Yasuhiro Kurokawa

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Mount for semiconductor device
- Patent number 6,137,170
- Issue date Oct 24, 2000
- NEC Corporation
- Masato Ujiie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for semiconductor elements having thermal dissipation means
- Patent number 5,455,457
- Issue date Oct 3, 1995
- NEC Corporation
- Yasuhiro Kurokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for semiconductor device having a flexible wiring...
- Patent number 5,291,064
- Issue date Mar 1, 1994
- NEC Corporation
- Yasuhiro Kurokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit board having a large heat dissipation
- Patent number 4,724,283
- Issue date Feb 9, 1988
- NEC Corporation
- Yuzo Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing aluminum nitride ceramics having superior ther...
- Patent number 4,650,777
- Issue date Mar 17, 1987
- NEC Corporation
- Yasuhiro Kurokawa
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES