TREA

by cutting with discs or wheels

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Industry

  • CPC
  • B28D5/022
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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/022by cutting with discs or wheels
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    TECHNIQUES FOR PATTERNING FERRITE MATERIALS
    • Publication number 20240404749
    • Publication date Dec 5, 2024
    • Metamagnetics Inc.
    • Alexander Sokolov
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CUTTING APPARATUS
    • Publication number 20230191511
    • Publication date Jun 22, 2023
    • Disco Corporation
    • Takashi FUKAZAWA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DICING BLADE INCLUDING DIAMOND PARTICLES
    • Publication number 20230039736
    • Publication date Feb 9, 2023
    • Samsung Electronics Co., Ltd.
    • Youngja KIM
    • C01 - INORGANIC CHEMISTRY
  • Information Patent Application

    METHOD AND APPARATUS FOR MANUFACTURING HIGH-HARDNESS DIAMOND SIMULA...
    • Publication number 20220063135
    • Publication date Mar 3, 2022
    • DIA&CO Inc.
    • YOUNG DAE KIM
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    BLADE REPLACING APPARATUS AND ADJUSTING METHOD OF BLADE REPLACING A...
    • Publication number 20210354257
    • Publication date Nov 18, 2021
    • Disco Corporation
    • Kazuki TERADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BLADE HOLDING JIG
    • Publication number 20210316477
    • Publication date Oct 14, 2021
    • Disco Corporation
    • Zhibo SU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CUTTING BLADE AND MANUFACTURING METHOD OF CUTTING BLADE
    • Publication number 20210078204
    • Publication date Mar 18, 2021
    • Disco Corporation
    • Takashi FUKAZAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HUBBED BLADE
    • Publication number 20200324390
    • Publication date Oct 15, 2020
    • Disco Corporation
    • Ryoji TAGUCHI
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    HUBBED BLADE
    • Publication number 20200324391
    • Publication date Oct 15, 2020
    • Disco Corporation
    • Ryoji TAGUCHI
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    PATTERN STRUCTURE AND METHOD OF MANUFACTURING THE PATTERN STRUCTURE
    • Publication number 20200249384
    • Publication date Aug 6, 2020
    • Samsung Electronics Co., Ltd.
    • Sunghoon LEE
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING BLADE MOUNTING METHOD
    • Publication number 20200198183
    • Publication date Jun 25, 2020
    • Disco Corporation
    • Kazuma Sekiya
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING APPARATUS
    • Publication number 20200030928
    • Publication date Jan 30, 2020
    • Disco Corporation
    • Kazuki TERADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20190378745
    • Publication date Dec 12, 2019
    • Disco Corporation
    • Shigenori HARADA
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20190229018
    • Publication date Jul 25, 2019
    • Disco Corporation
    • Kenji Takenouchi
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING BLADE MOUNTING METHOD
    • Publication number 20190001526
    • Publication date Jan 3, 2019
    • Disco Corporation
    • Kazuma Sekiya
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20180229396
    • Publication date Aug 16, 2018
    • Disco Corporation
    • Kazuma Sekiya
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING APPARATUS
    • Publication number 20180015638
    • Publication date Jan 18, 2018
    • Disco Corporation
    • Fumio Uchida
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING
  • Information Patent Application

    APPARATUS FOR LAMINATING A TAPE FILM ON A SUBSTRATE AND A SYSTEM OF...
    • Publication number 20170133249
    • Publication date May 11, 2017
    • Samsung Electronics Co., Ltd.
    • YOUNGMIN KIM
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    METHOD FOR CUTTING DISPLAY PANEL
    • Publication number 20170084879
    • Publication date Mar 23, 2017
    • EverDisplay Optronics (Shanghai) Limited
    • Chih-wei WEN
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    PROCESSING SYSTEM
    • Publication number 20160346956
    • Publication date Dec 1, 2016
    • Disco Corporation
    • Masahiro Takekawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CUTTING APPARATUS AND CUTTING METHOD
    • Publication number 20160311127
    • Publication date Oct 27, 2016
    • Disco Corporation
    • Yuya Itatani
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING
  • Information Patent Application

    CUTTING APPARATUS AND WAFER CUTTING METHOD
    • Publication number 20160260626
    • Publication date Sep 8, 2016
    • Disco Corporation
    • Kenji Takenouchi
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING BLADE HAVING CUTTING EDGE CONTAINING PHOTOCATALYST PARTICLES
    • Publication number 20160218023
    • Publication date Jul 28, 2016
    • Disco Corporation
    • Kenji Takenouchi
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    MOUNT FLANGE
    • Publication number 20160207216
    • Publication date Jul 21, 2016
    • Disco Corporation
    • Shuji Nitta
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20160189989
    • Publication date Jun 30, 2016
    • Disco Corporation
    • Satoshi Hanajima
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING APPARATUS
    • Publication number 20160136843
    • Publication date May 19, 2016
    • Disco Corporation
    • Kei Katoh
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CLEANING MECHANISM FOR SEMICONDUCTOR SINGULATION SAWS
    • Publication number 20150367529
    • Publication date Dec 24, 2015
    • Zhijie Wang
    • B08 - CLEANING
  • Information Patent Application

    SEMICONDUCTOR WAFER DICING BLADE
    • Publication number 20150183131
    • Publication date Jul 2, 2015
    • Chee Seng Foong
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    Dicing Blade
    • Publication number 20150107572
    • Publication date Apr 23, 2015
    • Tokyo Seimitsu Co., Ltd.
    • Takashi Fujita
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    CUTTING APPARATUS
    • Publication number 20150020670
    • Publication date Jan 22, 2015
    • Disco Corporation
    • Nobuhiko Wakita
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING