Wen Wei LUM

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Singapore, SG

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Patents Applicationslast 30 patents

Information Patent Application
MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVI...
- Publication number 20240260281
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Wen Wei LUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR HAVING ELECTRODES FORMED WITHIN A SUBSTRATE
- Publication number 20240021545
- Publication date Jan 18, 2024
- Micron Technology, Inc.
- Wen Wei LUM
- H01 - BASIC ELECTRIC ELEMENTS