Yuxin Fang

Person

Chandler, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...
- Publication number 20250218924
- Publication date Jul 3, 2025
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC INDIUM-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED...
- Publication number 20250219002
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION GOLD-ELECTROLESS PALLADIUM-IMMERSION GOLD (IGEPIG) AS A S...
- Publication number 20250218910
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC COBALT-IRON-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMB...
- Publication number 20250218911
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technologies for Components Embedded in a Substrate Core
- Publication number 20250219040
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) WI...
- Publication number 20250218925
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES INCLUDING MICRO-STRUCTURED THIN FILM CAPACITORS
- Publication number 20240421144
- Publication date Dec 19, 2024
- Intel Corporation
- Chun-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Applicationslast 30 patents

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...

ELECTROLYTIC INDIUM-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED...

IMMERSION GOLD-ELECTROLESS PALLADIUM-IMMERSION GOLD (IGEPIG) AS A S...

ELECTROLYTIC COBALT-IRON-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMB...

Technologies for Components Embedded in a Substrate Core

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) WI...

SUBSTRATES INCLUDING MICRO-STRUCTURED THIN FILM CAPACITORS