Yongbo Liao

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Chengdu, CN

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Patents Grantslast 30 patents

Information Patent Grant
Nano-wall integrated circuit structure with high integrated density
- Patent number 11,621,349
- Issue date Apr 4, 2023
- University of Electronic Science and Technology of China
- Ping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide semiconductor integrated circuit basic unit
- Patent number 11,335,785
- Issue date May 17, 2022
- University of Electronic Science and Technology of China
- Ping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate extraction and injection field effect transistors and method f...
- Patent number 11,145,754
- Issue date Oct 12, 2021
- University of Electronic Science and Technology of China
- Yongbo Liao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Nano-wall Integrated Circuit Structure with High Integrated Density
- Publication number 20220149198
- Publication date May 12, 2022
- University of Electronic Science and Technology of China
- Ping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE SEMICONDUCTOR INTEGRATED CIRCUIT BASIC UNIT
- Publication number 20210226022
- Publication date Jul 22, 2021
- University of Electronic Science and Technology of China
- Ping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Extraction and Injection Field Effect Transistors and Method f...
- Publication number 20200105913
- Publication date Apr 2, 2020
- University of Electronic Science and Technology of China
- Yongbo LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hardware and Software Co-test Method for FPGA
- Publication number 20090100304
- Publication date Apr 16, 2009
- Ping Li
- G01 - MEASURING TESTING