Teck Jung Tang

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Patents Grantslast 30 patents

Information Patent Grant
Method of controlled low-k via etch for Cu interconnections
- Patent number 7,906,426
- Issue date Mar 15, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit processing system
- Patent number 7,749,894
- Issue date Jul 6, 2010
- Chartered Semiconductor Manufacturing Ltd.
- Xianbin Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DUAL STRESS LINERS FOR INTEGRATED CIRCUITS
- Publication number 20090014807
- Publication date Jan 15, 2009
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Teck Jung TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of controlled low-k via etch for Cu interconnections
- Publication number 20080258308
- Publication date Oct 23, 2008
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICIDE FORMATION FOR eSiGe USING SPACER OVERLAPPING eSiGe AND SIL...
- Publication number 20080246056
- Publication date Oct 9, 2008
- Victor W. C. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PROCESSING SYSTEM
- Publication number 20080111238
- Publication date May 15, 2008
- Chartered Semiconductor Manufacturing LTD.
- Xianbin Wang
- H01 - BASIC ELECTRIC ELEMENTS