Binary compounds of nitrogen with aluminium

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CPC
C08K2003/282

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CCHEMISTRY METALLURGY C08Organic compounds C08KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS

Current Industry

C08K2003/282Binary compounds of nitrogen with aluminium

Industries

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Patents Grantslast 30 patents

Information Patent Grant
SiC-filled polymers with high electrical resistivity and high therm...
- Patent number 12,187,954
- Issue date Jan 7, 2025
- WASHINGTON MILLS MANAGEMENT, INC.
- Raymond Ashton Cutler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal-conductive silicone composition, production method therefor...
- Patent number 12,180,368
- Issue date Dec 31, 2024
- Shin-Etsu Chemical Co., Ltd.
- Wataru Toya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filler-loaded high thermal conductive dispersion liquid composition...
- Patent number 12,152,113
- Issue date Nov 26, 2024
- TAKAGI CHEMICALS, INC.
- Noriaki Takagi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermally conductive silicone gel composition
- Patent number 12,152,147
- Issue date Nov 26, 2024
- Fuji Polymer Industries Co., Ltd.
- Takumi Kataishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer film and laminate
- Patent number 12,152,116
- Issue date Nov 26, 2024
- FUJIFILM Corporation
- Yasuyuki Sasada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Non-curable thermal-conductive silicone composition
- Patent number 11,912,869
- Issue date Feb 27, 2024
- Shin-Etsu Chemical Co., Ltd.
- Keita Kitazawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermally conductive composition and methods and devices in which s...
- Patent number 11,851,603
- Issue date Dec 26, 2023
- Dow Silicones Corporation
- Xiaolian Hu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermally conductive polyorganosiloxane composition
- Patent number 11,814,521
- Issue date Nov 14, 2023
- Momentive Performance Materials Japan LLC
- Atsushi Sakamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wear resistant coating, method of manufacture thereof and articles...
- Patent number 11,795,295
- Issue date Oct 24, 2023
- RTX Corporation
- Agnieszka M. Wusatowska-Sarnek
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermally conductive composition and thermally conductive sheet usi...
- Patent number 11,781,053
- Issue date Oct 10, 2023
- Fuji Polymer Industries Co., Ltd.
- Katsuyuki Suzumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluorine-containing elastomer composition for heat dissipation mate...
- Patent number 11,781,002
- Issue date Oct 10, 2023
- Daikin Industries, Ltd.
- Hiroyuki Sagami
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermally conductive composition and thermally conductive molded body
- Patent number 11,781,052
- Issue date Oct 10, 2023
- SEKISUI POLYMATECH CO., LTD.
- Hiroshi Umetani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive sheet and method for manufacturing thermally c...
- Patent number 11,742,258
- Issue date Aug 29, 2023
- Dexerials Corporation
- Yuma Sato
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermally conductive polyorganosiloxane composition
- Patent number 11,739,245
- Issue date Aug 29, 2023
- Momentive Performance Materials Japan LLC
- Masanori Takanashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Insulating filler and production method therefor, insulating materi...
- Patent number 11,718,729
- Issue date Aug 8, 2023
- Nippon Aerosil Co., Ltd.
- Masao Aoki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermal conductive layer, photosensitive layer, photosensitive comp...
- Patent number 11,697,754
- Issue date Jul 11, 2023
- FUJIFILM Corporation
- Kosuke Yamashita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermally conductive resin composition and thermally conductive she...
- Patent number 11,692,118
- Issue date Jul 4, 2023
- Dexerials Corporation
- Masayuki Matsushima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Aluminum nitride particles
- Patent number 11,661,494
- Issue date May 30, 2023
- Tokuyama Corporation
- Akimasa Kuramoto
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Composite resin granules and method for producing the same, and the...
- Patent number 11,643,554
- Issue date May 9, 2023
- National Institute of Advanced Industrial Science and Technology
- Yuichi Tominaga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition
- Patent number 11,634,533
- Issue date Apr 25, 2023
- LG Chem, Ltd.
- Yoon Gyung Cho
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Thermally conductive resin composition and thermally conductive she...
- Patent number 11,634,581
- Issue date Apr 25, 2023
- Dexerials Corporation
- Masayuki Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition
- Patent number 11,603,451
- Issue date Mar 14, 2023
- LG Chem, Ltd.
- Yoon Gyung Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition
- Patent number 11,603,427
- Issue date Mar 14, 2023
- LG Chem, Ltd.
- Yoon Gyung Cho
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Modified aluminum nitride particles and methods of making the same
- Patent number 11,492,495
- Issue date Nov 8, 2022
- 3M Innovative Properties Company
- Nathan E. Schultz
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermally conductive member, thermally conductive composition, and...
- Patent number 11,434,403
- Issue date Sep 6, 2022
- SEKISUI POLYMATECH CO., LTD.
- Hiroya Endo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Hexagonal boron nitride powder and production process therefor
- Patent number 11,407,638
- Issue date Aug 9, 2022
- Tokuyama Corporation
- Shota Daiki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Aluminum nitride particle
- Patent number 11,325,830
- Issue date May 10, 2022
- Tokuyama Corporation
- Akimasa Kuramoto
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Thermal conducting sheet, method for manufacturing thermal conducti...
- Patent number 11,296,007
- Issue date Apr 5, 2022
- Dexerials Corporation
- Hiroki Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically insulating, thermally conductive coatings for electric...
- Patent number 11,289,967
- Issue date Mar 29, 2022
- General Electric Company
- Weijun Yin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
High temperature electrostatic chuck bonding adhesive
- Patent number 11,264,261
- Issue date Mar 1, 2022
- Applied Materials, Inc.
- Jennifer Y. Sun
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY CONDUCTIVE COMPOSITION, THERMALLY CONDUCTIVE SHEET OBTAIN...
- Publication number 20240409799
- Publication date Dec 12, 2024
- FUJI POLYMER INDUSTRIES CO., LTD.
- Yuki KAMIYA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT DISSIPATION MATERIAL AND ELECTRONIC DEVICE
- Publication number 20240400789
- Publication date Dec 5, 2024
- Hitachi Astemo, Ltd.
- Yasuhiro TSUYUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EPOXY RESIN COMPOSITION, LIQUID COMPRESSION MOLD MATERIAL, GLOB-TOP...
- Publication number 20240368374
- Publication date Nov 7, 2024
- Namics Corporation
- Makoto SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRAVIOLET-CURABLE HEAT-DISSIPATING RESIN COMPOSITION, HEAT-DISSIP...
- Publication number 20240368328
- Publication date Nov 7, 2024
- Sekisui Chemical Co., Ltd
- Chiharu OKUHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT DISSIPATION MOLDING AGENT AND HEAT DISSIPATION FILM OF MANUFAC...
- Publication number 20240360350
- Publication date Oct 31, 2024
- L2Y CO.,LTD.
- Hak Gue YEO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMALLY CONDUCTIVE SILICONE COMPOSITION
- Publication number 20240279525
- Publication date Aug 22, 2024
- Dow Silicones Corporation
- Yan Zheng
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMALLY CONDUCTIVE SILICONE COMPOSITION
- Publication number 20240218150
- Publication date Jul 4, 2024
- Shin-Etsu Chemical Co., Ltd.
- Takanori Ito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20240199791
- Publication date Jun 20, 2024
- Elite Material Co., Ltd.
- Chun-Hung CHEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ULTRAVIOLET REFLECTIVE MATERIAL, METHOD FOR PRODUCING SAME, AND RAW...
- Publication number 20240199842
- Publication date Jun 20, 2024
- Asahi Rubber Inc.
- Naoto IGARASHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
INK COMPOSITION, LAYER USING SAME, AND ELECTROPHORESIS DEVICE AND D...
- Publication number 20240182728
- Publication date Jun 6, 2024
- SAMSUNG SDI CO., LTD.
- Kyuyoung KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT CONDUCTING COMPOSITION AND CURED PRODUCT THEREOF
- Publication number 20240101885
- Publication date Mar 28, 2024
- Resonac Corporation
- Hikaru SATOH
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, ADHESIVE SHEET, PREPREG, AND LAMINATE
- Publication number 20240093020
- Publication date Mar 21, 2024
- Risho Kogyo Co., Ltd.
- Norihito Kuboyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ALUMINUM NITRIDE GRANULAR POWDER AND RESIN COMPOSITION
- Publication number 20240026119
- Publication date Jan 25, 2024
- Tokuyama Corporation
- Akimasa KURAMOTO
- C01 - INORGANIC CHEMISTRY
Information Patent Application
XRF-IDENTIFIABLE BLACK POLYMERS
- Publication number 20240002630
- Publication date Jan 4, 2024
- Security Matters Ltd.
- Haggai ALON
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Application
THERMALLY CONDUCTIVE COMPOSITION
- Publication number 20230399512
- Publication date Dec 14, 2023
- Resonac Corporation
- Hajime FUNAHASHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
GREASE COMPOSITION AND ELECTRONIC COMPONENT USING SAME
- Publication number 20230392008
- Publication date Dec 7, 2023
- KYOCERA CORPORATION
- Takuma GOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY CONDUCTIVE RESIN COMPOSITION AND ELECTRONIC DEVICE
- Publication number 20230374363
- Publication date Nov 23, 2023
- Denka Company Limited
- Kazuyuki IGARASHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SPHERICAL ALN PARTICLES AND METHOD OF PRODUCTION OF SAME, AND COMPO...
- Publication number 20230312343
- Publication date Oct 5, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Kazuhiko KUSUNOKI
- C01 - INORGANIC CHEMISTRY
Information Patent Application
THERMALLY CONDUCTIVE COMPOSITION, CURED PRODUCT AND ELECTRONIC COMP...
- Publication number 20230287213
- Publication date Sep 14, 2023
- Resonac Corporation
- Hajime FUNAHASHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin Composition
- Publication number 20230242736
- Publication date Aug 3, 2023
- Tokuyama Corporation
- Saiko Fujii
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SILICONE COMPOSITION AND A THERMALLY CONDUCTIVE SILICONE CURED PROD...
- Publication number 20230227708
- Publication date Jul 20, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yuya Hironaka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMALLY CONDUCTIVE COMPOSITION AND CURED PRODUCT THEREOF
- Publication number 20230227707
- Publication date Jul 20, 2023
- SHOWA DENKO K.K.
- Hajime YUKUTAKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMAL CONDUCTIVE SILICONE COMPOSITION
- Publication number 20230183540
- Publication date Jun 15, 2023
- Shin-Etsu Chemical Co., Ltd.
- Kunihiro YAMADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMAL CONDUCTIVE SILICONE COMPOSITION
- Publication number 20230167347
- Publication date Jun 1, 2023
- Shin-Etsu Chemical Co., Ltd.
- Wataru TOYA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
INSULATING FILLER AND PRODUCTION METHOD THEREFOR, INSULATING MATERI...
- Publication number 20230118996
- Publication date Apr 20, 2023
- NIPPON AEROSIL CO., LTD.
- Masao AOKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION AND HEAT DISSIPATION CIRCUIT BOARD USING SAME
- Publication number 20220325033
- Publication date Oct 13, 2022
- MEGNATECH CO., LTD.
- Soo-hyun Sung
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HIGHLY THERMALLY CONDUCTIVE FLOWABLE SILICONE COMPOSITION
- Publication number 20220289936
- Publication date Sep 15, 2022
- Dow Silicones Corporation
- Yan Zheng
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMALLY CONDUCTIVE POLYSILOXANE COMPOSITIONS
- Publication number 20220267533
- Publication date Aug 25, 2022
- MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
- Atsushi SAKAMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMALLY CONDUCTIVE RESIN COMPOSITION AND THERMALLY CONDUCTIVE SHE...
- Publication number 20220254701
- Publication date Aug 11, 2022
- DEXERIALS CORPORATION
- Masayuki MATSUSHIMA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURED MATERIAL OF THERMAL CONDUCTIVE SILICONE COMPOSITION
- Publication number 20220220354
- Publication date Jul 14, 2022
- Shin-Etsu Chemical Co., Ltd.
- Yasuhisa ISHIHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Binary compounds of nitrogen with aluminium

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

SiC-filled polymers with high electrical resistivity and high therm...

Thermal-conductive silicone composition, production method therefor...

Filler-loaded high thermal conductive dispersion liquid composition...

Thermally conductive silicone gel composition

Polymer film and laminate

Non-curable thermal-conductive silicone composition

Thermally conductive composition and methods and devices in which s...

Thermally conductive polyorganosiloxane composition

Wear resistant coating, method of manufacture thereof and articles...

Thermally conductive composition and thermally conductive sheet usi...

Fluorine-containing elastomer composition for heat dissipation mate...

Thermally conductive composition and thermally conductive molded body

Thermally conductive sheet and method for manufacturing thermally c...

Thermally conductive polyorganosiloxane composition

Insulating filler and production method therefor, insulating materi...

Thermal conductive layer, photosensitive layer, photosensitive comp...

Thermally conductive resin composition and thermally conductive she...

Aluminum nitride particles

Composite resin granules and method for producing the same, and the...

Resin composition

Thermally conductive resin composition and thermally conductive she...

Resin composition

Resin composition

Modified aluminum nitride particles and methods of making the same

Thermally conductive member, thermally conductive composition, and...

Hexagonal boron nitride powder and production process therefor

Aluminum nitride particle

Thermal conducting sheet, method for manufacturing thermal conducti...

Electrically insulating, thermally conductive coatings for electric...

High temperature electrostatic chuck bonding adhesive

Patents Applicationslast 30 patents

THERMALLY CONDUCTIVE COMPOSITION, THERMALLY CONDUCTIVE SHEET OBTAIN...

HEAT DISSIPATION MATERIAL AND ELECTRONIC DEVICE

EPOXY RESIN COMPOSITION, LIQUID COMPRESSION MOLD MATERIAL, GLOB-TOP...

ULTRAVIOLET-CURABLE HEAT-DISSIPATING RESIN COMPOSITION, HEAT-DISSIP...

HEAT DISSIPATION MOLDING AGENT AND HEAT DISSIPATION FILM OF MANUFAC...

THERMALLY CONDUCTIVE SILICONE COMPOSITION

THERMALLY CONDUCTIVE SILICONE COMPOSITION

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

ULTRAVIOLET REFLECTIVE MATERIAL, METHOD FOR PRODUCING SAME, AND RAW...

INK COMPOSITION, LAYER USING SAME, AND ELECTROPHORESIS DEVICE AND D...

HEAT CONDUCTING COMPOSITION AND CURED PRODUCT THEREOF

RESIN COMPOSITION, ADHESIVE SHEET, PREPREG, AND LAMINATE

ALUMINUM NITRIDE GRANULAR POWDER AND RESIN COMPOSITION

XRF-IDENTIFIABLE BLACK POLYMERS

THERMALLY CONDUCTIVE COMPOSITION

GREASE COMPOSITION AND ELECTRONIC COMPONENT USING SAME

THERMALLY CONDUCTIVE RESIN COMPOSITION AND ELECTRONIC DEVICE

SPHERICAL ALN PARTICLES AND METHOD OF PRODUCTION OF SAME, AND COMPO...

THERMALLY CONDUCTIVE COMPOSITION, CURED PRODUCT AND ELECTRONIC COMP...

Resin Composition

SILICONE COMPOSITION AND A THERMALLY CONDUCTIVE SILICONE CURED PROD...

THERMALLY CONDUCTIVE COMPOSITION AND CURED PRODUCT THEREOF

THERMAL CONDUCTIVE SILICONE COMPOSITION

THERMAL CONDUCTIVE SILICONE COMPOSITION

INSULATING FILLER AND PRODUCTION METHOD THEREFOR, INSULATING MATERI...

EPOXY RESIN COMPOSITION AND HEAT DISSIPATION CIRCUIT BOARD USING SAME

HIGHLY THERMALLY CONDUCTIVE FLOWABLE SILICONE COMPOSITION

THERMALLY CONDUCTIVE POLYSILOXANE COMPOSITIONS

THERMALLY CONDUCTIVE RESIN COMPOSITION AND THERMALLY CONDUCTIVE SHE...

CURED MATERIAL OF THERMAL CONDUCTIVE SILICONE COMPOSITION