 20250015044
- Publication date Jan 9, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hao YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT
- Publication number 20240030093
- Publication date Jan 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Leo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT
- Publication number 20220189848
- Publication date Jun 16, 2022
- Semiconductor Components Industries, LLC
- Leo GU
- H01 - BASIC ELECTRIC ELEMENTS