Accessory, coolant

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CPC
G05B2219/49052

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GPHYSICS G05Controlling systems G05BCONTROL OR REGULATING SYSTEMS IN GENERAL FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS G05B2219/00Program-control systems

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G05B2219/49052Accessory, coolant

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Patents Grantslast 30 patents

Information Patent Grant
Machine tool and system
- Patent number 12,030,145
- Issue date Jul 9, 2024
- FANUC CORPORATION
- Yuu Akutsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Numerical control device provided with heat radiation characteristi...
- Patent number 10,042,346
- Issue date Aug 7, 2018
- FANUC CORPORATION
- Junichi Tezuka
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method and apparatus for delivery of minimum quantity lubrication
- Patent number 8,934,998
- Issue date Jan 13, 2015
- Unist, Inc.
- Charles W. Boelkins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Programmable coolant nozzle system
- Patent number 6,772,042
- Issue date Aug 3, 2004
- Dimensional Control, Inc.
- Marc R. Warren
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,739,944
- Issue date May 25, 2004
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,488,566
- Issue date Dec 3, 2002
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,464,560
- Issue date Oct 15, 2002
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,464,561
- Issue date Oct 15, 2002
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,464,564
- Issue date Oct 15, 2002
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,338,667
- Issue date Jan 15, 2002
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,306,009
- Issue date Oct 23, 2001
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,261,151
- Issue date Jul 17, 2001
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 6,120,347
- Issue date Sep 19, 2000
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 5,851,135
- Issue date Dec 22, 1998
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing inclu...
- Patent number 5,842,909
- Issue date Dec 1, 1998
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing inclu...
- Patent number 5,762,537
- Issue date Jun 9, 1998
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing inclu...
- Patent number 5,730,642
- Issue date Mar 24, 1998
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing
- Patent number 5,700,180
- Issue date Dec 23, 1997
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing inclu...
- Patent number 5,658,183
- Issue date Aug 19, 1997
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for real-time control of semiconductor wafer polishing inclu...
- Patent number 5,643,060
- Issue date Jul 1, 1997
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
NC device controlling machining processes with pre- and post-execut...
- Patent number 5,578,913
- Issue date Nov 26, 1996
- Brother Kogyo Kabushiki Kaisha
- Shouki Yasuda
- G05 - CONTROLLING REGULATING
Information Patent Grant
Chip buildup detection and control method and apparatus
- Patent number 5,559,713
- Issue date Sep 24, 1996
- Western Atlas, Inc.
- Jeffrey Brown
- G05 - CONTROLLING REGULATING
Information Patent Grant
System and method for real-time control of semiconductor a wafer po...
- Patent number 5,486,129
- Issue date Jan 23, 1996
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for forming a workpiece surface into a non-rot...
- Patent number 5,467,675
- Issue date Nov 21, 1995
- North Carolina State University
- Thomas A. Dow
- G05 - CONTROLLING REGULATING
Information Patent Grant
Machine tool with temperature compensation
- Patent number 5,421,683
- Issue date Jun 6, 1995
- National Broach & Machine Company
- Richard G. Keehn
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method and apparatus for automatic vapor cooling when shape melting...
- Patent number 4,857,694
- Issue date Aug 15, 1989
- The Babcock & Wilcox Company
- Thomas E. Doyle
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Tool condition sensing by measuring heat generation rate at the cut...
- Patent number 4,757,307
- Issue date Jul 12, 1988
- General Electric Company
- Bahram Keramati
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dressing-grinding process and electronically controlled grinding ma...
- Patent number 4,640,057
- Issue date Feb 3, 1987
- Ernst Salje
- G05 - CONTROLLING REGULATING
Information Patent Grant
Nozzle device for cutting fluid for machine tools
- Patent number 4,573,833
- Issue date Mar 4, 1986
- Kabushiki Kaisha Matsuura Kikai Seisakusho
- Koji Kondo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Programmably controlled method for grinding end cutting tools and t...
- Patent number 4,186,529
- Issue date Feb 5, 1980
- S. E. Huffman Corporation
- Stanley E. Huffman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
System for real-time control of semiconductor wafer polishing
- Publication number 20030073384
- Publication date Apr 17, 2003
- Gurtej S. Sandhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System for real-time control of semiconductor wafer polishing
- Publication number 20020034922
- Publication date Mar 21, 2002
- Gurtej S. Sandhu
- B24 - GRINDING POLISHING
Information Patent Application
System for real-time control of semiconductor wafer polishing
- Publication number 20020016131
- Publication date Feb 7, 2002
- Gurtej S. Sandhu
- B24 - GRINDING POLISHING
Information Patent Application
System for real-time control of semiconductor wafer polishing
- Publication number 20010041501
- Publication date Nov 15, 2001
- Gurtej S. Sandhu
- B24 - GRINDING POLISHING
Information Patent Application
System for real-time control of semiconductor wafer polishing
- Publication number 20010016466
- Publication date Aug 23, 2001
- Gurtej S. Sandhu
- B24 - GRINDING POLISHING
Information Patent Application
System for real-time control of semiconductor wafer polishing
- Publication number 20010001755
- Publication date May 24, 2001
- Gurtej S. Sandhu
- B24 - GRINDING POLISHING

Accessory, coolant

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Machine tool and system

Numerical control device provided with heat radiation characteristi...

Method and apparatus for delivery of minimum quantity lubrication

Programmable coolant nozzle system

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing inclu...

System for real-time control of semiconductor wafer polishing inclu...

System for real-time control of semiconductor wafer polishing inclu...

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing inclu...

System for real-time control of semiconductor wafer polishing inclu...

NC device controlling machining processes with pre- and post-execut...

Chip buildup detection and control method and apparatus

System and method for real-time control of semiconductor a wafer po...

Apparatus and method for forming a workpiece surface into a non-rot...

Machine tool with temperature compensation

Method and apparatus for automatic vapor cooling when shape melting...

Tool condition sensing by measuring heat generation rate at the cut...

Dressing-grinding process and electronically controlled grinding ma...

Nozzle device for cutting fluid for machine tools

Programmably controlled method for grinding end cutting tools and t...

Patents Applicationslast 30 patents

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing

System for real-time control of semiconductor wafer polishing