Copper

Industry

CPC
C04B2237/407

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Parent Industries

CCHEMISTRY METALLURGY C04Concrete, cement, ceramics C04BLIME, MAGNESIA SLAG CEMENTS COMPOSITIONS THEREOF C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating

Current Industry

C04B2237/407Copper

Industries

Patents Grantslast 30 patents

Information Patent Grant
Copper/ceramic joined body and insulating circuit substrate
- Patent number 12,125,765
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic-copper composite, ceramic circuit board, power module, and...
- Patent number 12,109,640
- Issue date Oct 8, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal ceramic substrate and method for manufacturing such metal cer...
- Patent number 12,075,557
- Issue date Aug 27, 2024
- Rogers Germany GmbH
- Vitalij Gil
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-copper composite, method of producing ceramic-copper compos...
- Patent number 12,065,385
- Issue date Aug 20, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper/ceramic bonded body, insulating circuit substrate, copper/ce...
- Patent number 12,037,294
- Issue date Jul 16, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High optical power light conversion device using a phosphor element...
- Patent number 12,034,092
- Issue date Jul 9, 2024
- Materion Corporation
- Michael P. Newell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing active metal-brazed nitride ceramic substr...
- Patent number 11,964,919
- Issue date Apr 23, 2024
- ZONE INFINITYCO., LTD.
- Inchul Cho
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Composite green sheet and ceramic member
- Patent number 11,952,316
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method for copper/ceramic joined body, production method...
- Patent number 11,939,270
- Issue date Mar 26, 2024
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic sintered body and substrate for semiconductor device
- Patent number 11,897,817
- Issue date Feb 13, 2024
- NGK Insulators, Ltd.
- Yuji Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper/ceramic joined body, insulating circuit substrate, copper/ce...
- Patent number 11,881,439
- Issue date Jan 23, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a semi-finished metal product, method for prod...
- Patent number 11,845,700
- Issue date Dec 19, 2023
- Rogers Germany GmbH
- Maximilian Engel
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal-ceramic substrate and method for producing a metal-ceramic su...
- Patent number 11,807,584
- Issue date Nov 7, 2023
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a metal-ceramic substrate with electrically co...
- Patent number 11,804,383
- Issue date Oct 31, 2023
- Infineon Technologies AG
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
High optical power light conversion device using a phosphor element...
- Patent number 11,658,252
- Issue date May 23, 2023
- Michael P. Newell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite component for horology or jewellery with a ceramic struct...
- Patent number 11,625,007
- Issue date Apr 11, 2023
- Omega SA
- Frederic Jeanrenaud
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Hard PZT ceramic, piezoelectric multilayer component and method for...
- Patent number 11,608,301
- Issue date Mar 21, 2023
- TDK ELECTRONICS AG
- Denis Orosel
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Copper-ceramic composite
- Patent number 11,584,696
- Issue date Feb 21, 2023
- Heraeus Deutschland GmbH & Co. KG
- Kai Herbst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board and module using same
- Patent number 11,570,890
- Issue date Jan 31, 2023
- DENKA COMPANY LIMITED
- Yuta Tsugawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a metal-ceramic substrate with at least one via
- Patent number 11,557,490
- Issue date Jan 17, 2023
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-ceramic composite
- Patent number 11,498,878
- Issue date Nov 15, 2022
- Heraeus Deutschland GmbH & Co. KG
- Kai Herbst
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic circuit board, method for manufacturing ceramic circuit boa...
- Patent number 11,452,204
- Issue date Sep 20, 2022
- DENKA COMPANY LIMITED
- Yusaku Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structures and methods of manufacture
- Patent number 11,437,304
- Issue date Sep 6, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic-metal substrate with low amorphous phase
- Patent number 11,430,741
- Issue date Aug 30, 2022
- Heraeus Deutschland GmbH & Co. KG
- Alexander Rogg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structures and methods of manufacture
- Patent number 11,419,217
- Issue date Aug 16, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High optical power light conversion device using a phosphor element...
- Patent number 11,289,616
- Issue date Mar 29, 2022
- MATERION CORPORATION
- Michael P. Newell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of metallizing ferrite ceramics and component comprising a m...
- Patent number 11,236,024
- Issue date Feb 1, 2022
- Wurth Elektronik eiSos GmbH & Co. KG
- Patrick Messner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gallium nitride sintered body or gallium nitride molded article, an...
- Patent number 11,168,393
- Issue date Nov 9, 2021
- Tosoh Corporation
- Masami Mesuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing ceramic circuit board
- Patent number 11,129,282
- Issue date Sep 21, 2021
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Direct bonded copper ceramic substrate
- Patent number 11,076,483
- Issue date Jul 27, 2021
- Industrial Technology Research Institute
- Kai-Hsiang Chuang
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE CERAMIC SUBSTRATE HAVING MULTI-LAYER CONFIGURATION
- Publication number 20240360043
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Kai-Mou CHOU
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
COPPER-CERAMIC SUBSTRATE
- Publication number 20230399267
- Publication date Dec 14, 2023
- AURUBIS STOLBERG GMBH & CO. KG
- Benjamin CAPPI
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE SHEET AND METHOD FOR PRODUCING SAME, AND MULTILAYER BODY...
- Publication number 20230365471
- Publication date Nov 16, 2023
- Denka Company Limited
- Yusuke WAKUDA
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE SHEET AND MANUFACTURING METHOD THEREOF, AND LAMINATE AND...
- Publication number 20230357089
- Publication date Nov 9, 2023
- Denka Company Limited
- Yoshitaka MINAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SHEET, LAMINATE, AND EVALUATION METHOD FOR ESTIMATING ADH...
- Publication number 20230357090
- Publication date Nov 9, 2023
- Denka Company Limited
- Yusuke WAKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-C...
- Publication number 20230269879
- Publication date Aug 24, 2023
- BYD Company Limited
- Wei ZHOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITE BODY AND LAYERED BODY
- Publication number 20230227370
- Publication date Jul 20, 2023
- Denka Company Limited
- Nobuya SUZUKI
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Bonded Assembly, And Ceramic Circuit Substrate And Semiconductor De...
- Publication number 20230202137
- Publication date Jun 29, 2023
- Kabushiki Kaisha Toshiba
- Shota YAMAMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT SUBSTRATE
- Publication number 20230197556
- Publication date Jun 22, 2023
- MITSUBISHI MATERIALS CORPORATION
- Satoshi Takakuwa
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Support Substrate and Method for Producing a Support Substrate
- Publication number 20230171887
- Publication date Jun 1, 2023
- Rogers Germany GmbH
- Tilo Welker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for Producing a Metal-Ceramic Substrate, and a Metal-Cerami...
- Publication number 20230164913
- Publication date May 25, 2023
- Rogers Germany GmbH
- Fabian Wagle
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20230135530
- Publication date May 4, 2023
- Kabushiki Kaisha Toshiba
- Seiichi SUENAGA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20230140744
- Publication date May 4, 2023
- Kabushiki Kaisha Toshiba
- Seiichi SUENAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-GRAPHENE BONDED BODY AND METHOD FOR MANUFACTURING SAME, AND...
- Publication number 20230127611
- Publication date Apr 27, 2023
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Method for Producing a Metal-Ceramic Substrate with Electrically Co...
- Publication number 20230095753
- Publication date Mar 30, 2023
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Metal ceramic substrate and method for manufacturing such metal cer...
- Publication number 20230028429
- Publication date Jan 26, 2023
- Rogers Germany GmbH
- Vitalij GIL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE AND FURNACE
- Publication number 20220411339
- Publication date Dec 29, 2022
- Heraeus Deutschland GmbH & Co. KG
- Andre SCHWÖBEL
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20220369468
- Publication date Nov 17, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE CERAMIC CONDUCTOR FOR DOWNHOLE APPLICATIONS
- Publication number 20220316281
- Publication date Oct 6, 2022
- Baker Hughes Oilfield Operations LLC
- Farhat Shaikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC JOINED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CE...
- Publication number 20220223492
- Publication date Jul 14, 2022
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC-COPPER COMPOSITE, CERAMIC CIRCUIT BOARD, POWER MODULE, AND...
- Publication number 20220225498
- Publication date Jul 14, 2022
- DENKA COMPANY LIMITED
- Akimasa YUASA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD FOR COPPER/CERAMIC JOINED BODY, PRODUCTION METHOD...
- Publication number 20220064074
- Publication date Mar 3, 2022
- MITSUBISHI MATERIALS CORPORATION
- Shuji Nishimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC-COPPER COMPOSITE, METHOD OF PRODUCING CERAMIC-COPPER COMPOS...
- Publication number 20220009842
- Publication date Jan 13, 2022
- DENKA COMPANY LIMITED
- Akimasa YUASA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
METHOD FOR MANUFACTURING ACTIVE METAL-BRAZED NITRIDE CERAMIC SUBSTR...
- Publication number 20210269368
- Publication date Sep 2, 2021
- ZONE INFINITY CO., LTD.
- Inchul CHO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CERAMIC SINTERED BODY AND SUBSTRATE FOR SEMICONDUCTOR DEVICE
- Publication number 20210261473
- Publication date Aug 26, 2021
- NGK Insulators, Ltd.
- Yuji UMEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING A METAL-CERAMIC SU...
- Publication number 20210188719
- Publication date Jun 24, 2021
- Rogers Germany GmbH
- Andreas Meyer
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
COPPER-CERAMIC COMPOSITE
- Publication number 20210188718
- Publication date Jun 24, 2021
- Heraeus Deutschland GmbH & Co. KG
- Kai Herbst
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
DIRECT BONDED COPPER CERAMIC SUBSTRATE
- Publication number 20210161006
- Publication date May 27, 2021
- Industrial Technology Research Institute
- Kai-Hsiang CHUANG
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
COPPER-CERAMIC SUBSTRATE
- Publication number 20210002179
- Publication date Jan 7, 2021
- AURUBIS STOLBERG GMBH & CO. KG
- HELGE LEHMANN
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Method for Producing a Metal-Ceramic Substrate with at Least One Via
- Publication number 20200395225
- Publication date Dec 17, 2020
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Copper/ceramic joined body and insulating circuit substrate

Ceramic-copper composite, ceramic circuit board, power module, and...

Metal ceramic substrate and method for manufacturing such metal cer...

Ceramic-copper composite, method of producing ceramic-copper compos...

Copper/ceramic bonded body, insulating circuit substrate, copper/ce...

High optical power light conversion device using a phosphor element...

Method for manufacturing active metal-brazed nitride ceramic substr...

Composite green sheet and ceramic member

Production method for copper/ceramic joined body, production method...

Ceramic sintered body and substrate for semiconductor device

Copper/ceramic joined body, insulating circuit substrate, copper/ce...

Method for producing a semi-finished metal product, method for prod...

Metal-ceramic substrate and method for producing a metal-ceramic su...

Method for producing a metal-ceramic substrate with electrically co...

High optical power light conversion device using a phosphor element...

Composite component for horology or jewellery with a ceramic struct...

Hard PZT ceramic, piezoelectric multilayer component and method for...

Copper-ceramic composite

Ceramic circuit board and module using same

Method for producing a metal-ceramic substrate with at least one via

Copper-ceramic composite

Ceramic circuit board, method for manufacturing ceramic circuit boa...

Substrate structures and methods of manufacture

Ceramic-metal substrate with low amorphous phase

Substrate structures and methods of manufacture

High optical power light conversion device using a phosphor element...

Method of metallizing ferrite ceramics and component comprising a m...

Gallium nitride sintered body or gallium nitride molded article, an...

Method for manufacturing ceramic circuit board

Direct bonded copper ceramic substrate

Patents Applicationslast 30 patents

COMPOSITE CERAMIC SUBSTRATE HAVING MULTI-LAYER CONFIGURATION

COPPER-CERAMIC SUBSTRATE

COMPOSITE SHEET AND METHOD FOR PRODUCING SAME, AND MULTILAYER BODY...

COMPOSITE SHEET AND MANUFACTURING METHOD THEREOF, AND LAMINATE AND...

COMPOSITE SHEET, LAMINATE, AND EVALUATION METHOD FOR ESTIMATING ADH...

CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-C...

COMPOSITE BODY AND LAYERED BODY

Bonded Assembly, And Ceramic Circuit Substrate And Semiconductor De...

COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT SUBSTRATE

Support Substrate and Method for Producing a Support Substrate

Process for Producing a Metal-Ceramic Substrate, and a Metal-Cerami...

BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

COPPER-GRAPHENE BONDED BODY AND METHOD FOR MANUFACTURING SAME, AND...

Method for Producing a Metal-Ceramic Substrate with Electrically Co...

Metal ceramic substrate and method for manufacturing such metal cer...

METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE AND FURNACE

SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE

ELECTRICALLY CONDUCTIVE CERAMIC CONDUCTOR FOR DOWNHOLE APPLICATIONS

COPPER/CERAMIC JOINED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CE...

CERAMIC-COPPER COMPOSITE, CERAMIC CIRCUIT BOARD, POWER MODULE, AND...

PRODUCTION METHOD FOR COPPER/CERAMIC JOINED BODY, PRODUCTION METHOD...

CERAMIC-COPPER COMPOSITE, METHOD OF PRODUCING CERAMIC-COPPER COMPOS...

METHOD FOR MANUFACTURING ACTIVE METAL-BRAZED NITRIDE CERAMIC SUBSTR...

CERAMIC SINTERED BODY AND SUBSTRATE FOR SEMICONDUCTOR DEVICE

METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING A METAL-CERAMIC SU...

COPPER-CERAMIC COMPOSITE

DIRECT BONDED COPPER CERAMIC SUBSTRATE

COPPER-CERAMIC SUBSTRATE

Method for Producing a Metal-Ceramic Substrate with at Least One Via