Yongsuk Kwon

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Suzhou, CN

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Patents Grantslast 30 patents

Information Patent Grant
Aluminum bump bonding for fine aluminum wire
- Patent number 8,138,081
- Issue date Mar 20, 2012
- Fairchild Semiconductor Corporation
- Adams Zhu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ALUMINUM BUMP BONDING FOR FINE ALUMINUM WIRE
- Publication number 20100035385
- Publication date Feb 11, 2010
- Adams Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum bump bonding for fine aluminum wire
- Publication number 20070216026
- Publication date Sep 20, 2007
- Adams Zhu
- H01 - BASIC ELECTRIC ELEMENTS