YoRim Lee

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Koyang-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Package stacking system with mold contamination prevention and meth...
- Patent number 8,143,103
- Issue date Mar 27, 2012
- Stats Chippac Ltd.
- Young-Joon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stacking system with mold contamination prevention
- Patent number 7,898,072
- Issue date Mar 1, 2011
- Stats Chippac Ltd.
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoff height improvement for bumping technology using solder resist
- Patent number 7,875,495
- Issue date Jan 25, 2011
- STATS ChipPAC, Ltd.
- TaeWoo Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package system with underfill
- Patent number 7,682,872
- Issue date Mar 23, 2010
- Stats Chippac Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoff height improvement for bumping technology using solder resist
- Patent number 7,615,865
- Issue date Nov 10, 2009
- STATS ChipPAC, Ltd.
- TaeWoo Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STACKING SYSTEM WITH MOLD CONTAMINATION PREVENTION AND METH...
- Publication number 20110121465
- Publication date May 26, 2011
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Standoff Height Improvement for Bumping Technology Using Solder Resist
- Publication number 20100022050
- Publication date Jan 28, 2010
- STATS ChipPAC, Ltd.
- TaeWoo KANG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PACKAGE STACKING SYSTEM WITH MOLD CONTAMINATION PREVENTION
- Publication number 20100007000
- Publication date Jan 14, 2010
- YoungJoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Standoff Height Improvement for Bumping Technology Using Solder Resist
- Publication number 20080293232
- Publication date Nov 27, 2008
- STATS ChipPAC, Ltd.
- TaeWoo KANG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH UNDERFILL
- Publication number 20080211111
- Publication date Sep 4, 2008
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS