Wai Keung Ng

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Tuen Mun, HK

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Patents Grantslast 30 patents

Information Patent Grant
Leadless semiconductor package and method
- Patent number 9,443,791
- Issue date Sep 13, 2016
- NXP B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20160035651
- Publication date Feb 4, 2016
- NXP B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS