Steven J. Carey

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Flip-chip package having thermal expansion posts
- Patent number 7,667,473
- Issue date Feb 23, 2010
- Xilinx, Inc.
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-heating mechanism for duplicating microbump failure conditions...
- Patent number 7,362,121
- Issue date Apr 22, 2008
- Xilinx, Inc.
- Robert O. Conn
- G01 - MEASURING TESTING
Information Patent Grant
Interposer providing low-inductance decoupling capacitance for a pa...
- Patent number 6,961,231
- Issue date Nov 1, 2005
- Xilinx, Inc.
- Mark A. Alexander
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer providing low-inductance decoupling capacitance for a pa...
- Patent number 6,891,258
- Issue date May 10, 2005
- Xilinx, Inc.
- Mark A. Alexander
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR