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Takao Inaba

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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,623,344
    • Issue date Sep 23, 2003
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Polishing apparatus
    • Patent number 6,547,650
    • Issue date Apr 15, 2003
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,494,768
    • Issue date Dec 17, 2002
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer grinder and method of detecting grinding amount
    • Patent number 6,402,589
    • Issue date Jun 11, 2002
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,354,914
    • Issue date Mar 12, 2002
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing machine
    • Patent number 6,346,037
    • Issue date Feb 12, 2002
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,302,762
    • Issue date Oct 16, 2001
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer machining apparatus
    • Patent number 6,296,555
    • Issue date Oct 2, 2001
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Polishing apparatus
    • Patent number 6,203,414
    • Issue date Mar 20, 2001
    • Tokyo Seimitsu Co., Ltd.
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus with retainer ring
    • Patent number 6,196,905
    • Issue date Mar 6, 2001
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,080,049
    • Issue date Jun 27, 2000
    • Tokyo Seimitsu Co., Ltd.
    • Minoru Numoto
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus
    • Patent number 6,059,636
    • Issue date May 9, 2000
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing apparatus with retainer ring
    • Patent number 6,033,292
    • Issue date Mar 7, 2000
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Polishing apparatus
    • Patent number 5,961,378
    • Issue date Oct 5, 1999
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Apparatus for determining removed amount of wafer
    • Patent number 5,948,206
    • Issue date Sep 7, 1999
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing machine
    • Patent number 5,931,725
    • Issue date Aug 3, 1999
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Semiconductor wafer polishing machine
    • Patent number 5,876,272
    • Issue date Mar 2, 1999
    • Tokyo Seimitsu Co., Ltd.
    • Takao Inaba
    • B24 - GRINDING POLISHING