WE-JEI KE

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XINFENG TOWNSHIP, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a polymer printed circuit board
- Patent number 11,102,891
- Issue date Aug 24, 2021
- BGT MATERIALS LIMITED
- Kuo-Hsin Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation coating layer and manufacturing method thereof
- Patent number 10,782,078
- Issue date Sep 22, 2020
- BGT MATERIALS LIMITED
- Chung-Ping Lai
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method of manufacturing polymer printed circuit board
- Patent number 10,561,025
- Issue date Feb 11, 2020
- BGT MATERIALS LIMITED
- Kuo-Hsin Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacturing a polymer printed circuit board
- Publication number 20190174637
- Publication date Jun 6, 2019
- BGT Materials Limited
- Kuo-Hsin CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION COATING LAYER AND MANUFACTURING METHOD THEREOF
- Publication number 20190154367
- Publication date May 23, 2019
- BGT Materials Limited
- Chung-Ping LAI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Electroless plating catalyst and method of forming copper metal lay...
- Publication number 20190069414
- Publication date Feb 28, 2019
- BGT Materials Limited
- Kuo-Hsin CHANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless plating catalyst and method of forming copper metal lay...
- Publication number 20190069415
- Publication date Feb 28, 2019
- BGT Materials Limited
- Kuo-Hsin CHANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing polymer printed circuit board
- Publication number 20180199441
- Publication date Jul 12, 2018
- BGT Materials Limited
- KUO-HSIN CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION COATING LAYER AND MANUFACTURING METHOD THEREOF
- Publication number 20180072933
- Publication date Mar 15, 2018
- BGT Materials Limited
- CHUNG-PING LAI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Person

Patents Grantslast 30 patents

Method of manufacturing a polymer printed circuit board

Heat dissipation coating layer and manufacturing method thereof

Method of manufacturing polymer printed circuit board

Patents Applicationslast 30 patents

Method of manufacturing a polymer printed circuit board

HEAT DISSIPATION COATING LAYER AND MANUFACTURING METHOD THEREOF

Electroless plating catalyst and method of forming copper metal lay...

Electroless plating catalyst and method of forming copper metal lay...

Method of manufacturing polymer printed circuit board

HEAT DISSIPATION COATING LAYER AND MANUFACTURING METHOD THEREOF