Yasuyuki SEKIMOTO

Person

Ritto-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component and electronic component series including the...
- Patent number 10,522,289
- Issue date Dec 31, 2019
- MURATA & MANUFACTURING CO., LTD.
- Shinichiro Kuroiwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elastic conductor
- Patent number 10,111,325
- Issue date Oct 23, 2018
- Murata Manufacturing Co., Ltd.
- Yasuyuki Sekimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solder bump, and solder bump
- Patent number 10,090,268
- Issue date Oct 2, 2018
- MURATA MANUFACTURING CO., LTD.
- Yasuyuki Sekimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing substrate
- Patent number 8,794,499
- Issue date Aug 5, 2014
- Murata Manufacturing Co., Ltd.
- Yasuyuki Sekimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming hole for interlayer connection conductor, method...
- Patent number 8,570,763
- Issue date Oct 29, 2013
- Murata Manufacturing Co., Ltd.
- Yasuyuki Sekimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer wiring substrate
- Patent number 8,419,884
- Issue date Apr 16, 2013
- Murata Manufacturing Co., Ltd.
- Yasuyuki Sekimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELASTIC CONDUCTOR
- Publication number 20180168028
- Publication date Jun 14, 2018
- Murata Manufacturing Co., Ltd.
- Yasuyuki SEKIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT SERIES INCLUDING THE...
- Publication number 20160276106
- Publication date Sep 22, 2016
- Murata Manufacturing Co., Ltd.
- Shinichiro KUROIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Solder Bump, and Solder Bump
- Publication number 20150333027
- Publication date Nov 19, 2015
- Murata Manufacturing Co., Ltd.
- Yasuyuki Sekimoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD OF FORMING HOLE FOR INTERLAYER CONNECTION CONDUCTOR, METHOD...
- Publication number 20120321814
- Publication date Dec 20, 2012
- Murata Manufacturing Co., Ltd.
- Yasuyuki SEKIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE
- Publication number 20120298728
- Publication date Nov 29, 2012
- Murata Manufacturing Co., Ltd.
- Yasuyuki SEKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE
- Publication number 20100236698
- Publication date Sep 23, 2010
- Murata Manufacturing Co., Ltd.
- Yasuyuki SEKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING HOLE FOR INTERLAYER CONNECTION CONDUCTOR, METHOD...
- Publication number 20100101836
- Publication date Apr 29, 2010
- Murata Manufacturing Co., Ltd.
- Yasuyuki SEKIMOTO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Yasuyuki SEKIMOTO

Person

Patents Grantslast 30 patents

Electronic component and electronic component series including the...

Elastic conductor

Method of forming solder bump, and solder bump

Method for manufacturing substrate

Method of forming hole for interlayer connection conductor, method...

Method for manufacturing multilayer wiring substrate

Patents Applicationslast 30 patents

ELASTIC CONDUCTOR

ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT SERIES INCLUDING THE...

Method of Forming Solder Bump, and Solder Bump

METHOD OF FORMING HOLE FOR INTERLAYER CONNECTION CONDUCTOR, METHOD...

METHOD FOR MANUFACTURING SUBSTRATE

METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE

METHOD OF FORMING HOLE FOR INTERLAYER CONNECTION CONDUCTOR, METHOD...