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Yinglong LI
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San Jose, CA, US
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last 30 patents
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Patent Grant
Method, apparatus, and system for wafer grounding
Patent number
12,051,562
Issue date
Jul 30, 2024
ASML Netherlands B.V.
Yixiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHOD OF WAFER GROUNDING UTILIZING WAFER EDGE BACKSIDE COATING EXC...
Publication number
20250218720
Publication date
Jul 3, 2025
ASML NETHERLANDS B.V.
Yinglong LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD, APPARATUS, AND SYSTEM FOR WAFER GROUNDING
Publication number
20240371599
Publication date
Nov 7, 2024
ASML Netheriands B. V.
Yixiang WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHARGED PARTICLE ASSESSMENT SYSTEM AND METHOD
Publication number
20240331971
Publication date
Oct 3, 2024
ASML NETHERLANDS B.V.
Jurgen VAN SOEST
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD, APPARATUS, AND SYSTEM FOR WAFER GROUNDING
Publication number
20220277926
Publication date
Sep 1, 2022
ASML NETHERLANDS B.V.
Yixiang WANG
H01 - BASIC ELECTRIC ELEMENTS