Wataru Hidese

Person

Fukuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electric component mounting system and electric component mounting...
- Patent number 9,198,336
- Issue date Nov 24, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masahiro Kihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Screen printer
- Patent number 8,499,688
- Issue date Aug 6, 2013
- Panasonic Corporation
- Seiichi Miyahara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Screen printer
- Patent number 8,375,852
- Issue date Feb 19, 2013
- Panasonic Corporation
- Seiichi Miyahara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Screen printer
- Patent number 8,327,761
- Issue date Dec 11, 2012
- Panasonic Corporation
- Seiichi Miyahara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electronic component installation apparatus
- Patent number 8,196,287
- Issue date Jun 12, 2012
- Panasonic Corporation
- Yoshiaki Awata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method
- Patent number 7,243,420
- Issue date Jul 17, 2007
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting electronic parts onto a board
- Patent number 7,137,195
- Issue date Nov 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting an electronic part by solder position detection
- Patent number 7,059,043
- Issue date Jun 13, 2006
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting apparatus
- Patent number 6,874,225
- Issue date Apr 5, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting method
- Patent number 6,865,803
- Issue date Mar 15, 2005
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting electronic parts on a board
- Patent number 6,839,960
- Issue date Jan 11, 2005
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for mounting electronic parts
- Patent number 6,792,676
- Issue date Sep 21, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounter and mounting method
- Patent number 6,606,790
- Issue date Aug 19, 2003
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method employing X-Y tables for simultaneously mounting electronic...
- Patent number 6,588,096
- Issue date Jul 8, 2003
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic components mounting device and the mounting method
- Patent number 6,539,622
- Issue date Apr 1, 2003
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method
- Patent number 6,453,548
- Issue date Sep 24, 2002
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Outer lead bonding apparatus
- Patent number 5,342,460
- Issue date Aug 30, 1994
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for bonding outer leads
- Patent number 5,338,381
- Issue date Aug 16, 1994
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic components mounting apparatus
- Patent number 5,208,969
- Issue date May 11, 1993
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting electronic parts
- Patent number 5,208,975
- Issue date May 11, 1993
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical component placing apparatus
- Patent number 5,184,397
- Issue date Feb 9, 1993
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Outer lead bonding head and method of bonding outer lead
- Patent number 5,113,581
- Issue date May 19, 1992
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting apparatus
- Patent number 5,033,185
- Issue date Jul 23, 1991
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SCREEN PRINTER
- Publication number 20120090484
- Publication date Apr 19, 2012
- PANASONIC CORPORATION
- Seiichi Miyahara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SCREEN PRINTER
- Publication number 20120085252
- Publication date Apr 12, 2012
- PANASONIC CORPORATION
- Seiichi Miyahara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRONIC COMPONENT INSTALLATION APPARATUS
- Publication number 20110023294
- Publication date Feb 3, 2011
- PANASONIC CORPORATION
- Yoshiaki Awata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCREEN PRINTER
- Publication number 20110017080
- Publication date Jan 27, 2011
- PANASONIC CORPORATION
- Seiichi Miyahara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRIC COMPONENT MOUNTING SYSTEM AND ELECTRIC COMPONENT MOUNTING...
- Publication number 20100071195
- Publication date Mar 25, 2010
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Kihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for mounting electronic parts
- Publication number 20050108873
- Publication date May 26, 2005
- Matsushita Electric Industrial Co., Ltd.
- Wataru Hidese
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component mounting apparatus and electronic component mo...
- Publication number 20040205961
- Publication date Oct 21, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for mounting electronic parts
- Publication number 20040148769
- Publication date Aug 5, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component mounter and mounting method
- Publication number 20030192178
- Publication date Oct 16, 2003
- Wataru Hidese
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component mounting apparatus and electronic component mo...
- Publication number 20030110623
- Publication date Jun 19, 2003
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for mounting electronic parts
- Publication number 20030029033
- Publication date Feb 13, 2003
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Wataru Hidese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for mounting electronic parts
- Publication number 20030029032
- Publication date Feb 13, 2003
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENTS MOUNTING DEVICE AND THE MOUNTING METHOD
- Publication number 20020124397
- Publication date Sep 12, 2002
- WATARU HIDESE
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Component mounter and mounting method
- Publication number 20020053134
- Publication date May 9, 2002
- Wataru Hidese
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Wataru Hidese

Person

Patents Grantslast 30 patents

Electric component mounting system and electric component mounting...

Screen printer

Screen printer

Screen printer

Electronic component installation apparatus

Electronic component mounting method

Method for mounting electronic parts onto a board

Method for mounting an electronic part by solder position detection

Electronic component mounting apparatus

Component mounting method

Method for mounting electronic parts on a board

Apparatus and method for mounting electronic parts

Component mounter and mounting method

Method employing X-Y tables for simultaneously mounting electronic...

Electronic components mounting device and the mounting method

Electronic component mounting method

Outer lead bonding apparatus

Apparatus and method for bonding outer leads

Electronic components mounting apparatus

Method and apparatus for mounting electronic parts

Electrical component placing apparatus

Outer lead bonding head and method of bonding outer lead

Electronic component mounting apparatus

Patents Applicationslast 30 patents

SCREEN PRINTER

SCREEN PRINTER

ELECTRONIC COMPONENT INSTALLATION APPARATUS

SCREEN PRINTER

ELECTRIC COMPONENT MOUNTING SYSTEM AND ELECTRIC COMPONENT MOUNTING...

Apparatus and method for mounting electronic parts

Electronic component mounting apparatus and electronic component mo...

Apparatus and method for mounting electronic parts

Component mounter and mounting method

Electronic component mounting apparatus and electronic component mo...

Apparatus and method for mounting electronic parts

Apparatus and method for mounting electronic parts

ELECTRONIC COMPONENTS MOUNTING DEVICE AND THE MOUNTING METHOD

Component mounter and mounting method