Teruyuki ISHIHARA

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board having embedded pads and method for manufactur...
- Patent number 10,874,018
- Issue date Dec 22, 2020
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 10,674,604
- Issue date Jun 2, 2020
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having support plate and method for manufactur...
- Patent number 10,271,430
- Issue date Apr 23, 2019
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 10,256,175
- Issue date Apr 9, 2019
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board having embedded pads and method for manufactur...
- Patent number 10,249,561
- Issue date Apr 2, 2019
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,219,374
- Issue date Feb 26, 2019
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 10,051,736
- Issue date Aug 14, 2018
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined wiring board and method for manufacturing the same
- Patent number 10,004,145
- Issue date Jun 19, 2018
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 10,004,143
- Issue date Jun 19, 2018
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,949,372
- Issue date Apr 17, 2018
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing combined wiring board
- Patent number 9,844,151
- Issue date Dec 12, 2017
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 9,756,735
- Issue date Sep 5, 2017
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined wiring board and method for manufacturing combined wiring...
- Patent number 9,635,765
- Issue date Apr 25, 2017
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined wiring board
- Patent number 9,603,238
- Issue date Mar 21, 2017
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined wiring board and method for manufacturing combined wiring...
- Patent number 9,538,663
- Issue date Jan 3, 2017
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method for manufacturing flex-rigid wir...
- Patent number 9,480,173
- Issue date Oct 25, 2016
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for plug-in board replacement and method for manufacturing m...
- Patent number 9,370,101
- Issue date Jun 14, 2016
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined wiring board and method for manufacturing the same
- Patent number 9,277,655
- Issue date Mar 1, 2016
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined wiring board and method for manufacturing the same
- Patent number 9,277,650
- Issue date Mar 1, 2016
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,258,897
- Issue date Feb 9, 2016
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multi-piece substrate and multi-piece subs...
- Patent number 9,215,811
- Issue date Dec 15, 2015
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,066,439
- Issue date Jun 23, 2015
- Ibiden Co., Ltd.
- Hiroshi Segawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,040,837
- Issue date May 26, 2015
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,735,739
- Issue date May 27, 2014
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex-rigid wiring board and method for manufacturing the same
- Patent number 8,383,948
- Issue date Feb 26, 2013
- Ibiden Co., Ltd.
- Masakazu Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190327830
- Publication date Oct 24, 2019
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20190139877
- Publication date May 9, 2019
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180054888
- Publication date Feb 22, 2018
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20180054891
- Publication date Feb 22, 2018
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20180054890
- Publication date Feb 22, 2018
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20180053715
- Publication date Feb 22, 2018
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170317017
- Publication date Nov 2, 2017
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD FOR MANUFACTURIN...
- Publication number 20170263571
- Publication date Sep 14, 2017
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170245365
- Publication date Aug 24, 2017
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20170215282
- Publication date Jul 27, 2017
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20170196084
- Publication date Jul 6, 2017
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20170196096
- Publication date Jul 6, 2017
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170127517
- Publication date May 4, 2017
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20170064835
- Publication date Mar 2, 2017
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20170064825
- Publication date Mar 2, 2017
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20170053878
- Publication date Feb 23, 2017
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...
- Publication number 20170033036
- Publication date Feb 2, 2017
- IBIDEN CO., LTD.
- Kazuki KAJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160113120
- Publication date Apr 21, 2016
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT APPARATUS AND METHOD FOR MANUFACTURING ELECTRONI...
- Publication number 20150366102
- Publication date Dec 17, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD
- Publication number 20150257269
- Publication date Sep 10, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150245474
- Publication date Aug 27, 2015
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150136454
- Publication date May 21, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150136453
- Publication date May 21, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIR...
- Publication number 20150114689
- Publication date Apr 30, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIR...
- Publication number 20150114690
- Publication date Apr 30, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING...
- Publication number 20150085461
- Publication date Mar 26, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150083471
- Publication date Mar 26, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING...
- Publication number 20150055313
- Publication date Feb 26, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD
- Publication number 20140133110
- Publication date May 15, 2014
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20140131074
- Publication date May 15, 2014
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Teruyuki ISHIHARA

Person

Patents Grantslast 30 patents

Printed wiring board having embedded pads and method for manufactur...

Printed wiring board and method for manufacturing the same

Printed wiring board having support plate and method for manufactur...

Printed wiring board and method for manufacturing printed wiring board

Printed wiring board having embedded pads and method for manufactur...

Printed wiring board

Printed wiring board and method for manufacturing printed wiring board

Combined wiring board and method for manufacturing the same

Printed wiring board and method for manufacturing printed wiring board

Printed wiring board and method for manufacturing the same

Method for manufacturing combined wiring board

Method for manufacturing printed wiring board

Combined wiring board and method for manufacturing combined wiring...

Combined wiring board

Combined wiring board and method for manufacturing combined wiring...

Flex-rigid wiring board and method for manufacturing flex-rigid wir...

Method for plug-in board replacement and method for manufacturing m...

Combined wiring board and method for manufacturing the same

Combined wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Method for manufacturing multi-piece substrate and multi-piece subs...

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Flex-rigid wiring board and method for manufacturing the same

Patents Applicationslast 30 patents

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD FOR MANUFACTURIN...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC CIRCUIT APPARATUS AND METHOD FOR MANUFACTURING ELECTRONI...

COMBINED WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIR...

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIR...

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING...

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING...

COMBINED WIRING BOARD

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE