Vladimir Perelman

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stackable package and method
- Patent number 9,496,210
- Issue date Nov 15, 2016
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable package and method
- Patent number 8,482,134
- Issue date Jul 9, 2013
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with fast power-up cycle and method of making...
- Patent number 8,084,868
- Issue date Dec 27, 2011
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic component package having film-on-wire spacer
- Patent number 8,072,083
- Issue date Dec 6, 2011
- Amkor Technology, Inc.
- Roger D. St. Amand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked flip chip die assembly
- Patent number 7,859,119
- Issue date Dec 28, 2010
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with fast power-up cycle and method of making...
- Patent number 7,768,135
- Issue date Aug 3, 2010
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic component package having film-on-wire spacer
- Patent number 7,675,180
- Issue date Mar 9, 2010
- Amkor Technology, Inc.
- Roger D. St. Amand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked die assembly having semiconductor die projecting beyond sup...
- Patent number 7,459,776
- Issue date Dec 2, 2008
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die assembly having semiconductor die overhanging support
- Patent number 7,132,753
- Issue date Nov 7, 2006
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-die extension support structure and method thereof
- Patent number 7,071,568
- Issue date Jul 4, 2006
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assembly having at least one support
- Patent number 6,930,378
- Issue date Aug 16, 2005
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hole generation and lead forming for integrated circuit lead frames...
- Patent number 5,767,480
- Issue date Jun 16, 1998
- National Semiconductor Corporation
- Noah L. Anglin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Vladimir Perelman

Person

Patents Grantslast 30 patents

Stackable package and method

Stackable package and method

Semiconductor package with fast power-up cycle and method of making...

Stacked electronic component package having film-on-wire spacer

Stacked flip chip die assembly

Semiconductor package with fast power-up cycle and method of making...

Stacked electronic component package having film-on-wire spacer

Stacked die assembly having semiconductor die projecting beyond sup...

Stacked die assembly having semiconductor die overhanging support

Stacked-die extension support structure and method thereof

Stacked semiconductor die assembly having at least one support

Hole generation and lead forming for integrated circuit lead frames...