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Yohei Yamashita

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20180130709
    • Publication date May 10, 2018
    • Disco Corporation
    • Yohei Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20180122700
    • Publication date May 3, 2018
    • Disco Corporation
    • Yohei Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20170133269
    • Publication date May 11, 2017
    • Disco Corporation
    • Tsubasa Obata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20170117434
    • Publication date Apr 27, 2017
    • Disco Corporation
    • Yuki Ogawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF DIVIDING WAFER
    • Publication number 20160307851
    • Publication date Oct 20, 2016
    • Disco Corporation
    • Yukinobu Ohura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160163597
    • Publication date Jun 9, 2016
    • Disco Corporation
    • Yohei Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160104643
    • Publication date Apr 14, 2016
    • Disco Corporation
    • Yohei Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20150099346
    • Publication date Apr 9, 2015
    • Disco Corporation
    • Yohei Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Laser processing method for wafer
    • Publication number 20080076233
    • Publication date Mar 27, 2008
    • Disco Corporation
    • Yukio Morishige
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer dividing method
    • Publication number 20080047408
    • Publication date Feb 28, 2008
    • DISCO CORPORATION
    • Ryugo Oba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method for applying resin film to face of semiconductor wafer
    • Publication number 20070054498
    • Publication date Mar 8, 2007
    • DISCO CORPORATION
    • Kentaro Iizuka
    • H01 - BASIC ELECTRIC ELEMENTS