by soldering

Industry

CPC
H05K13/0465

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Current Industry

H05K13/0465by soldering

Industries

Patents Grantslast 30 patents

Information Patent Grant
Robot apparatus for soldering
- Patent number 12,017,341
- Issue date Jun 25, 2024
- FANUC CORPORATION
- Yoshio Motowaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluxless gang die bonding arrangement
- Patent number 11,972,968
- Issue date Apr 30, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wave solder pallets for optimal solder flow and methods of manufact...
- Patent number 11,850,684
- Issue date Dec 26, 2023
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Information handling system interchangeable solder pads
- Patent number 11,832,393
- Issue date Nov 28, 2023
- Dell Products L.P.
- Yu-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SMT process prediction tool for intelligent decision making on PCB...
- Patent number 11,825,606
- Issue date Nov 21, 2023
- Chengdu Aeronautic Polytechnic
- Xin Su
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 11,813,688
- Issue date Nov 14, 2023
- LASERSSEL CO., LTD.
- Jae Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder composition and electronic substrate
- Patent number 11,780,035
- Issue date Oct 10, 2023
- Tamura Corporation
- Ryutaro Shimoishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Correction amount calculation device, component mounting machine, a...
- Patent number 11,751,370
- Issue date Sep 5, 2023
- FUJI CORPORATION
- Tomokatsu Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for aligning a component
- Patent number 11,711,898
- Issue date Jul 25, 2023
- Google LLC
- Douglas Raymond Dykaar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for attachment and devices produced using the methods
- Patent number 11,699,632
- Issue date Jul 11, 2023
- Alpha Assembly Solutions Inc.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable printed-circuit-board-assembly component pressing fixture
- Patent number 11,696,427
- Issue date Jul 4, 2023
- International Business Machines Corporation
- XiYuan Yin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic module, electronic module, and e...
- Patent number 11,632,886
- Issue date Apr 18, 2023
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage suppressing reflow oven
- Patent number 11,589,488
- Issue date Feb 21, 2023
- ABLEPRINT IECHNOLOGY CO., LTD.
- Chih-Horng Horng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow soldering system for combined convection soldering and conde...
- Patent number 11,504,786
- Issue date Nov 22, 2022
- Rehm Thermal Systems GmbH
- Johannes Rehm
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting machine
- Patent number 11,503,752
- Issue date Nov 15, 2022
- FUJI CORPORATION
- Hiroaki Ina
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting system and component mounting method
- Patent number 11,477,927
- Issue date Oct 18, 2022
- FUJI CORPORATION
- Takeshi Sakurayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Localized rework using liquid media soldering
- Patent number 11,445,650
- Issue date Sep 13, 2022
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming an electronic device
- Patent number 11,432,448
- Issue date Aug 30, 2022
- KEMET Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information handling system interchangeable solder pads
- Patent number 11,432,447
- Issue date Aug 30, 2022
- Dell Products L.P.
- Yu-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounter
- Patent number 11,317,551
- Issue date Apr 26, 2022
- FUJI CORPORATION
- Ryohei Kamio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting surface-mount electronic components to a circ...
- Patent number 11,317,517
- Issue date Apr 26, 2022
- PulseForge Incorporated
- Rudresh Ghosh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting machine and production line
- Patent number 11,291,149
- Issue date Mar 29, 2022
- FUJI CORPORATION
- Mitsuhiko Shibata
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing optical module
- Patent number 11,223,182
- Issue date Jan 11, 2022
- Sumitomo Electric Industries, Ltd.
- Hiromi Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting apparatus with light source plate secured between two conn...
- Patent number 11,175,027
- Issue date Nov 16, 2021
- XIAMEN LEEDARSON LIGHTING CO. LTD
- Digen Shen
- F21 - LIGHTING
Information Patent Grant
Multilayer electronics assembly and method for embedding electrical...
- Patent number 11,172,572
- Issue date Nov 9, 2021
- Crane Electronics, Inc.
- Ernest Clyde Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB for bare die mount and process therefore
- Patent number 11,160,160
- Issue date Oct 26, 2021
- Jan Hendrik Berkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting method, component mounting system, and manufactu...
- Patent number 11,140,788
- Issue date Oct 5, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tetsuya Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting device
- Patent number 11,134,597
- Issue date Sep 28, 2021
- Yamaha Hatsudoki Kabushiki Kaisha
- Kazushi Takama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 11,109,482
- Issue date Aug 31, 2021
- Kabushiki Kaisha Toshiba
- Kota Tokuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MOUNTING ELECTRONIC DEVICES AND PARTIALLY SHIELDED BOARD...
- Publication number 20240365523
- Publication date Oct 31, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Sei UEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUXLESS GANG DIE BONDING ARRANGEMENT
- Publication number 20240304485
- Publication date Sep 12, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX TRANSFER APPARATUS, FLUX TRANSFER METHOD, AND MOUNTING APPARATUS
- Publication number 20240276695
- Publication date Aug 15, 2024
- SHINKAWA LTD.
- Shinichi YOSHIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR DETERMINING CONTAMINATION COEFFICIENTS AND/OR DEGREES OF...
- Publication number 20240237322
- Publication date Jul 11, 2024
- ERSA GMBH
- Michael Haas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
QUALITY DETERMINATION DEVICE AND QUALITY DETERMINATION METHOD
- Publication number 20240149363
- Publication date May 9, 2024
- FUJI CORPORATION
- Seijiro HAGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR DETERMINING CONTAMINATION COEFFICIENTS AND/OR DEGREES OF...
- Publication number 20240138134
- Publication date Apr 25, 2024
- ERSA GMBH
- Michael Haas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES
- Publication number 20240033840
- Publication date Feb 1, 2024
- LASERSSEL CO., LTD.
- Jae Joon CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSPECTION AND PRODUCTION OF PRINTED CIRCUIT BOARD ASSEMBLIES
- Publication number 20230262903
- Publication date Aug 17, 2023
- SIEMENS AKTIENGESELLSCHAFT
- Daniel Fiebag
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLDER PRINTING INSPECTION DEVICE
- Publication number 20230232603
- Publication date Jul 20, 2023
- CKD CORPORATION
- Kazuyoshi Kikuchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD ASSEMBLY, DISPLAY ASSEMBLY AND ASSEMBLING METHOD THER...
- Publication number 20230180448
- Publication date Jun 8, 2023
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Fengxian WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORM SOLDER AND BONDING METHOD USING SAME
- Publication number 20230112020
- Publication date Apr 13, 2023
- SENJU METAL INDUSTRY CO., LTD.
- Haruya SAKUMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WARPAGE SUPPRESSING REFLOW OVEN
- Publication number 20230035154
- Publication date Feb 2, 2023
- ABLEPRINT TECHNOLOGY CO., LTD.
- Chih-Horng Horng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INFORMATION HANDLING SYSTEM INTERCHANGEABLE SOLDER PADS
- Publication number 20220322591
- Publication date Oct 6, 2022
- Dell Products L.P.
- Yu-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORRECTION AMOUNT CALCULATION DEVICE, COMPONENT MOUNTING MACHINE, A...
- Publication number 20220159886
- Publication date May 19, 2022
- FUJI CORPORATION
- Tomokatsu KUBOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORRECTION AMOUNT CALCULATING DEVICE AND CORRECTION AMOUNT CALCULAT...
- Publication number 20220151120
- Publication date May 12, 2022
- FUJI CORPORATION
- Tomokatsu KUBOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMT PROCESS PREDICTION TOOL FOR INTELLIGENT DECISION MAKING ON PCB...
- Publication number 20220104410
- Publication date Mar 31, 2022
- Southwest Electronic Technology Research Institute (The Tenth Research Instit...
- Xin SU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE
- Publication number 20220097181
- Publication date Mar 31, 2022
- TAMURA CORPORATION
- Ryutaro Shimoishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME
- Publication number 20220088710
- Publication date Mar 24, 2022
- Nidec Copal Electronics Corporation
- Tadashi Komuro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME
- Publication number 20220088711
- Publication date Mar 24, 2022
- Nidec Copal Electronics Corporation
- Tadashi Komuro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CONNECTING SURFACE-MOUNT ELECTRONIC COMPONENTS TO A CIRC...
- Publication number 20210392756
- Publication date Dec 16, 2021
- NCC NANO, LLC
- RUDRESH GHOSH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS
- Publication number 20210289680
- Publication date Sep 16, 2021
- Alpha Assembly Solutions Inc.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE PITCH ELECTRONIC COMPONENT MASS TRANSFER APPARATUS AND METHOD
- Publication number 20210219476
- Publication date Jul 15, 2021
- Guangdong University of Technology
- Xin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE PCBA COMPONENT PRESSING FIXTURE
- Publication number 20210153395
- Publication date May 20, 2021
- International Business Machines Corporation
- XiYuan Yin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC MODULE, ELECTRONIC MODULE, AND E...
- Publication number 20210136967
- Publication date May 6, 2021
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED REWORK USING LIQUID MEDIA SOLDERING
- Publication number 20210120712
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ASSEMBLING A SEMICONDUCTOR POWER MODULE COMPONENT AND A S...
- Publication number 20210013175
- Publication date Jan 14, 2021
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHTING APPARATUS
- Publication number 20200400295
- Publication date Dec 24, 2020
- XIAMEN LEEDARSON LIGHTING CO.LTD.
- Digen Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INFORMATION HANDLING SYSTEM INTERCHANGEABLE SOLDER PADS
- Publication number 20200390012
- Publication date Dec 10, 2020
- Dell Products L.P.
- Yu-Lin Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW OVEN CENTRAL MONITORING SYSTEM AND METHOD
- Publication number 20200329598
- Publication date Oct 15, 2020
- HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO.,LTD.
- SHIH-LIN WU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

by soldering

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Robot apparatus for soldering

Advanced device assembly structures and methods

Fluxless gang die bonding arrangement

Wave solder pallets for optimal solder flow and methods of manufact...

Information handling system interchangeable solder pads

SMT process prediction tool for intelligent decision making on PCB...

Laser bonding apparatus for three-dimensional molded sculptures

Solder composition and electronic substrate

Correction amount calculation device, component mounting machine, a...

Methods and systems for aligning a component

Methods for attachment and devices produced using the methods

Configurable printed-circuit-board-assembly component pressing fixture

Method of manufacturing electronic module, electronic module, and e...

Warpage suppressing reflow oven

Reflow soldering system for combined convection soldering and conde...

Component mounting machine

Component mounting system and component mounting method

Localized rework using liquid media soldering

Method of forming an electronic device

Information handling system interchangeable solder pads

Component mounter

Method for connecting surface-mount electronic components to a circ...

Electronic component mounting machine and production line

Method of manufacturing optical module

Lighting apparatus with light source plate secured between two conn...

Multilayer electronics assembly and method for embedding electrical...

PCB for bare die mount and process therefore

Component mounting method, component mounting system, and manufactu...

Component mounting device

Electronic device

Patents Applicationslast 30 patents

METHOD OF MOUNTING ELECTRONIC DEVICES AND PARTIALLY SHIELDED BOARD...

FLUXLESS GANG DIE BONDING ARRANGEMENT

FLUX TRANSFER APPARATUS, FLUX TRANSFER METHOD, AND MOUNTING APPARATUS

SYSTEM FOR DETERMINING CONTAMINATION COEFFICIENTS AND/OR DEGREES OF...

QUALITY DETERMINATION DEVICE AND QUALITY DETERMINATION METHOD

SYSTEM FOR DETERMINING CONTAMINATION COEFFICIENTS AND/OR DEGREES OF...

LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES

INSPECTION AND PRODUCTION OF PRINTED CIRCUIT BOARD ASSEMBLIES

SOLDER PRINTING INSPECTION DEVICE

CIRCUIT BOARD ASSEMBLY, DISPLAY ASSEMBLY AND ASSEMBLING METHOD THER...

PREFORM SOLDER AND BONDING METHOD USING SAME

WARPAGE SUPPRESSING REFLOW OVEN

INFORMATION HANDLING SYSTEM INTERCHANGEABLE SOLDER PADS

CORRECTION AMOUNT CALCULATION DEVICE, COMPONENT MOUNTING MACHINE, A...

CORRECTION AMOUNT CALCULATING DEVICE AND CORRECTION AMOUNT CALCULAT...

SMT PROCESS PREDICTION TOOL FOR INTELLIGENT DECISION MAKING ON PCB...

Advanced Device Assembly Structures And Methods

SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE

ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME

ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME

METHOD FOR CONNECTING SURFACE-MOUNT ELECTRONIC COMPONENTS TO A CIRC...

METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS

VARIABLE PITCH ELECTRONIC COMPONENT MASS TRANSFER APPARATUS AND METHOD

CONFIGURABLE PCBA COMPONENT PRESSING FIXTURE

METHOD OF MANUFACTURING ELECTRONIC MODULE, ELECTRONIC MODULE, AND E...

LOCALIZED REWORK USING LIQUID MEDIA SOLDERING

METHOD OF ASSEMBLING A SEMICONDUCTOR POWER MODULE COMPONENT AND A S...

LIGHTING APPARATUS

INFORMATION HANDLING SYSTEM INTERCHANGEABLE SOLDER PADS

REFLOW OVEN CENTRAL MONITORING SYSTEM AND METHOD