Takashi NAGASHIMA

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Sano-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multi wire bonding with current sensing method
- Patent number 11,519,943
- Issue date Dec 6, 2022
- Semiconductor Components Industries, LLC
- Hiroshi Inoguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI WIRE BONDING WITH CURRENT SENSING METHOD
- Publication number 20220137102
- Publication date May 5, 2022
- Semiconductor Components Industries, LLC
- Hiroshi INOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK FOR THERMAL RESPONSE CONTROL FOR INTEGRATED CIRCUITS
- Publication number 20210320054
- Publication date Oct 14, 2021
- Semiconductor Components Industries, LLC
- Hiroshi INOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS