Yi-Lei Chow

Follow

Person

Los Altos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate cleaving under controlled stress conditions
- Patent number 9,640,711
- Issue date May 2, 2017
- SILICON GENESIS CORPORATION
- Francois Henley
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Substrate cleaving under controlled stress conditions
- Patent number 9,356,181
- Issue date May 31, 2016
- SILICON GENESIS CORPORATION
- Francois Henley
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Substrate cleaving under controlled stress conditions
- Patent number 8,993,410
- Issue date Mar 31, 2015
- Silicon Genesis Corporation
- Francois Henley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE CLEAVING UNDER CONTROLLED STRESS CONDITIONS
- Publication number 20160276522
- Publication date Sep 22, 2016
- Silicon Genesis Corporation
- Francois HENLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CLEAVING UNDER CONTROLLED STRESS CONDITIONS
- Publication number 20150155422
- Publication date Jun 4, 2015
- Silicon Genesis Corporation
- Francois HENLEY
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
SUBSTRATE CLEAVING UNDER CONTROLLED STRESS CONDITIONS
- Publication number 20120234887
- Publication date Sep 20, 2012
- Silicon Genesis Corporation
- Francois Henley
- B26 - HAND CUTTING TOOLS CUTTING SEVERING