Cell separation

Industry

CPC
C25D17/002

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating

Current Industry

C25D17/002Cell separation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plating apparatus and method for electroplating wafer
- Patent number 12,227,865
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Min Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating membrane
- Patent number 12,195,866
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Hsiang Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method, insoluble anode for plating, and plating apparatus
- Patent number 12,157,951
- Issue date Dec 3, 2024
- Ebara Corporation
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film forming apparatus for forming metal film and film forming meth...
- Patent number 12,123,103
- Issue date Oct 22, 2024
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film forming apparatus for forming metal film and film forming meth...
- Patent number 12,110,604
- Issue date Oct 8, 2024
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Air bubble removing method of plating apparatus and plating apparatus
- Patent number 12,077,875
- Issue date Sep 3, 2024
- Ebara Corporation
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 12,054,846
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
System and process for producing lithium
- Patent number 12,018,397
- Issue date Jun 25, 2024
- ALPHA-EN CORPORATION
- Lawrence Ralph Swonger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film formation apparatus and film formation method for forming meta...
- Patent number 12,006,584
- Issue date Jun 11, 2024
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for shielding features of a workpiece during el...
- Patent number 11,987,897
- Issue date May 21, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating bath containing trivalent chromium and process for d...
- Patent number 11,905,613
- Issue date Feb 20, 2024
- Coventya S.p.A.
- Diego Dal Zilio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 11,903,141
- Issue date Feb 13, 2024
- Toyota Jidosha Kabushiki Kaisha
- Keiji Kuroda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 11,859,303
- Issue date Jan 2, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Zhaowei Jia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
- Patent number 11,859,300
- Issue date Jan 2, 2024
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film formation apparatus and film formation method for forming meta...
- Patent number 11,840,770
- Issue date Dec 12, 2023
- Toyota Jidosha Kabushiki Kaisha
- Akira Kato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film, film forming method, and surface-coated material
- Patent number 11,821,101
- Issue date Nov 21, 2023
- Toyota Jidosha Kabushiki Kaisha
- Koji Wada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Interfacial electrofabrication of freestanding biopolymer membranes...
- Patent number 11,821,097
- Issue date Nov 21, 2023
- The Catholic University of America
- Xiaolong Luo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating membrane
- Patent number 11,814,743
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Hsiang Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 11,781,235
- Issue date Oct 10, 2023
- ACM RESEARCH (SHANGHAI), INC.
- Yinuo Jin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film forming method for forming metal film and film forming apparat...
- Patent number 11,718,923
- Issue date Aug 8, 2023
- Toyota Jidosha Kabushiki Kaisha
- Yuki Sato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multi-compartment electrochemical replenishment cell
- Patent number 11,697,887
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Nolan L. Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating systems and methods with increased metal ion concent...
- Patent number 11,686,005
- Issue date Jun 27, 2023
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film formation device and film formation method for metallic coating
- Patent number 11,643,745
- Issue date May 9, 2023
- Toyota Jidosha Kabushiki Kaisha
- Akira Kato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for plating
- Patent number 11,591,709
- Issue date Feb 28, 2023
- Ebara Corporation
- Naoto Takahashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus for tailored uniformity profile
- Patent number 11,549,192
- Issue date Jan 10, 2023
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus, air bubble removing method, and storage medium t...
- Patent number 11,542,623
- Issue date Jan 3, 2023
- Ebara Corporation
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and method for electroplating wafer
- Patent number 11,401,624
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Min Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
- Patent number 11,401,623
- Issue date Aug 2, 2022
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for forming silver film
- Patent number 11,230,781
- Issue date Jan 25, 2022
- Toyota Jidosha Kabushiki Kaisha
- Hirofumi Iisaka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film forming device and method for forming metal film using the same
- Patent number 11,225,728
- Issue date Jan 18, 2022
- Toyota Jidosha Kabushiki Kaisha
- Kazuaki Okamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20250034745
- Publication date Jan 30, 2025
- EBARA CORPORATION
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240368795
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20240318346
- Publication date Sep 26, 2024
- EBARA CORPORATION
- Shinji OMATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM AND PROCESS FOR PRODUCING LITHIUM
- Publication number 20240301579
- Publication date Sep 12, 2024
- ALPHA-EN CORPORATION
- Lawrence Ralph Swonger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FILM FORMING METHOD FOR METAL FILM
- Publication number 20240263336
- Publication date Aug 8, 2024
- Toyota Jidosha Kabushiki Kaisha
- Koji INAGAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING PROCESS METHOD
- Publication number 20240209540
- Publication date Jun 27, 2024
- EBARA CORPORATION
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FILM FORMATION DEVICE FOR METAL FILM
- Publication number 20240200221
- Publication date Jun 20, 2024
- Toyota Jidosha Kabushiki Kaisha
- Soma HIGASHIKOZONO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20240175165
- Publication date May 30, 2024
- EBARA CORPORATION
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM AND METHOD FOR ELECTROFORMING A COMPONENT
- Publication number 20240167187
- Publication date May 23, 2024
- UNISON INDUSTRIES, LLC
- Pei-hsin Kuo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20240141540
- Publication date May 2, 2024
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PROCESSING ARTICLES AND CORRESPONDING APPARATUS
- Publication number 20240141543
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Paolo CREMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
OPTIMIZED METHOD AND DEVICE FOR INSOLUBLE ANODE ACID SULFATE COPPER...
- Publication number 20240060202
- Publication date Feb 22, 2024
- Tao YE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FILM, FILM FORMING METHOD, AND SURFACE-COATED MATERIAL
- Publication number 20240044033
- Publication date Feb 8, 2024
- Toyota Jidosha Kabushiki Kaisha
- Koji WADA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20240026561
- Publication date Jan 25, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Zhaowei Jia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20240018681
- Publication date Jan 18, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Yinuo Jin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING MEMBRANE
- Publication number 20240018685
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Hsiang CHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING DEVICE
- Publication number 20240003040
- Publication date Jan 4, 2024
- MITOMO SEMICON ENGINEERING CO., LTD.
- YUJI UCHIUMI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...
- Publication number 20230313405
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING-DEPLATING WAVEFORM BASED CONTACT CLEANING FOR A SUBSTRATE E...
- Publication number 20230313408
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Liu YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REDOX MEMBRANES FOR LITHIUM EXTRACTION
- Publication number 20230311074
- Publication date Oct 5, 2023
- XERION ADVANCED BATTERY CORP.
- Heng Yang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...
- Publication number 20230313406
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...
- Publication number 20230272546
- Publication date Aug 31, 2023
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURGING FLOW FOR BUBBLE CLEARING IN ELECTROPLATING SYSTEMS
- Publication number 20230235474
- Publication date Jul 27, 2023
- Applied Materials, Inc.
- Joel L. Cannone
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20230167574
- Publication date Jun 1, 2023
- EBARA CORPORATION
- Ryosuke Hiwatashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FILM FORMATION APPARATUS AND FILM FORMATION METHOD FOR FORMING META...
- Publication number 20230124546
- Publication date Apr 20, 2023
- TOYOTA JIDOSHA KABUSHIKI KAISHA
- Haruki KONDOH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FILM FORMING APPARATUS FOR FORMING METAL FILM AND FILM FORMING METH...
- Publication number 20230122871
- Publication date Apr 20, 2023
- Toyota Jidosha Kabushiki Kaisha
- Haruki KONDOH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FILM FORMING APPARATUS FOR FORMING METAL FILM AND FILM FORMING METH...
- Publication number 20230117855
- Publication date Apr 20, 2023
- Toyota Jidosha Kabushiki Kaisha
- Haruki KONDOH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20230083395
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL DEPOSITION SYSTEM FOR A CHEMICAL AND/OR ELECTROLYTI...
- Publication number 20230056444
- Publication date Feb 23, 2023
- Semsysco GmbH
- Andreas GLEISSNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAFER SHIELDING FOR PREVENTION OF LIPSEAL PLATE-OUT
- Publication number 20220396894
- Publication date Dec 15, 2022
- LAM RESEARCH CORPORATION
- Gregory J. Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Cell separation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plating apparatus and method for electroplating wafer

Plating membrane

Plating method, insoluble anode for plating, and plating apparatus

Film forming apparatus for forming metal film and film forming meth...

Film forming apparatus for forming metal film and film forming meth...

Air bubble removing method of plating apparatus and plating apparatus

Electroplating apparatus and electroplating method

System and process for producing lithium

Film formation apparatus and film formation method for forming meta...

Systems and methods for shielding features of a workpiece during el...

Electroplating bath containing trivalent chromium and process for d...

Method for manufacturing wiring board

Plating apparatus

Controlling plating electrolyte concentration on an electrochemical...

Film formation apparatus and film formation method for forming meta...

Film, film forming method, and surface-coated material

Interfacial electrofabrication of freestanding biopolymer membranes...

Plating membrane

Plating apparatus and plating method

Film forming method for forming metal film and film forming apparat...

Multi-compartment electrochemical replenishment cell

Electroplating systems and methods with increased metal ion concent...

Film formation device and film formation method for metallic coating

Apparatus for plating

Electroplating apparatus for tailored uniformity profile

Plating apparatus, air bubble removing method, and storage medium t...

Plating apparatus and method for electroplating wafer

Controlling plating electrolyte concentration on an electrochemical...

Method for forming silver film

Film forming device and method for forming metal film using the same

Patents Applicationslast 30 patents

PLATING APPARATUS AND PLATING METHOD

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

PLATING APPARATUS

SYSTEM AND PROCESS FOR PRODUCING LITHIUM

FILM FORMING METHOD FOR METAL FILM

PLATING PROCESS METHOD

FILM FORMATION DEVICE FOR METAL FILM

PLATING APPARATUS

SYSTEM AND METHOD FOR ELECTROFORMING A COMPONENT

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

METHOD OF PROCESSING ARTICLES AND CORRESPONDING APPARATUS

OPTIMIZED METHOD AND DEVICE FOR INSOLUBLE ANODE ACID SULFATE COPPER...

FILM, FILM FORMING METHOD, AND SURFACE-COATED MATERIAL

PLATING APPARATUS AND PLATING METHOD

PLATING APPARATUS AND PLATING METHOD

PLATING MEMBRANE

PLATING DEVICE

ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...

PLATING-DEPLATING WAVEFORM BASED CONTACT CLEANING FOR A SUBSTRATE E...

REDOX MEMBRANES FOR LITHIUM EXTRACTION

ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...

ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...

SURGING FLOW FOR BUBBLE CLEARING IN ELECTROPLATING SYSTEMS

PLATING APPARATUS

FILM FORMATION APPARATUS AND FILM FORMATION METHOD FOR FORMING META...

FILM FORMING APPARATUS FOR FORMING METAL FILM AND FILM FORMING METH...

FILM FORMING APPARATUS FOR FORMING METAL FILM AND FILM FORMING METH...

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

ELECTROCHEMICAL DEPOSITION SYSTEM FOR A CHEMICAL AND/OR ELECTROLYTI...

WAFER SHIELDING FOR PREVENTION OF LIPSEAL PLATE-OUT