Wang-Pen MO

Person

Pingtung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a photoresist layer
- Patent number 9,875,892
- Issue date Jan 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithography process on high topology features
- Patent number 9,791,775
- Issue date Oct 17, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wei Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Film portion at wafer edge
- Patent number 9,651,869
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wei Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Film portion at wafer edge
- Patent number 9,372,406
- Issue date Jun 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wei Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Thickening phase for spin coating process
- Patent number 9,360,755
- Issue date Jun 7, 2016
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Wei Chang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Test structure placement on a semiconductor wafer
- Patent number 9,349,662
- Issue date May 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithography process on high topology features
- Patent number 9,285,677
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wei Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of fabricating a metal grid for semiconductor device
- Patent number 9,153,620
- Issue date Oct 6, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a photoresist layer
- Patent number 9,028,915
- Issue date May 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wei Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Metal grid in backside illumination image sensor chips and methods...
- Patent number 8,940,574
- Issue date Jan 27, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 8,883,403
- Issue date Nov 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing techniques for workpieces with varying topographies
- Patent number 8,771,534
- Issue date Jul 8, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form a CMOS image sensor
- Patent number 8,759,225
- Issue date Jun 24, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung Chien Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and manufacturing methods thereof
- Patent number 8,692,296
- Issue date Apr 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing techniques to limit damage on workpiece with varying...
- Patent number 8,623,229
- Issue date Jan 7, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Lithography Process on High Topology Features
- Publication number 20160195807
- Publication date Jul 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wei Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF FABRICATING A METAL GRID FOR SEMICONDUCTOR DEVICE
- Publication number 20150249109
- Publication date Sep 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PHOTORESIST LAYER
- Publication number 20150243500
- Publication date Aug 27, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PORTION AT WAFER EDGE
- Publication number 20150212420
- Publication date Jul 30, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICKENING PHASE FOR SPIN COATING PROCESS
- Publication number 20140272704
- Publication date Sep 18, 2014
- Chun-Wei Chang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Lithography Process on High Topology Features
- Publication number 20140272715
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wei Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Test Structure Placement on a Semiconductor Wafer
- Publication number 20140151699
- Publication date Jun 5, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION
- Publication number 20140080067
- Publication date Mar 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Photoresist Layer
- Publication number 20140065843
- Publication date Mar 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to Form a CMOS Image Sensor
- Publication number 20140061738
- Publication date Mar 6, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung Chien Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REMOVING RESIDUE DURING SEMICONDUCTOR DEVICE FABRICATION
- Publication number 20130302985
- Publication date Nov 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd., ("TSMC")
- Chun-Chang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PORTION AT WAFER EDGE
- Publication number 20130273740
- Publication date Oct 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Grid in Backside Illumination Image Sensor Chips and Methods...
- Publication number 20130270667
- Publication date Oct 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Manufacturing Methods Thereof
- Publication number 20130207163
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing Techniques for Workpieces with Varying Topographies
- Publication number 20130181320
- Publication date Jul 18, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING TECHNIQUES TO LIMIT DAMAGE ON WORKPIECE WITH VARYING...
- Publication number 20130137266
- Publication date May 30, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS

Wang-Pen MO

Person

Patents Grantslast 30 patents

Method of forming a photoresist layer

Lithography process on high topology features

Film portion at wafer edge

Film portion at wafer edge

Thickening phase for spin coating process

Test structure placement on a semiconductor wafer

Lithography process on high topology features

Method of fabricating a metal grid for semiconductor device

Method of forming a photoresist layer

Metal grid in backside illumination image sensor chips and methods...

Method of semiconductor integrated circuit fabrication

Manufacturing techniques for workpieces with varying topographies

Method to form a CMOS image sensor

Semiconductor devices and manufacturing methods thereof

Manufacturing techniques to limit damage on workpiece with varying...

Patents Applicationslast 30 patents

Lithography Process on High Topology Features

METHOD OF FABRICATING A METAL GRID FOR SEMICONDUCTOR DEVICE

METHOD OF FORMING A PHOTORESIST LAYER

FILM PORTION AT WAFER EDGE

THICKENING PHASE FOR SPIN COATING PROCESS

Lithography Process on High Topology Features

Test Structure Placement on a Semiconductor Wafer

METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION

Method of Forming a Photoresist Layer

Method to Form a CMOS Image Sensor

METHOD OF REMOVING RESIDUE DURING SEMICONDUCTOR DEVICE FABRICATION

FILM PORTION AT WAFER EDGE

Metal Grid in Backside Illumination Image Sensor Chips and Methods...

Semiconductor Devices and Manufacturing Methods Thereof

Manufacturing Techniques for Workpieces with Varying Topographies

MANUFACTURING TECHNIQUES TO LIMIT DAMAGE ON WORKPIECE WITH VARYING...