by ultrasonic cutting

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CPC
B28D5/047

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/047by ultrasonic cutting

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Acoustic cleaving apparatus and methods of acoustic cleaving
- Patent number 12,103,200
- Issue date Oct 1, 2024
- Crystal Sonic, Inc.
- Mariana Bertoni
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Cutting method
- Patent number 12,097,633
- Issue date Sep 24, 2024
- Disco Corporation
- Takashi Okamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic resonator support structure and ultrasonic vibration mac...
- Patent number 11,759,975
- Issue date Sep 19, 2023
- TAKADA CORPORATION
- Keiichi Yotsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon wafer forming method
- Patent number 11,511,374
- Issue date Nov 29, 2022
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sound-assisted crack propagation for semiconductor wafering
- Patent number 11,504,882
- Issue date Nov 22, 2022
- Arizona Board of Regents on behalf of Arizona State University
- Mariana Bertoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling apparatus
- Patent number 11,358,306
- Issue date Jun 14, 2022
- Disco Corporation
- Kazuyuki Hinohara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic peening-type integrated machining method of cutting and...
- Patent number 10,994,386
- Issue date May 4, 2021
- Beihang University
- Deyuan Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Processing apparatus
- Patent number 10,930,558
- Issue date Feb 23, 2021
- Disco Corporation
- Kenji Takenouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sound-assisted crack propagation for semiconductor wafering
- Patent number 10,828,800
- Issue date Nov 10, 2020
- Arizona Board of Regents on behalf of Arizona State University
- Mariana Bertoni
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor substrate manufacturing method
- Patent number 10,253,432
- Issue date Apr 9, 2019
- Sumitomo Chemical Company, Limited
- Masatomo Shibata
- C30 - CRYSTAL GROWTH
Information Patent Grant
Tool unit applied to ultrasonic machining
- Patent number 9,789,580
- Issue date Oct 17, 2017
- Chen-Chia Chou
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of processing tempered glass
- Patent number 9,700,983
- Issue date Jul 11, 2017
- CERON Technologies Inc.
- Hironori Minami
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Honeycomb catalyst body
- Patent number 9,695,724
- Issue date Jul 4, 2017
- NGK Insulators, Ltd.
- Satoshi Sakashita
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Ultrasonic micron precision molding apparatus
- Patent number 9,671,774
- Issue date Jun 6, 2017
- Chen-Chia Chou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting method of honeycomb formed body
- Patent number 9,238,308
- Issue date Jan 19, 2016
- NGK Insulators, Ltd.
- Keisuke Toba
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Spindle and flexible hinge used in ultrasonic machine
- Patent number 7,816,840
- Issue date Oct 19, 2010
- Industrial Technology Research Institute
- Kuo-Yu Tang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing components
- Patent number 7,736,995
- Issue date Jun 15, 2010
- Schott AG
- Markus Vos
- B24 - GRINDING POLISHING
Information Patent Grant
Cutting method and cutting apparatus
- Patent number 7,347,766
- Issue date Mar 25, 2008
- Disco Corporation
- Yuji Nitta
- B24 - GRINDING POLISHING
Information Patent Grant
Vibratory material removal system and method
- Patent number 6,612,906
- Issue date Sep 2, 2003
- David Benderly
- B24 - GRINDING POLISHING
Information Patent Grant
Method of machining a thermosetting laminate
- Patent number 6,146,252
- Issue date Nov 14, 2000
- Perstorp Flooring AB
- Goran Martensson
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for producing sonotrodes
- Patent number 5,709,823
- Issue date Jan 20, 1998
- Thera Patent GmbH & Co. KG Gesellschaft fur industrielle Schutzrechte
- Rainer Hahn
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus for making an aperture in a tile
- Patent number 5,597,345
- Issue date Jan 28, 1997
- Michael J. R. Young
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Process and device for manufacturing a structural part, especially...
- Patent number 5,490,810
- Issue date Feb 13, 1996
- Thera Patent GmbH & Co. KG Gesellschaft fur industrielle Schutzrechte
- Rainer Hahn
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Ultrasonic cutting device
- Patent number 5,437,215
- Issue date Aug 1, 1995
- Nestec S.A.
- Francis F. Hamilton
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Ultrasonic cutting apparatus
- Patent number 5,226,343
- Issue date Jul 13, 1993
- Nestec S.A.
- Francis F. H. Rawson
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting brittle materials
- Patent number 5,195,410
- Issue date Mar 23, 1993
- S.R.A. Developments Limited
- Michael J. R. Young
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Ultrasonic drilling apparatus
- Patent number 4,828,052
- Issue date May 9, 1989
- The United States of America as represented by the United States Department o...
- Edward L. Duran
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Ultrasonic cutting apparatus and methods
- Patent number 4,567,797
- Issue date Feb 4, 1986
- Donald C. Folk
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus for marking identification symbols on wafer
- Patent number 4,166,574
- Issue date Sep 4, 1979
- Tokyo Shibaura Electric Co., Ltd.
- Masanori Yokoyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Gemstone drill
- Patent number 4,076,007
- Issue date Feb 28, 1978
- Eugene E. Redlin
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
PEELING APPARATUS
- Publication number 20230373129
- Publication date Nov 23, 2023
- Disco Corporation
- Koyo HONOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOUND-ASSISTED CRACK PROPAGATION FOR SEMICONDUCTOR WAFERING
- Publication number 20230102291
- Publication date Mar 30, 2023
- Arizona Board of Regents on behalf of Arizona State University
- Mariana BERTONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUTTING METHOD
- Publication number 20220055242
- Publication date Feb 24, 2022
- Disco Corporation
- Takashi OKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LINE CUTTING METHOD, MULTI-LINE CUTTING APPARATUS AND USE THE...
- Publication number 20220009126
- Publication date Jan 13, 2022
- FUJIAN NORSTEL MATERIAL TECHNOLOGIES CO., LTD
- Bofan LAI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SOUND-ASSISTED CRACK PROPAGATION FOR SEMICONDUCTOR WAFERING
- Publication number 20210053251
- Publication date Feb 25, 2021
- Arizona Board of Regents on behalf of Arizona State University
- Mariana BERTONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS
- Publication number 20190229018
- Publication date Jul 25, 2019
- Disco Corporation
- Kenji Takenouchi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SOUND-ASSISTED CRACK PROPAGATION FOR SEMICONDUCTOR WAFERING
- Publication number 20190061198
- Publication date Feb 28, 2019
- ARIZONA BOARD OR REGEMTS ON BEHALF OF ARIZONA STATE UNIVERSITY
- Mariana BERTONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD
- Publication number 20170009378
- Publication date Jan 12, 2017
- Sumitomo Chemical Company, Limited
- Masatomo SHIBATA
- C30 - CRYSTAL GROWTH
Information Patent Application
HONEYCOMB CATALYST BODY
- Publication number 20140205509
- Publication date Jul 24, 2014
- NGK Insulators, Ltd.
- Satoshi SAKASHITA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SPINDLE AND FLEXIBLE HINGE USED IN ULTRASONIC MACHINE
- Publication number 20090146530
- Publication date Jun 11, 2009
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Kuo-Yu TANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for producing components
- Publication number 20070170597
- Publication date Jul 26, 2007
- Markus Vos
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Cutting method and cutting apparatus
- Publication number 20070066188
- Publication date Mar 22, 2007
- Yuji Nitta
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Impact induced crack propagation in a brittle material
- Publication number 20070039990
- Publication date Feb 22, 2007
- Marvin William Kemmerer
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Ultrasonic induced crack propagation in a brittle material
- Publication number 20060249553
- Publication date Nov 9, 2006
- Ljerka Ukrainczyk
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Cutting or grinding machine
- Publication number 20060236828
- Publication date Oct 26, 2006
- Kazumasa Ohnishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vibratory material removal system and method
- Publication number 20030077980
- Publication date Apr 24, 2003
- David Benderly
- B28 - WORKING CEMENT, CLAY, OR STONE

by ultrasonic cutting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Acoustic cleaving apparatus and methods of acoustic cleaving

Cutting method

Ultrasonic resonator support structure and ultrasonic vibration mac...

Silicon wafer forming method

Sound-assisted crack propagation for semiconductor wafering

Peeling apparatus

Ultrasonic peening-type integrated machining method of cutting and...

Processing apparatus

Sound-assisted crack propagation for semiconductor wafering

Semiconductor substrate manufacturing method

Tool unit applied to ultrasonic machining

Method of processing tempered glass

Honeycomb catalyst body

Ultrasonic micron precision molding apparatus

Cutting method of honeycomb formed body

Spindle and flexible hinge used in ultrasonic machine

Process for producing components

Cutting method and cutting apparatus

Vibratory material removal system and method

Method of machining a thermosetting laminate

Method for producing sonotrodes

Apparatus for making an aperture in a tile

Process and device for manufacturing a structural part, especially...

Ultrasonic cutting device

Ultrasonic cutting apparatus

Cutting brittle materials

Ultrasonic drilling apparatus

Ultrasonic cutting apparatus and methods

Apparatus for marking identification symbols on wafer

Gemstone drill

Patents Applicationslast 30 patents

PEELING APPARATUS

SOUND-ASSISTED CRACK PROPAGATION FOR SEMICONDUCTOR WAFERING

CUTTING METHOD

MULTI-LINE CUTTING METHOD, MULTI-LINE CUTTING APPARATUS AND USE THE...

SOUND-ASSISTED CRACK PROPAGATION FOR SEMICONDUCTOR WAFERING

PROCESSING APPARATUS

SOUND-ASSISTED CRACK PROPAGATION FOR SEMICONDUCTOR WAFERING

SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD

HONEYCOMB CATALYST BODY

SPINDLE AND FLEXIBLE HINGE USED IN ULTRASONIC MACHINE

Process for producing components

Cutting method and cutting apparatus

Impact induced crack propagation in a brittle material

Ultrasonic induced crack propagation in a brittle material

Cutting or grinding machine

Vibratory material removal system and method