Tomohiro Ishino

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Ageo-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin composition, copper foil with resin, dielectric layer, copper...
- Patent number 12,351,698
- Issue date Jul 8, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Toshihiro Hosoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing copper-clad laminate
- Patent number 6,551,433
- Issue date Apr 22, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Fujio Kuwako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...
- Publication number 20220162418
- Publication date May 26, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Toshihiro HOSOI
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for producing copper-clad laminate
- Publication number 20020005249
- Publication date Jan 17, 2002
- Fujio Kuwako
- B32 - LAYERED PRODUCTS