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BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

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B28D5/0005by breaking

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming a crack in an edge region of a donor substrate
- Patent number 12,097,641
- Issue date Sep 24, 2024
- Siltectra GmbH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hammer
- Patent number 11,794,330
- Issue date Oct 24, 2023
- TOKUYAMA CORPORATION
- Kazuhiro Kawaguchi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer processing method including crushed layer and wafer processin...
- Patent number 11,721,584
- Issue date Aug 8, 2023
- Disco Corporation
- Keiji Nomaru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a layer of solid material
- Patent number 11,699,616
- Issue date Jul 11, 2023
- Siltectra GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 11,322,404
- Issue date May 3, 2022
- Disco Corporation
- Masaru Nakamura
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
UV laser slicing of β-Ga2O3 by micro-crack generation and propagation
- Patent number 11,171,055
- Issue date Nov 9, 2021
- The Government of the United States of America, as represented by the Secreta...
- Nadeemullah A. Mahadik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of cleaving of buried defects
- Patent number 11,137,356
- Issue date Oct 5, 2021
- SELA SEMICONDUCTOR ENGINEERING LABORATORIES LTD.
- Vladimir Zheleznyak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer production method
- Patent number 11,004,723
- Issue date May 11, 2021
- Siltectra GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a crack in the edge region of a donor substrate,...
- Patent number 10,994,442
- Issue date May 4, 2021
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED wafer processing method
- Patent number 10,937,658
- Issue date Mar 2, 2021
- Disco Corporation
- Makiko Ohmae
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for separating bonded wafer structures
- Patent number 10,910,280
- Issue date Feb 2, 2021
- GlobalWafers Co., Ltd.
- Justin Scott Kayser
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for guiding a crack in the peripheral region of a donor subs...
- Patent number 10,676,386
- Issue date Jun 9, 2020
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cleave systems, mountable cleave monitoring systems, and methods fo...
- Patent number 10,679,908
- Issue date Jun 9, 2020
- GlobalWafers Co., Ltd.
- Justin Scott Kayser
- B32 - LAYERED PRODUCTS
Information Patent Grant
Combined wafer production method with laser treatment and temperatu...
- Patent number 10,593,590
- Issue date Mar 17, 2020
- Siltectra GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 10,562,207
- Issue date Feb 18, 2020
- Disco Corporation
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of forming a semiconductor die cutting tool
- Patent number 10,340,160
- Issue date Jul 2, 2019
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined wafer production method with laser treatment and temperatu...
- Patent number 10,312,135
- Issue date Jun 4, 2019
- Siltectra, GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for guiding a crack in the peripheral region of a donor subs...
- Patent number 10,280,107
- Issue date May 7, 2019
- Siltectra, GmbH
- Marko Swoboda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
SiC ingot slicing method
- Patent number 9,884,389
- Issue date Feb 6, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dicing methods
- Patent number 8,895,345
- Issue date Nov 25, 2014
- Toshiba Kikai Kabushiki Kaisha
- Takanobu Akiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing method for a workpiece, dividing method for a workpiece,...
- Patent number 8,536,024
- Issue date Sep 17, 2013
- Mitsuboshi Diamond Industrial Co., Ltd.
- Shohei Nagatomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die singulation method
- Patent number 7,985,661
- Issue date Jul 26, 2011
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die singulation method
- Patent number 7,781,310
- Issue date Aug 24, 2010
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for splitting substrates
- Patent number 7,648,888
- Issue date Jan 19, 2010
- S.O.I. Tec Silicon on Insulator Technologies
- Thierry Barge
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus and method for splitting substrates
- Patent number 7,017,570
- Issue date Mar 28, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Thierry Barge
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus and method for batch processing semiconductor substrates...
- Patent number 6,673,699
- Issue date Jan 6, 2004
- ADC Telecommunications, Inc.
- Kevin J. Hubbard
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and device for separating a plate of material, in particular...
- Patent number 6,468,879
- Issue date Oct 22, 2002
- S.O.I. Tec Silicon on Insulator Technologies
- Jean-Michel Lamure
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus and method for batch processing semiconductor substrates...
- Patent number 6,451,120
- Issue date Sep 17, 2002
- ADC Telecommunications, Inc.
- Kevin J. Hubbard
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for processing semiconductor material
- Patent number 6,360,755
- Issue date Mar 26, 2002
- Wacker-Chemie GmbH
- Matthäus Schantz
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Process for working a preform made of an oxide single crystal, and...
- Patent number 6,257,224
- Issue date Jul 10, 2001
- NGK Insulators, Ltd.
- Takashi Yoshino
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
DIVIDING METHOD
- Publication number 20250083358
- Publication date Mar 13, 2025
- Disco Corporation
- Masahiro KOBAYASHI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
ENGINEERED SEMICONDUCTOR SUBSTRATE
- Publication number 20240203804
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Darwin A. Clampitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Layer of Solid Material
- Publication number 20230307286
- Publication date Sep 28, 2023
- SILTECTRA GMBH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUS
- Publication number 20210233814
- Publication date Jul 29, 2021
- Disco Corporation
- Keiji Nomaru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing a Layer of Solid Material
- Publication number 20210225694
- Publication date Jul 22, 2021
- SILTECTRA GMBH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A CRACK IN AN EDGE REGION OF A DONOR SUBSTRATE
- Publication number 20210213643
- Publication date Jul 15, 2021
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HAMMER
- Publication number 20210078155
- Publication date Mar 18, 2021
- Kazuhiro KAWAGUCHI
- C01 - INORGANIC CHEMISTRY
Information Patent Application
METHOD OF SEGMENTING SUBSTRATE WITH METAL FILM
- Publication number 20200361120
- Publication date Nov 19, 2020
- Mitsuboshi Diamond Industrial Co., LTD.
- Kenji MURAKAMI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Wafer Production Method
- Publication number 20200185267
- Publication date Jun 11, 2020
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED WAFER PROCESSING METHOD
- Publication number 20200027739
- Publication date Jan 23, 2020
- Disco Corporation
- Makiko OHMAE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD OF CLEAVING OF BURIED DEFECTS
- Publication number 20190242829
- Publication date Aug 8, 2019
- SELA Solutions EnabLing nano Analytics Ltd.
- Vladimir Zheleznyak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Combined wafer production method with laser treatment and temperatu...
- Publication number 20190237359
- Publication date Aug 1, 2019
- Siltectra, GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...
- Publication number 20190218131
- Publication date Jul 18, 2019
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR SEPARATING BONDED WAFER STRUCTURES
- Publication number 20190206745
- Publication date Jul 4, 2019
- GLOBALWAFERS CO., LTD.
- Justin Scott Kayser
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...
- Publication number 20180185957
- Publication date Jul 5, 2018
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SPLITTING CIRCLES
- Publication number 20160339603
- Publication date Nov 24, 2016
- YOUNGTEK ELECTRONICS CORPORATION
- WEN-MING LIU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SiC INGOT SLICING METHOD
- Publication number 20160074960
- Publication date Mar 17, 2016
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DIE CUTTING TOOL
- Publication number 20160035599
- Publication date Feb 4, 2016
- Semiconductor Components Industries, LLC
- Gordon M. GRIVNA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECOVERY OF SILICON VALUE FROM KERF SILICON WASTE
- Publication number 20130319391
- Publication date Dec 5, 2013
- SEMLUX NEWCO
- Alleppey V. HARIHARAN
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SUBSTRATE-SPLITTING DEVICE WITH DETECTION OF OBSTACLES
- Publication number 20120298710
- Publication date Nov 29, 2012
- SOITEC
- Teddy Besnard
- B60 - VEHICLES IN GENERAL
Information Patent Application
LASER MACHINING DEVICE AND LASER MACHINING METHOD
- Publication number 20120061356
- Publication date Mar 15, 2012
- HAMAMATSU PHOTONICS K. K.
- Kenshi Fukumitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DICING METHODS
- Publication number 20110318877
- Publication date Dec 29, 2011
- Takanobu AKIYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD FOR A WORKPIECE, DIVIDING METHOD FOR A WORKPIECE,...
- Publication number 20110155706
- Publication date Jun 30, 2011
- Shohei NAGATOMO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE SINGULATION METHOD
- Publication number 20100184272
- Publication date Jul 22, 2010
- Gordon M. Grivna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR INTE...
- Publication number 20100133659
- Publication date Jun 3, 2010
- Fujitsu Microelectronics Limited
- Akio Hara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFER
- Publication number 20090311948
- Publication date Dec 17, 2009
- SUMCO CORPORATION
- Tomohiro Hashii
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SEMICONDUCTOR DIE SINGULATION METHOD
- Publication number 20090042366
- Publication date Feb 12, 2009
- Gordon M. Grivna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for splitting substrates
- Publication number 20060138189
- Publication date Jun 29, 2006
- S.O.I.Tec Silicon on Insulator Technologies S.A., a French company
- Thierry Barge
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Apparatus and method for splitting substrates
- Publication number 20040188487
- Publication date Sep 30, 2004
- Thierry Barge
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Apparatus and method for batch processing semiconductor substrates...
- Publication number 20020197757
- Publication date Dec 26, 2002
- ADC Telecommunications, Inc.
- Kevin J. Hubbard
- B28 - WORKING CEMENT, CLAY, OR STONE

by breaking

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming a crack in an edge region of a donor substrate

Hammer

Wafer processing method including crushed layer and wafer processin...

Method for producing a layer of solid material

Wafer processing method

UV laser slicing of β-Ga2O3 by micro-crack generation and propagation

System and method of cleaving of buried defects

Wafer production method

Method for forming a crack in the edge region of a donor substrate,...

LED wafer processing method

Methods for separating bonded wafer structures

Method for guiding a crack in the peripheral region of a donor subs...

Cleave systems, mountable cleave monitoring systems, and methods fo...

Combined wafer production method with laser treatment and temperatu...

Wafer processing method

Method of forming a semiconductor die cutting tool

Combined wafer production method with laser treatment and temperatu...

Method for guiding a crack in the peripheral region of a donor subs...

SiC ingot slicing method

Dicing methods

Processing method for a workpiece, dividing method for a workpiece,...

Semiconductor die singulation method

Semiconductor die singulation method

Apparatus and method for splitting substrates

Apparatus and method for splitting substrates

Apparatus and method for batch processing semiconductor substrates...

Method and device for separating a plate of material, in particular...

Apparatus and method for batch processing semiconductor substrates...

Method for processing semiconductor material

Process for working a preform made of an oxide single crystal, and...

Patents Applicationslast 30 patents

DIVIDING METHOD

ENGINEERED SEMICONDUCTOR SUBSTRATE

Method for Producing a Layer of Solid Material

WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUS

Method for Producing a Layer of Solid Material

METHOD FOR FORMING A CRACK IN AN EDGE REGION OF A DONOR SUBSTRATE

HAMMER

METHOD OF SEGMENTING SUBSTRATE WITH METAL FILM

Wafer Production Method

LED WAFER PROCESSING METHOD

SYSTEM AND METHOD OF CLEAVING OF BURIED DEFECTS

Combined wafer production method with laser treatment and temperatu...

METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...

METHODS FOR SEPARATING BONDED WAFER STRUCTURES

METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...

METHOD FOR SPLITTING CIRCLES

SiC INGOT SLICING METHOD

METHOD OF FORMING A SEMICONDUCTOR DIE CUTTING TOOL

RECOVERY OF SILICON VALUE FROM KERF SILICON WASTE

SUBSTRATE-SPLITTING DEVICE WITH DETECTION OF OBSTACLES

LASER MACHINING DEVICE AND LASER MACHINING METHOD

DICING METHODS

PROCESSING METHOD FOR A WORKPIECE, DIVIDING METHOD FOR A WORKPIECE,...

SEMICONDUCTOR DIE SINGULATION METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR INTE...

METHOD FOR PRODUCING SEMICONDUCTOR WAFER

SEMICONDUCTOR DIE SINGULATION METHOD

Apparatus and method for splitting substrates

Apparatus and method for splitting substrates

Apparatus and method for batch processing semiconductor substrates...