TAESEONG KIM

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices having penetration vias
- Patent number 12,347,781
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a lower chip including a peripheral...
- Patent number 12,166,000
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Hoonjoo Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via, semiconductor package,...
- Patent number 12,107,109
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via structure
- Patent number 12,046,538
- Issue date Jul 23, 2024
- Samsung Electronics Co., Ltd.
- Sonkwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit semiconductor device including through silicon via
- Patent number 11,955,408
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Sohye Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through vias and methods of fabrica...
- Patent number 11,791,211
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via structure
- Patent number 11,749,586
- Issue date Sep 5, 2023
- Samsung Electronics Co., Ltd.
- Sonkwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having penetration vias with portions having...
- Patent number 11,664,316
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via, semiconductor package,...
- Patent number 11,626,443
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including through holes and methods of fabri...
- Patent number 11,373,932
- Issue date Jun 28, 2022
- Samsung Electronics Co., Ltd.
- Hyoukyung Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through vias and methods of fabrica...
- Patent number 11,295,981
- Issue date Apr 5, 2022
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,133,240
- Issue date Sep 28, 2021
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via, semiconductor package,...
- Patent number 10,734,430
- Issue date Aug 4, 2020
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-electrodes and methods for fab...
- Patent number 9,847,276
- Issue date Dec 19, 2017
- Samsung Electronics Co., Ltd.
- Pil-Kyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of fabricating the same
- Patent number 9,679,829
- Issue date Jun 13, 2017
- Samsung Electronics Co., Ltd.
- Kwangjin Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of fabricating the same
- Patent number 9,153,522
- Issue date Oct 6, 2015
- Samsung Electronics Co., Ltd.
- Kwangjin Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 8,836,142
- Issue date Sep 16, 2014
- Samsung Electronics Co., Ltd.
- Yeun-Sang Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
- Publication number 20250062262
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Hoonjoo NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFAC...
- Publication number 20240071841
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Sumin PARK
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE
- Publication number 20230361004
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Sonkwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING PENETRATION VIAS
- Publication number 20230260916
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA, SEMICONDUCTOR PACKAGE,...
- Publication number 20230230995
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING ENHANCEMENT LAYER AND METHOD...
- Publication number 20220406740
- Publication date Dec 22, 2022
- Samsung Electronics Co., Ltd.
- Taeyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE
- Publication number 20220310485
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- Sonkwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
- Publication number 20220310541
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- Hoonjoo NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THROUGH VIAS AND METHODS OF FABRICA...
- Publication number 20220199469
- Publication date Jun 23, 2022
- Samsung Electronics Co., Ltd.
- YI KOAN HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE INCLUDING THROUGH SILICON VIA
- Publication number 20210305130
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- Sohye CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING PENETRATION VIAS
- Publication number 20210043575
- Publication date Feb 11, 2021
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20210020543
- Publication date Jan 21, 2021
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING THROUGH HOLES AND METHODS OF FABRI...
- Publication number 20210005533
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Hyoukyung Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THROUGH VIAS AND METHODS OF FABRICA...
- Publication number 20200381301
- Publication date Dec 3, 2020
- Samsung Electronics Co., Ltd.
- YI KOAN HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA, SEMICONDUCTOR PACKAGE,...
- Publication number 20200343291
- Publication date Oct 29, 2020
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200066682
- Publication date Feb 27, 2020
- Samsung Electronics Co., Ltd.
- Taeseong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA, SEMICONDUCTOR PACKAGE,...
- Publication number 20190386051
- Publication date Dec 19, 2019
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTERPOSER AND A METHOD OF MANUFACTURING A SEM...
- Publication number 20180108540
- Publication date Apr 19, 2018
- Samsung Electronics Co., Ltd.
- Jae-Hyun Phee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20150332967
- Publication date Nov 19, 2015
- KWANGJIN MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH-ELECTRODES AND METHODS FOR FAB...
- Publication number 20150137326
- Publication date May 21, 2015
- Pil-Kyu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20140084473
- Publication date Mar 27, 2014
- KWANGJIN MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices
- Publication number 20140008815
- Publication date Jan 9, 2014
- Yeun-Sang Park
- H01 - BASIC ELECTRIC ELEMENTS

TAESEONG KIM

Person

Patents Grantslast 30 patents

Semiconductor devices having penetration vias

Semiconductor device including a lower chip including a peripheral...

Semiconductor device including through via, semiconductor package,...

Semiconductor device including through via structure

Integrated circuit semiconductor device including through silicon via

Semiconductor devices including through vias and methods of fabrica...

Semiconductor device including through via structure

Semiconductor devices having penetration vias with portions having...

Semiconductor device including through via, semiconductor package,...

Semiconductor packages including through holes and methods of fabri...

Semiconductor devices including through vias and methods of fabrica...

Semiconductor device and semiconductor package

Semiconductor device including through via, semiconductor package,...

Semiconductor devices having through-electrodes and methods for fab...

Semiconductor devices and methods of fabricating the same

Semiconductor devices and methods of fabricating the same

Semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME

LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFAC...

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE

SEMICONDUCTOR DEVICES HAVING PENETRATION VIAS

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA, SEMICONDUCTOR PACKAGE,...

SEMICONDUCTOR DEVICE INCLUDING BONDING ENHANCEMENT LAYER AND METHOD...

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICES INCLUDING THROUGH VIAS AND METHODS OF FABRICA...

INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE INCLUDING THROUGH SILICON VIA

SEMICONDUCTOR DEVICES HAVING PENETRATION VIAS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES INCLUDING THROUGH HOLES AND METHODS OF FABRI...

SEMICONDUCTOR DEVICES INCLUDING THROUGH VIAS AND METHODS OF FABRICA...

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA, SEMICONDUCTOR PACKAGE,...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA, SEMICONDUCTOR PACKAGE,...

METHOD OF FORMING AN INTERPOSER AND A METHOD OF MANUFACTURING A SEM...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR DEVICES HAVING THROUGH-ELECTRODES AND METHODS FOR FAB...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Semiconductor Devices