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Sumitomo Electric Industries, Ltd.
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MULTI-LAYER CERAMIC PLATE DEVICE
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Thermal Insulation
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MODIFIED SCHEELITE MATERIAL FOR CO-FIRING
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Skyworks Solutions, Inc.
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Thermal Insulation
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Thermal Ceramics UK Limited
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METHOD FOR ANNEALING BONDING WAFERS
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IHP GmbH - Innovations for High Performance Microelectronics / Leibniz-Instit...
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