TREA

Taebok Jung

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  • Seoul, KR
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Patents Grantslast 30 patents

  • Information Patent Grant

    Stacked die package system
    • Patent number 7,674,640
    • Issue date Mar 9, 2010
    • Stats Chippac Ltd.
    • Jong-Woo Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multichip leadframe package
    • Patent number 7,436,048
    • Issue date Oct 14, 2008
    • ChipPAC, Inc.
    • Jongwoo Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stacked die package system
    • Patent number 7,279,785
    • Issue date Oct 9, 2007
    • Stats Chippac Ltd.
    • Jong-Woo Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multichip leadframe package
    • Patent number 7,208,821
    • Issue date Apr 24, 2007
    • ChipPAC, Inc.
    • Jongwoo Ha
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    STACKED DIE PACKAGE SYSTEM
    • Publication number 20070284718
    • Publication date Dec 13, 2007
    • Jong-Woo Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multichip leadframe package
    • Publication number 20070152308
    • Publication date Jul 5, 2007
    • ChipPAC, Inc.
    • Jongwoo Ha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multichip leadframe package
    • Publication number 20060081967
    • Publication date Apr 20, 2006
    • ChipPAC, Inc.
    • Jongwoo Ha
    • H01 - BASIC ELECTRIC ELEMENTS