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Ya Fang CHAN
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Kaohsiung, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device package with conductive pillars and reinforcin...
Patent number
12,272,687
Issue date
Apr 8, 2025
Advanced Semiconductor Engineering, Inc.
Ya Fang Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and the method of manufacturing the same
Patent number
12,107,056
Issue date
Oct 1, 2024
Advanced Semiconductor Engineering, Inc.
Ya Fang Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package
Patent number
11,791,227
Issue date
Oct 17, 2023
Advanced Semiconductor Engineering, Inc.
Kuoching Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package with conductive pillars and reinforcin...
Patent number
11,521,958
Issue date
Dec 6, 2022
Advanced Semiconductor Engineering, Inc.
Ya Fang Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with chamfered pads
Patent number
11,056,435
Issue date
Jul 6, 2021
Advanced Semiconductor Engineering, Inc.
Cheng-Lin Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method of manufacturing the same
Patent number
11,037,853
Issue date
Jun 15, 2021
Advanced Semiconductor Engineering, Inc.
Ya Fang Chan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME
Publication number
20250029940
Publication date
Jan 23, 2025
Advanced Semiconductor Engineering, Inc.
Ya Fang CHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR FL...
Publication number
20240249958
Publication date
Jul 25, 2024
Advanced Semiconductor Engineering, Inc.
Ya Fang CHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE PILLARS AND REINFORCIN...
Publication number
20230094668
Publication date
Mar 30, 2023
Advanced Semiconductor Engineering, Inc.
Ya Fang CHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20220367304
Publication date
Nov 17, 2022
Advanced Semiconductor Engineering, Inc.
Kuoching CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME
Publication number
20210225783
Publication date
Jul 22, 2021
Advanced Semiconductor Engineering, Inc.
Ya Fang CHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20210183723
Publication date
Jun 17, 2021
Advanced Semiconductor Engineering, Inc.
Ya Fang CHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE
Publication number
20210134781
Publication date
May 6, 2021
Advanced Semiconductor Engineering, Inc.
Ya Fang CHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20190148297
Publication date
May 16, 2019
Advanced Semiconductor Engineering, Inc.
Cheng-Lin HO
H01 - BASIC ELECTRIC ELEMENTS