Tai-Min Chang

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HSINCHU CITY, TW

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Patents Grantslast 30 patents

Information Patent Grant
Thermal dissipation substrate
- Patent number 8,796,071
- Issue date Aug 5, 2014
- National Chiao Tung University
- YewChung Sermon Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shared buffer management mechanism and method using multiple linked...
- Patent number 6,363,075
- Issue date Mar 26, 2002
- Industrial Technology Research Institute
- Paul Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
THERMAL DISSIPATION SUBSTRATE
- Publication number 20120273803
- Publication date Nov 1, 2012
- NATIONAL CHIAO-TUNG UNIVERSITY
- YewChung Sermon Wu
- H01 - BASIC ELECTRIC ELEMENTS