containing more than 50% by weight of copper

Industry

CPC
C25D3/58

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Parent Industries

CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D3/00Electroplating: Baths therefor

Current Industry

C25D3/58containing more than 50% by weight of copper

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Nano-twinned Cu—Ni alloy layer and method for manufacturing the same
- Patent number 12,037,670
- Issue date Jul 16, 2024
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chih Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dilute alloy catalysts for electrochemical CO2 reduction
- Patent number 11,959,183
- Issue date Apr 16, 2024
- Lawrence Livermore National Security, LLC
- Juergen Biener
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper or copper alloy electroplating bath
- Patent number 11,946,153
- Issue date Apr 2, 2024
- Ishihara Chemical Co., LTD
- Masaru Hatabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electroplating baths containing compounds of reaction produc...
- Patent number 11,761,107
- Issue date Sep 19, 2023
- Rohm and Haas Electronic Materials LLC
- Weijing Lu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cladded metal interconnects
- Patent number 11,749,560
- Issue date Sep 5, 2023
- Intel Corporation
- Thomas Marieb
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal or metal alloy deposition composition and plating compound
- Patent number 11,512,405
- Issue date Nov 29, 2022
- Atotech Deutschland GmbH
- Angela Llavona-Serrano
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for metal electroplating comprising leveling agent
- Patent number 11,486,049
- Issue date Nov 1, 2022
- BASF SE
- Cornelia Roeger-Goepfert
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil with minimized bagginess and tear, electrode comprising...
- Patent number 11,352,707
- Issue date Jun 7, 2022
- SK NEXILIS CO., LTD.
- Seung Min Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating bronze on polymer sheets
- Patent number 11,293,111
- Issue date Apr 5, 2022
- 3M Innovative Properties Company
- Steven Y. Yu
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Metal deposits, compositions, and methods for making the same
- Patent number 11,274,374
- Issue date Mar 15, 2022
- Iontra LLC
- Daniel A. Konopka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating method
- Patent number 11,236,431
- Issue date Feb 1, 2022
- YKK Corporation
- Masayuki Iimori
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrode for battery and fabrication method thereof
- Patent number 11,211,606
- Issue date Dec 28, 2021
- The Hong Kong Polytechnic University
- Zijian Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated material and manufacturing method therefor
- Patent number 11,072,866
- Issue date Jul 27, 2021
- YKK Corporation
- Masayuki Iimori
- A44 - HABERDASHERY JEWELLERY
Information Patent Grant
Metal wires, manufacturing methods therefor and tires
- Patent number 11,020,781
- Issue date Jun 1, 2021
- Jiangsu Xingda Steel Tyre Cord Co., Ltd.
- Xiang Liu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for manufacturing composition controlled thin alloy foil by...
- Patent number 10,988,851
- Issue date Apr 27, 2021
- DANKOOK UNIVERSITY CHEONAN CAMPUS INDUSTRY ACADEMIC COOPERATION FOUNDATION
- Yong Choi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,171
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,170
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal plating compositions
- Patent number 10,892,802
- Issue date Jan 12, 2021
- Rohm and Haas Electronic Materials LLC
- Lingli Duan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Pyridinium compounds, a synthesis method therefor, metal or metal a...
- Patent number 10,882,842
- Issue date Jan 5, 2021
- Atotech Deutschland GmbH
- Rangarajan Jagannathan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Easily handleable electrolytic copper foil, electrode comprising th...
- Patent number 10,811,689
- Issue date Oct 20, 2020
- KCF TECHNOLOGIES CO., LTD.
- Seung Min Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electroplating baths containing compounds of reaction produc...
- Patent number 10,738,388
- Issue date Aug 11, 2020
- Rohm and Haas Electronic Materials LLC
- Weijing Lu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin-plated product and method for producing same
- Patent number 10,676,835
- Issue date Jun 9, 2020
- Dowa Metaltech Co., Ltd.
- Hirotaka Kotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material and process for electrochemical deposition of nanolaminate...
- Patent number 10,662,542
- Issue date May 26, 2020
- Modumetal, Inc.
- Richard Caldwell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper electroplating baths containing reaction products of aminex,...
- Patent number 10,662,541
- Issue date May 26, 2020
- Rohm and Haas Electronic Materials LLC
- Weijing Lu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper plating bath composition and method for deposition of copper
- Patent number 10,633,755
- Issue date Apr 28, 2020
- Atotech Deutschland GmbH
- Dirk Rohde
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electroplating baths containing compounds of reaction produc...
- Patent number 10,604,858
- Issue date Mar 31, 2020
- Dow Global Technologies LLC
- Weijing Lu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrically conductive material for connection component
- Patent number 10,597,792
- Issue date Mar 24, 2020
- Kobe Steel, Ltd.
- Masahiro Tsuru
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electroplating baths containing compounds of reaction produc...
- Patent number 10,590,556
- Issue date Mar 17, 2020
- Rohm and Haas Electronic Materials LLC
- Weijing Lu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrolytic copper plating solution analyzer, and electrolytic cop...
- Patent number 10,557,819
- Issue date Feb 11, 2020
- Toppan Printing Co., Ltd.
- Masahiro Kosugi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper-nickel alloy electroplating device
- Patent number 10,538,854
- Issue date Jan 21, 2020
- Dipsol Chemicals Co., Ltd.
- Hitoshi Sakurai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
Bronze Layers as Noble Metal Substitutes
- Publication number 20240287698
- Publication date Aug 29, 2024
- UMICORE GALVANOTECHNIK GMBH
- Robert Ziebart
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PLUMBING COMPONENT WITH A COATING AND METHOD FOR COATING A PLUMBING...
- Publication number 20240084949
- Publication date Mar 14, 2024
- Grohe AG
- Christian ZIMMERMANN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADDITIVE COMPOSITION FOR PLATING SOLUTION
- Publication number 20240076792
- Publication date Mar 7, 2024
- Mi Yun KIM
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Improving Copper Alloy Electroplating Filling Process
- Publication number 20240060205
- Publication date Feb 22, 2024
- Shanghai Huali Integrated Circuit Corporation
- Yu Bao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...
- Publication number 20230282485
- Publication date Sep 7, 2023
- Aveni
- Louis Caillard
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NANO-TWINNED Cu-Ni ALLOY LAYER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230220517
- Publication date Jul 13, 2023
- National Yang Ming Chiao Tung University
- Chih CHEN
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PCB TERMINAL, CONNECTOR, WIRING HARNESS WITH CONNECTOR AND BOARD UNIT
- Publication number 20230130798
- Publication date Apr 27, 2023
- AUTONETWORKS TECHNOLOGIES, LTD.
- Michitake KAMAMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER OR COPPER ALLOY ELECTROPLATING BATH
- Publication number 20220127741
- Publication date Apr 28, 2022
- ISHIHARA CHEMICAL CO., LTD.
- Masaru HATABE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODEPOSITION OF A COBALT OR COPPER ALLOY, AND USE IN MICROELEC...
- Publication number 20220090283
- Publication date Mar 24, 2022
- aveni
- Vincent MEVELLEC
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID...
- Publication number 20210317582
- Publication date Oct 14, 2021
- BASF SE
- Cornelia Röger-Göpfert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DILUTE ALLOY CATALYSTS FOR ELECTROCHEMICAL CO2 REDUCTION
- Publication number 20210147989
- Publication date May 20, 2021
- LAWRENCE LIVERMORE NATIONAL SECURITY, LLC
- Juergen Biener
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER-IRON ALLOY ELECTROPLATING SOLUTION AND ELECTROPLATING METHOD...
- Publication number 20200385882
- Publication date Dec 10, 2020
- JCU INTERNATIONAL, INC.
- Masao HORI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL OR METAL ALLOY DEPOSITION COMPOSITION AND PLATING COMPOUND
- Publication number 20200340132
- Publication date Oct 29, 2020
- Angela LLAVONA-SERRANO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF OBTAINING A YELLOW GOLD ALLOY DEPOSITION BY GALVANOPLASTY...
- Publication number 20200240030
- Publication date Jul 30, 2020
- THE SWATCH GROUP RESEARCH AND DEVELOPMENT LTD
- Christophe Henzirohs
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PYRIDINIUM COMPOUNDS, A SYNTHESIS METHOD THEREFOR, METAL OR METAL A...
- Publication number 20200231565
- Publication date Jul 23, 2020
- Atotech Deutschland GmbH
- Rangarajan JAGANNATHAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT
- Publication number 20200199767
- Publication date Jun 25, 2020
- BASF SE
- Cornelia ROEGER-GOEPFERT
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID...
- Publication number 20200173029
- Publication date Jun 4, 2020
- BASF SE
- Cornelia ROEGER-GOEPFERT
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUC...
- Publication number 20200149176
- Publication date May 14, 2020
- DOW GLOBAL TECHNOLOGIES LLC
- Weijing LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating Method and Device
- Publication number 20200095700
- Publication date Mar 26, 2020
- YKK Corporation
- Masayuki Iimori
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CLADDED METAL INTERCONNECTS
- Publication number 20200098619
- Publication date Mar 26, 2020
- Intel Corporation
- Thomas Marieb
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NEW METAL PLATING COMPOSITIONS
- Publication number 20200031818
- Publication date Jan 30, 2020
- DOW GLOBAL TECHNOLOGIES LLC
- LINGLI DUAN
- C07 - ORGANIC CHEMISTRY
Information Patent Application
METAL WIRES, MANUFACTURING METHODS THEREFOR AND TIRES
- Publication number 20190338435
- Publication date Nov 7, 2019
- Jiangsu Xingda Steel Tyre Cord Co., Ltd.
- Xiang LIU
- B60 - VEHICLES IN GENERAL
Information Patent Application
METAL DEPOSITS, COMPOSITIONS, AND METHODS FOR MAKING THE SAME
- Publication number 20190301039
- Publication date Oct 3, 2019
- Iontra LLC
- Daniel A. Konopka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODE FOR BATTERY AND FABRICATION METHOD THEREOF
- Publication number 20190207218
- Publication date Jul 4, 2019
- The Hong Kong Polytechnic University
- Zijian ZHENG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER-SILVER DUAL-COMPONENT METAL ELECTROPLATING SOLUTION AND ELEC...
- Publication number 20190127871
- Publication date May 2, 2019
- NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- CHI-HAW CHIANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTION COMPONENT
- Publication number 20180371633
- Publication date Dec 27, 2018
- Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- Masahiro TSURU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING BRONZE ON POLYMER SHEETS
- Publication number 20180347059
- Publication date Dec 6, 2018
- 3M Innovative Properties Company
- Steven Y. Yu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUC...
- Publication number 20180237931
- Publication date Aug 23, 2018
- DOW GLOBAL TECHNOLOGIES LLC
- Weijing LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER PLATING BATH COMPOSITION AND METHOD FOR DEPOSITION OF COPPER
- Publication number 20180237932
- Publication date Aug 23, 2018
- Atotech Deutschland GmbH
- Dirk ROHDE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUC...
- Publication number 20180237929
- Publication date Aug 23, 2018
- DOW GLOBAL TECHNOLOGIES LLC
- Weijing LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

containing more than 50% by weight of copper

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nano-twinned Cu—Ni alloy layer and method for manufacturing the same

Dilute alloy catalysts for electrochemical CO2 reduction

Copper or copper alloy electroplating bath

Copper electroplating baths containing compounds of reaction produc...

Cladded metal interconnects

Metal or metal alloy deposition composition and plating compound

Composition for metal electroplating comprising leveling agent

Copper foil with minimized bagginess and tear, electrode comprising...

Plating bronze on polymer sheets

Metal deposits, compositions, and methods for making the same

Electroplating method

Electrode for battery and fabrication method thereof

Plated material and manufacturing method therefor

Metal wires, manufacturing methods therefor and tires

Method for manufacturing composition controlled thin alloy foil by...

Surface treated copper foil, surface treated copper foil with resin...

Surface treated copper foil, surface treated copper foil with resin...

Metal plating compositions

Pyridinium compounds, a synthesis method therefor, metal or metal a...

Easily handleable electrolytic copper foil, electrode comprising th...

Copper electroplating baths containing compounds of reaction produc...

Tin-plated product and method for producing same

Material and process for electrochemical deposition of nanolaminate...

Copper electroplating baths containing reaction products of aminex,...

Copper plating bath composition and method for deposition of copper

Copper electroplating baths containing compounds of reaction produc...

Electrically conductive material for connection component

Copper electroplating baths containing compounds of reaction produc...

Electrolytic copper plating solution analyzer, and electrolytic cop...

Copper-nickel alloy electroplating device

Patents Applicationslast 30 patents

Bronze Layers as Noble Metal Substitutes

PLUMBING COMPONENT WITH A COATING AND METHOD FOR COATING A PLUMBING...

ADDITIVE COMPOSITION FOR PLATING SOLUTION

Method for Improving Copper Alloy Electroplating Filling Process

Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...

NANO-TWINNED Cu-Ni ALLOY LAYER AND METHOD FOR MANUFACTURING THE SAME

PCB TERMINAL, CONNECTOR, WIRING HARNESS WITH CONNECTOR AND BOARD UNIT

COPPER OR COPPER ALLOY ELECTROPLATING BATH

ELECTRODEPOSITION OF A COBALT OR COPPER ALLOY, AND USE IN MICROELEC...

COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID...

DILUTE ALLOY CATALYSTS FOR ELECTROCHEMICAL CO2 REDUCTION

COPPER-IRON ALLOY ELECTROPLATING SOLUTION AND ELECTROPLATING METHOD...

METAL OR METAL ALLOY DEPOSITION COMPOSITION AND PLATING COMPOUND

METHOD OF OBTAINING A YELLOW GOLD ALLOY DEPOSITION BY GALVANOPLASTY...

PYRIDINIUM COMPOUNDS, A SYNTHESIS METHOD THEREFOR, METAL OR METAL A...

COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT

COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID...

COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUC...

Electroplating Method and Device

CLADDED METAL INTERCONNECTS

NEW METAL PLATING COMPOSITIONS

METAL WIRES, MANUFACTURING METHODS THEREFOR AND TIRES

METAL DEPOSITS, COMPOSITIONS, AND METHODS FOR MAKING THE SAME

ELECTRODE FOR BATTERY AND FABRICATION METHOD THEREOF

COPPER-SILVER DUAL-COMPONENT METAL ELECTROPLATING SOLUTION AND ELEC...

ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTION COMPONENT

PLATING BRONZE ON POLYMER SHEETS

COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUC...

COPPER PLATING BATH COMPOSITION AND METHOD FOR DEPOSITION OF COPPER

COPPER ELECTROPLATING BATHS CONTAINING COMPOUNDS OF REACTION PRODUC...