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Yuji MORINAGA

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Patents Grantslast 30 patents

  • Information Patent Grant

    Electronic device, connection body, and manufacturing method for el...
    • Patent number 11,404,353
    • Issue date Aug 2, 2022
    • Shindengen Electric Manufacturing Co., Ltd.
    • Soichiro Umeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device and connection body
    • Patent number 11,211,311
    • Issue date Dec 28, 2021
    • Shindengen Electric Manufacturing Co., Ltd.
    • Soichiro Umeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device and connection body
    • Patent number 10,910,292
    • Issue date Feb 2, 2021
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    • Soichiro Umeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device and connector
    • Patent number 10,896,868
    • Issue date Jan 19, 2021
    • Shindengen Electric Manufacturing Co., Ltd.
    • Soichiro Umeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device
    • Patent number 10,615,092
    • Issue date Apr 7, 2020
    • Shindengen Electric Manufacturing Co., Ltd.
    • Soichiro Umeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device
    • Patent number 10,600,712
    • Issue date Mar 24, 2020
    • Shindengen Electric Manufacturing Co., Ltd.
    • Yuji Morinaga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor module
    • Patent number 10,461,042
    • Issue date Oct 29, 2019
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor module
    • Patent number 10,319,704
    • Issue date Jun 11, 2019
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Heat dissipating structure
    • Patent number 10,251,256
    • Issue date Apr 2, 2019
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device having a bypass capacitor
    • Patent number 10,243,477
    • Issue date Mar 26, 2019
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    • Yuji Morinaga
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Semiconductor device
    • Patent number 10,199,486
    • Issue date Feb 5, 2019
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    • Yuji Morinaga
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Heat dissipating structure
    • Patent number 10,159,166
    • Issue date Dec 18, 2018
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Method of manufacturing bonded body
    • Patent number 10,083,844
    • Issue date Sep 25, 2018
    • Shindengen Electric Manufacturing Co., Ltd.
    • Ryo Matsubayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor module
    • Patent number 9,704,828
    • Issue date Jul 11, 2017
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke Ikeda
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRONIC MODULE
    • Publication number 20250239532
    • Publication date Jul 24, 2025
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Yuji MORINAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRICAL CONNECTING MEMBER AND SEMICONDUCTOR DEVICE
    • Publication number 20250183218
    • Publication date Jun 5, 2025
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Yuji MORINAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20250140656
    • Publication date May 1, 2025
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Yuji MORINAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20250140652
    • Publication date May 1, 2025
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Yuji MORINAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20240379572
    • Publication date Nov 14, 2024
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Yuji MORINAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20240347466
    • Publication date Oct 17, 2024
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Yuji MORINAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20240312921
    • Publication date Sep 19, 2024
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Yuji MORINAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20240312922
    • Publication date Sep 19, 2024
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Yuji MORINAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE, CONNECTION BODY, AND MANUFACTURING METHOD FOR EL...
    • Publication number 20200219797
    • Publication date Jul 9, 2020
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Soichiro UMEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE AND CONNECTION BODY
    • Publication number 20200011904
    • Publication date Jan 9, 2020
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Soichiro UMEDA
    • G01 - MEASURING TESTING
  • Information Patent Application

    ELECTRONIC DEVICE AND CONNECTION BODY
    • Publication number 20190378782
    • Publication date Dec 12, 2019
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Soichiro UMEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE AND CONNECTOR
    • Publication number 20190318982
    • Publication date Oct 17, 2019
    • SHIDENGEN ELECTRIC MANUFACTURING CO., LTD.
    • Soichiro UMEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20190237377
    • Publication date Aug 1, 2019
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Soichiro UMEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20190051577
    • Publication date Feb 14, 2019
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Yuji MORINAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20180367054
    • Publication date Dec 20, 2018
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    • Yuji MORINAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20180366567
    • Publication date Dec 20, 2018
    • Yuji MORINAGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20180226356
    • Publication date Aug 9, 2018
    • Shindengen Electric Manufacturing Co., Ltd.
    • Kosuke IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20180182745
    • Publication date Jun 28, 2018
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    • Kosuke IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HEAT DISSIPATING STRUCTURE
    • Publication number 20170311482
    • Publication date Oct 26, 2017
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Kosuke IKEDA
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    HEAT DISSIPATING STRUCTURE
    • Publication number 20170303385
    • Publication date Oct 19, 2017
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Kosuke Ikeda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING BONDED BODY
    • Publication number 20170103903
    • Publication date Apr 13, 2017
    • Shindengen Electric Manufacturing Co., Ltd.
    • Ryo MATSUBAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20160254250
    • Publication date Sep 1, 2016
    • SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
    • Kosuke IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS