characterised by the organic bath constituents used

Industry

CPC
C25D3/32

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D3/00Electroplating: Baths therefor

Current Industry

C25D3/32characterised by the organic bath constituents used

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Composition for tin-silver alloy electroplating comprising a comple...
- Patent number 12,054,842
- Issue date Aug 6, 2024
- BASF SE
- Katharina Fritzsche
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for dissolving tin (II) oxide
- Patent number 12,043,914
- Issue date Jul 23, 2024
- JX Metals Corporation
- Koichi Takemoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Stannous oxide powder
- Patent number 11,981,581
- Issue date May 14, 2024
- JX Metals Corporation
- Koichi Takemoto
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Tin or tin alloy electroplating bath, and electronic component havi...
- Patent number 11,939,691
- Issue date Mar 26, 2024
- Ishihara Chemical Co., LTD
- Syohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for metal plating comprising suppressing agent for void...
- Patent number 11,926,918
- Issue date Mar 12, 2024
- BASF SE
- Marcel Patrik Kienle
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating solution of tin or tin alloy with improved thickness...
- Patent number 11,879,181
- Issue date Jan 23, 2024
- HOJIN PLATECH CO., LTD.
- Woon Suk Jung
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Sn-based plated steel sheet
- Patent number 11,859,289
- Issue date Jan 2, 2024
- Nippon Steel Corporation
- Shintaro Yamanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition for tin or tin alloy electroplating comprising suppress...
- Patent number 11,840,771
- Issue date Dec 12, 2023
- BASF SE
- Alexander Fluegel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Reaction products of amine monomers and polymers containing saturat...
- Patent number 11,732,374
- Issue date Aug 22, 2023
- Rohm and Haas Electronic Materials LLC
- Lingli Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin-indium alloy electroplating solution
- Patent number 11,686,007
- Issue date Jun 27, 2023
- NEW MEXICO TECH UNIVERSITY RESEARCH PARK CORPORATION
- Bhaskar S. Majumdar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silver/tin electroplating bath and method of using the same
- Patent number 11,643,742
- Issue date May 9, 2023
- MacDermid Enthone Inc.
- Fengting Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating method
- Patent number 11,549,189
- Issue date Jan 10, 2023
- Ming Chi University of Technology
- Kun-Cheng Peng
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Composition for tin or tin alloy electroplating comprising leveling...
- Patent number 11,535,946
- Issue date Dec 27, 2022
- BASF SE
- Alexander Fluegel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for metal electroplating comprising leveling agent
- Patent number 11,486,049
- Issue date Nov 1, 2022
- BASF SE
- Cornelia Roeger-Goepfert
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for tin or tin alloy electroplating comprising suppress...
- Patent number 11,459,665
- Issue date Oct 4, 2022
- BASF SE
- Alexander Fluegel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin solution for tin film formation and method for forming tin film...
- Patent number 11,421,334
- Issue date Aug 23, 2022
- Toyota Jidosha Kabushiki Kaisha
- Hirofumi Iisaka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Manufacturing method of indium tin oxide
- Patent number 11,359,299
- Issue date Jun 14, 2022
- Ming Chi University of Technology
- Kun-Cheng Peng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic method for extracting tin and/or lead contained in an...
- Patent number 11,280,011
- Issue date Mar 22, 2022
- VEOLIA ENVIRONMENT—VE
- Vincent Georgeaud
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Silver/tin electroplating bath and method of using the same
- Patent number 11,280,014
- Issue date Mar 22, 2022
- MacDermid Enthone Inc.
- Fengting Xu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal deposits, compositions, and methods for making the same
- Patent number 11,274,374
- Issue date Mar 15, 2022
- Iontra LLC
- Daniel A. Konopka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin plating bath and a method for depositing tin or tin alloy onto...
- Patent number 11,274,375
- Issue date Mar 15, 2022
- Atotech Deutschland GmbH
- Kadir Tuna
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin or tin alloy plating solution
- Patent number 11,268,203
- Issue date Mar 8, 2022
- Mitsubishi Materials Corporation
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for tin or tin alloy electroplating comprising suppress...
- Patent number 11,242,606
- Issue date Feb 8, 2022
- BASF SE
- Alexander Fluegel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating liquid
- Patent number 11,174,565
- Issue date Nov 16, 2021
- Mitsubishi Materials Corporation
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin or tin alloy plating solution
- Patent number 11,162,182
- Issue date Nov 2, 2021
- Mitsubishi Materials Corporation
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin-plated copper terminal material, terminal, and wire terminal pa...
- Patent number 11,088,472
- Issue date Aug 10, 2021
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin-plated product and method for producing same
- Patent number 11,078,587
- Issue date Aug 3, 2021
- Dowa Metaltech Co., Ltd.
- Yuta Sonoda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Tin or tin alloy plating solution and bump forming method
- Patent number 11,053,600
- Issue date Jul 6, 2021
- Mitsubishi Materials Corporation
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal plating compositions
- Patent number 10,892,802
- Issue date Jan 12, 2021
- Rohm and Haas Electronic Materials LLC
- Lingli Duan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sn-based alloy plated steel sheet
- Patent number 10,865,491
- Issue date Dec 15, 2020
- Nippon Steel Corporation
- Shintaro Yamanaka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
SULFONATE ELECTROPLATING BATH, PROCESS FOR REFINING METAL BY ELECTR...
- Publication number 20240287696
- Publication date Aug 29, 2024
- BASF SE
- Si Jun ZHU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR TIN-SILVER ALLOY ELECTROPLATING COMPRISING A COMPLE...
- Publication number 20240060201
- Publication date Feb 22, 2024
- BASF SE
- Marco ARNOLD
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-INDIUM ALLOY ELECTROPLATING SOLUTION
- Publication number 20230383430
- Publication date Nov 30, 2023
- NEW MEXICO TECH UNIVERSITY RESEARCH PARK CORPORATION
- Bhaskar S. MAJUMDAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROPLATING SOLUTION OF TIN OR TIN ALLOY WITH IMPROVED THICKNESS...
- Publication number 20230151504
- Publication date May 18, 2023
- HOJIN PLATECH CO., LTD.
- Woon Suk JUNG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN OR TIN ALLOY ELECTROPLATING SOLUTION, METHOD FOR FORMING BUMPS,...
- Publication number 20230038219
- Publication date Feb 9, 2023
- MITSUBISHI MATERIALS CORPORATION
- Kyoka Susuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Sn-BASED PLATED STEEL SHEET
- Publication number 20220389590
- Publication date Dec 8, 2022
- NIPPON STEEL CORPORATION
- Shintaro YAMANAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR DISSOLVING TIN (II) OXIDE
- Publication number 20220243349
- Publication date Aug 4, 2022
- JX NIPPON MINING & METALS CORPORATION
- Koichi Takemoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Silver/Tin Electroplating Bath and Method of Using the Same
- Publication number 20220170172
- Publication date Jun 2, 2022
- MacDermid Enthone Inc.
- Fengting Xu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESS...
- Publication number 20220119972
- Publication date Apr 21, 2022
- BASF SE
- Alexander FLUEGEL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD OF INDIUM TIN OXIDE
- Publication number 20220090285
- Publication date Mar 24, 2022
- Ming Chi University of Technology
- Kun-Cheng PENG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Silver/Tin Electroplating Bath and Method of Using the Same
- Publication number 20210381121
- Publication date Dec 9, 2021
- MacDermid Enthone Inc.
- Fengting Xu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESS...
- Publication number 20210180201
- Publication date Jun 17, 2021
- BASF SE
- Alexander FLUEGEL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESS...
- Publication number 20210079548
- Publication date Mar 18, 2021
- BASF SE
- Alexander FLUEGEL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STANNOUS OXIDE POWDER
- Publication number 20210047198
- Publication date Feb 18, 2021
- JX NIPPON MINING & METALS CORPORATION
- Koichi TAKEMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN OR TIN-ALLOY PLATING LIQUID, BUMP FORMING METHOD, AND CIRCUIT B...
- Publication number 20210040636
- Publication date Feb 11, 2021
- MITSUBISHI MATERIALS CORPORATION
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN OR TIN ALLOY PLATING SOLUTION AND BUMP FORMING METHOD
- Publication number 20210025069
- Publication date Jan 28, 2021
- MITSUBISHI MATERIALS CORPORATION
- Koji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR TIN-SILVER ALLOY ELECTROPLATING COMPRISING A COMPLE...
- Publication number 20210025070
- Publication date Jan 28, 2021
- BASF SE
- Katharina FRITZSCHE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN OR TIN ALLOY PLATING SOLUTION
- Publication number 20200378025
- Publication date Dec 3, 2020
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING LIQUID
- Publication number 20200378023
- Publication date Dec 3, 2020
- MITSUBISHI MATERIALS CORPORATION
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN OR TIN ALLOY PLATING SOLUTION
- Publication number 20200378024
- Publication date Dec 3, 2020
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC SN OR SN ALLOY PLATING SOLUTION AND METHOD FOR PRODUCI...
- Publication number 20200208285
- Publication date Jul 2, 2020
- C. Uyemura & Co., Ltd.
- Masato Enomoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT
- Publication number 20200199767
- Publication date Jun 25, 2020
- BASF SE
- Cornelia ROEGER-GOEPFERT
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FILM FORMING DEVICE AND METHOD FOR FORMING METAL FILM USING THE SAME
- Publication number 20200190685
- Publication date Jun 18, 2020
- TOYOTA JIDOSHA KABUSHIKI KAISHA
- Hirofumi IISAKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN SOLUTION FOR TIN FILM FORMATION AND METHOD FOR FORMING TIN FILM...
- Publication number 20200157697
- Publication date May 21, 2020
- Toyota Jidosha Kabushiki Kaisha
- Hirofumi IISAKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REACTION PRODUCTS OF AMINE MONOMERS AND POLYMERS CONTAINING SATURAT...
- Publication number 20200149175
- Publication date May 14, 2020
- DOW GLOBAL TECHNOLOGIES LLC
- Lingli Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC TIN ALLOY PLATING SOLUTION
- Publication number 20200123673
- Publication date Apr 23, 2020
- C. Uyemura & Co., Ltd.
- Daisuke HASHIMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING LEVELING...
- Publication number 20200115813
- Publication date Apr 16, 2020
- BASF SE
- Alexander FLUEGEL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC TIN PLATING SOLUTION
- Publication number 20200095698
- Publication date Mar 26, 2020
- C. Uyemura & Co., Ltd.
- Daisuke HASHIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NEW METAL PLATING COMPOSITIONS
- Publication number 20200031818
- Publication date Jan 30, 2020
- DOW GLOBAL TECHNOLOGIES LLC
- LINGLI DUAN
- C07 - ORGANIC CHEMISTRY
Information Patent Application
TIN ALLOY PLATING SOLUTION
- Publication number 20190390357
- Publication date Dec 26, 2019
- MITSUBISHI MATERIALS CORPORATION
- Kouji Tatsumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

characterised by the organic bath constituents used

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Composition for tin-silver alloy electroplating comprising a comple...

Method for dissolving tin (II) oxide

Stannous oxide powder

Tin or tin alloy electroplating bath, and electronic component havi...

Composition for metal plating comprising suppressing agent for void...

Electroplating solution of tin or tin alloy with improved thickness...

Sn-based plated steel sheet

Composition for tin or tin alloy electroplating comprising suppress...

Reaction products of amine monomers and polymers containing saturat...

Tin-indium alloy electroplating solution

Silver/tin electroplating bath and method of using the same

Electroplating method

Composition for tin or tin alloy electroplating comprising leveling...

Composition for metal electroplating comprising leveling agent

Composition for tin or tin alloy electroplating comprising suppress...

Tin solution for tin film formation and method for forming tin film...

Manufacturing method of indium tin oxide

Electrolytic method for extracting tin and/or lead contained in an...

Silver/tin electroplating bath and method of using the same

Metal deposits, compositions, and methods for making the same

Tin plating bath and a method for depositing tin or tin alloy onto...

Tin or tin alloy plating solution

Composition for tin or tin alloy electroplating comprising suppress...

Plating liquid

Tin or tin alloy plating solution

Tin-plated copper terminal material, terminal, and wire terminal pa...

Tin-plated product and method for producing same

Tin or tin alloy plating solution and bump forming method

Metal plating compositions

Sn-based alloy plated steel sheet

Patents Applicationslast 30 patents

SULFONATE ELECTROPLATING BATH, PROCESS FOR REFINING METAL BY ELECTR...

COMPOSITION FOR TIN-SILVER ALLOY ELECTROPLATING COMPRISING A COMPLE...

TIN-INDIUM ALLOY ELECTROPLATING SOLUTION

ELECTROPLATING SOLUTION OF TIN OR TIN ALLOY WITH IMPROVED THICKNESS...

TIN OR TIN ALLOY ELECTROPLATING SOLUTION, METHOD FOR FORMING BUMPS,...

Sn-BASED PLATED STEEL SHEET

METHOD FOR DISSOLVING TIN (II) OXIDE

Silver/Tin Electroplating Bath and Method of Using the Same

COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESS...

MANUFACTURING METHOD OF INDIUM TIN OXIDE

Silver/Tin Electroplating Bath and Method of Using the Same

COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESS...

COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESS...

STANNOUS OXIDE POWDER

TIN OR TIN-ALLOY PLATING LIQUID, BUMP FORMING METHOD, AND CIRCUIT B...

TIN OR TIN ALLOY PLATING SOLUTION AND BUMP FORMING METHOD

COMPOSITION FOR TIN-SILVER ALLOY ELECTROPLATING COMPRISING A COMPLE...

TIN OR TIN ALLOY PLATING SOLUTION

PLATING LIQUID

TIN OR TIN ALLOY PLATING SOLUTION

ELECTROLYTIC SN OR SN ALLOY PLATING SOLUTION AND METHOD FOR PRODUCI...

COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT

FILM FORMING DEVICE AND METHOD FOR FORMING METAL FILM USING THE SAME

TIN SOLUTION FOR TIN FILM FORMATION AND METHOD FOR FORMING TIN FILM...

REACTION PRODUCTS OF AMINE MONOMERS AND POLYMERS CONTAINING SATURAT...

ELECTROLYTIC TIN ALLOY PLATING SOLUTION

COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING LEVELING...

ELECTROLYTIC TIN PLATING SOLUTION

NEW METAL PLATING COMPOSITIONS

TIN ALLOY PLATING SOLUTION