for etching copper or alloys thereof

Industry

CPC
C23F1/34

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Parent Industries

CCHEMISTRY METALLURGY C23Surface treatment C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 C23F1/00Etching metallic material by chemical means

Current Industry

C23F1/34for etching copper or alloys thereof

Industries

Patents Grantslast 30 patents

Information Patent Grant
Nanotextured metal powders for 3D printing of metals
- Patent number 11,938,536
- Issue date Mar 26, 2024
- The Board of Trustees of the Leland Stanford Junior University
- Ottman A. Tertuliano
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Methods for wet atomic layer etching of copper
- Patent number 11,866,831
- Issue date Jan 9, 2024
- Tokyo Electron Limited
- Christopher Netzband
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical liquid and method for treating object to be treated
- Patent number 11,859,119
- Issue date Jan 2, 2024
- FUJIFILM Corporation
- Tomonori Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching chelating agent, manufacturing method thereof, and etching...
- Patent number 11,674,229
- Issue date Jun 13, 2023
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Haoxu Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ruthenium etching composition and method
- Patent number 11,346,008
- Issue date May 31, 2022
- Entegris, Inc.
- Steven Lippy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Alkaline cupric chloride etchant for printed circuit board
- Patent number 11,225,722
- Issue date Jan 18, 2022
- Tao Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Superhydrophobic surface arrangement, article compromising same and...
- Patent number 10,961,629
- Issue date Mar 30, 2021
- City University of Hong Kong
- Zuankai Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective metal/metal oxide etch process
- Patent number 10,297,465
- Issue date May 21, 2019
- Sachem, Inc.
- Paul Vermeulen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of modifying surfaces of diamond particles, and related dia...
- Patent number 10,246,335
- Issue date Apr 2, 2019
- Baker Hughes, a GE company, LLC
- Anthony A. DiGiovanni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacture method of array substrate and array substrate manufactu...
- Patent number 10,211,232
- Issue date Feb 19, 2019
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Qiming Gan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Removal composition for selectively removing hard mask and methods...
- Patent number 10,155,921
- Issue date Dec 18, 2018
- E I DUPONT NE NEMOURS AND COMPANY
- Hua Cui
- B08 - CLEANING
Information Patent Grant
High-efficiency high-quality and safe alkaline cupric chloride etch...
- Patent number 10,087,368
- Issue date Oct 2, 2018
- Tao Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Removal composition for selectively removing hard mask and methods...
- Patent number 10,005,991
- Issue date Jun 26, 2018
- EKC TECHNOLOGY INC
- Hua Cui
- B08 - CLEANING
Information Patent Grant
Microetching solution for copper, replenishment solution therefor a...
- Patent number 9,932,678
- Issue date Apr 3, 2018
- MEC Company Ltd.
- Masayo Kurii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching agent for copper or copper alloy
- Patent number 9,790,600
- Issue date Oct 17, 2017
- Entegris, Inc.
- Tsutomu Kojima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching liquid for film of multilayer structure containing copper l...
- Patent number 9,580,818
- Issue date Feb 28, 2017
- Mitsubishi Gas Chemical Company, Inc.
- Satoshi Tamai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of improving lifetime of etching liquid and yield in Cu-inte...
- Patent number 9,528,188
- Issue date Dec 27, 2016
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Xudong Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wet etching methods for copper removal and planarization in semicon...
- Patent number 9,447,505
- Issue date Sep 20, 2016
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microetching solution for copper, replenishment solution therefor a...
- Patent number 9,441,303
- Issue date Sep 13, 2016
- MEC Company Ltd.
- Masayo Kurii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching agent for copper or copper alloy
- Patent number 9,175,404
- Issue date Nov 3, 2015
- Advanced Technology Materials, Inc.
- Tsutomu Kojima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wet etching methods for copper removal and planarization in semicon...
- Patent number 9,074,286
- Issue date Jul 7, 2015
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reduced isotropic etchant material consumption and waste generation
- Patent number 9,074,287
- Issue date Jul 7, 2015
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective etching of copper and copper-barrier materials by an aque...
- Patent number 9,012,322
- Issue date Apr 21, 2015
- Intermolecular, Inc.
- Anh Duong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for processing a surface
- Patent number 8,951,612
- Issue date Feb 10, 2015
- International Business Machines Corporation
- Emmanuel Delamarche
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching composition, method of forming a metal pattern and method o...
- Patent number 8,637,399
- Issue date Jan 28, 2014
- Samsung Display Co., Ltd.
- Hong-Sick Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reduced isotropic etchant material consumption and waste generation
- Patent number 8,597,461
- Issue date Dec 3, 2013
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for processing a surface
- Patent number 8,580,129
- Issue date Nov 12, 2013
- International Business Machines Corporation
- Emmanuel Delamarche
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thin film support substrate for use in hydrogen production filter a...
- Patent number 8,562,847
- Issue date Oct 22, 2013
- Dai Nippon Insatsu Kabushiki Kaisha
- Hiroshi Yagi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Modulated metal removal using localized wet etching
- Patent number 8,530,359
- Issue date Sep 10, 2013
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabrication of semiconductor interconnect structure
- Patent number 8,481,432
- Issue date Jul 9, 2013
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ETCHING COMPOSITIONS
- Publication number 20230243041
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua JACOBS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AN AQUEOUS BASIC ETCHING COMPOSITION FOR THE TREATMENT OF SURFACES...
- Publication number 20230220558
- Publication date Jul 13, 2023
- Atotech Deutschland GmbH & Co. KG
- Lars KOHLMANN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ECO-FRIENDLY HYDROPHOBIC OR ULTRAHYDROPHOBIC COATING METHOD
- Publication number 20230081036
- Publication date Mar 16, 2023
- POSTECH Research and Business Development Foundation
- Woonbong HWANG
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
CONTINUOUS ETCHING SYSTEM
- Publication number 20220117092
- Publication date Apr 14, 2022
- Jainil SHAH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHEMICAL LIQUID AND METHOD FOR TREATING OBJECT TO BE TREATED
- Publication number 20220002622
- Publication date Jan 6, 2022
- FUJIFILM CORPORATION
- Tomonori TAKAHASHI
- B08 - CLEANING
Information Patent Application
HIGH-EFFICIENCY AND ENVIRONMENTAL FRIENDLY ALKALINE COPPER CHLORIDE...
- Publication number 20210332484
- Publication date Oct 28, 2021
- Tao YE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURE METHOD OF ARRAY SUBSTRATE AND ARRAY SUBSTRATE MANUFACTU...
- Publication number 20180097015
- Publication date Apr 5, 2018
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Qiming Gan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF IMPROVING LIFETIME OF ETCHING LIQUID AND YIELD IN CU-INTE...
- Publication number 20170037519
- Publication date Feb 9, 2017
- SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xudong ZHANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REMOVAL COMPOSITION FOR SELECTIVELY REMOVING HARD MASK AND METHODS...
- Publication number 20160312162
- Publication date Oct 27, 2016
- E.I. du Pont de Nemours and Company
- Hua Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUPERHYDROPHOBIC SURFACE ARRANGEMENT, ARTICLE COMPRISING SAME, AND...
- Publication number 20160214152
- Publication date Jul 28, 2016
- CITY UNIVERSITY OF HONG KONG
- Zuankai WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHED SILICON STRUCTURES, METHOD OF FORMING ETCHED SILICON STRUCTU...
- Publication number 20140335411
- Publication date Nov 13, 2014
- Fengming Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Selective etching of copper and copper-barrier materials by an aque...
- Publication number 20140302671
- Publication date Oct 9, 2014
- INTERMOLECULAR INC.
- Anh Duong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHING AGENT FOR COPPER OR COPPER ALLOY
- Publication number 20140238953
- Publication date Aug 28, 2014
- Tsutomu Kojima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCED ISOTROPIC ETCHANT MATERIAL CONSUMPTION AND WASTE GENERATION
- Publication number 20140061158
- Publication date Mar 6, 2014
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PROCESSING A SURFACE
- Publication number 20140038260
- Publication date Feb 6, 2014
- International Business Machines Corporation
- Emmanuel Delamarche
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WET ETCHING METHODS FOR COPPER REMOVAL AND PLANARIZATION IN SEMICON...
- Publication number 20130207030
- Publication date Aug 15, 2013
- Steven T. MAYER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ETCHING COMPOSITION, METHOD OF FORMING A METAL PATTERN AND METHOD O...
- Publication number 20130115770
- Publication date May 9, 2013
- Hong-Sick Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHING LIQUID FOR FILM OF MULTILAYER STRUCTURE CONTAINING COPPER L...
- Publication number 20130105729
- Publication date May 2, 2013
- Mitsubishi Gas Chemical Company, Inc.
- Satoshi Tamai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PROCESSING A SURFACE
- Publication number 20120255930
- Publication date Oct 11, 2012
- International Business Machines Corporation
- Emmanuel Delamarche
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THIN FILM SUPPORT SUBSTRATE FOR USE IN HYDROGEN PRODUCTION FILTER A...
- Publication number 20110315558
- Publication date Dec 29, 2011
- Dai Nippon Insatsu Kabushiki Kaisha
- Hiroshi YAGI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FABRICATION OF SEMICONDUCTOR INTERCONNECT STRUCTURE
- Publication number 20110223772
- Publication date Sep 15, 2011
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THIN FILM SUPPORT SUBSTRATE FOR USE IN HYDROGEN PRODUCTION FILTER A...
- Publication number 20110100828
- Publication date May 5, 2011
- Dai Nippon Insatsu Kabushiki Kaisha
- Hiroshi YAGI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REDUCED ISOTROPIC ETCHANT MATERIAL CONSUMPTION AND WASTE GENERATION
- Publication number 20110056913
- Publication date Mar 10, 2011
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER CHELATING AGENT, COMPOSITION INCLUDING THE AGENT, AND METHOD...
- Publication number 20100256034
- Publication date Oct 7, 2010
- PANTHEON CHEMICAL, INC.
- Nael N. Zaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF CLEANING FIREARMS AND ORDNANCE
- Publication number 20100170532
- Publication date Jul 8, 2010
- BULK CHEMICALS, INC.
- Ted M. Schlosser
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Modulated metal removal using localized wet etching
- Publication number 20100029088
- Publication date Feb 4, 2010
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Wet Etching Methods for Copper Removal and Planarization in Semicon...
- Publication number 20100015805
- Publication date Jan 21, 2010
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Fabrication of semiconductor interconnect structure
- Publication number 20090283499
- Publication date Nov 19, 2009
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR KINETICALLY CONTROLLED ETCHING OF COPPER
- Publication number 20080286701
- Publication date Nov 20, 2008
- IBM CORPORATION (YORKTOWN)
- David L. Rath
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PROCESSING A SURFACE
- Publication number 20080245771
- Publication date Oct 9, 2008
- International Business Machines Corporation
- Emmanuel Delamarche
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

for etching copper or alloys thereof

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nanotextured metal powders for 3D printing of metals

Methods for wet atomic layer etching of copper

Chemical liquid and method for treating object to be treated

Etching chelating agent, manufacturing method thereof, and etching...

Ruthenium etching composition and method

Alkaline cupric chloride etchant for printed circuit board

Superhydrophobic surface arrangement, article compromising same and...

Selective metal/metal oxide etch process

Methods of modifying surfaces of diamond particles, and related dia...

Manufacture method of array substrate and array substrate manufactu...

Removal composition for selectively removing hard mask and methods...

High-efficiency high-quality and safe alkaline cupric chloride etch...

Removal composition for selectively removing hard mask and methods...

Microetching solution for copper, replenishment solution therefor a...

Etching agent for copper or copper alloy

Etching liquid for film of multilayer structure containing copper l...

Method of improving lifetime of etching liquid and yield in Cu-inte...

Wet etching methods for copper removal and planarization in semicon...

Microetching solution for copper, replenishment solution therefor a...

Etching agent for copper or copper alloy

Wet etching methods for copper removal and planarization in semicon...

Reduced isotropic etchant material consumption and waste generation

Selective etching of copper and copper-barrier materials by an aque...

Method for processing a surface

Etching composition, method of forming a metal pattern and method o...

Reduced isotropic etchant material consumption and waste generation

Method for processing a surface

Thin film support substrate for use in hydrogen production filter a...

Modulated metal removal using localized wet etching

Fabrication of semiconductor interconnect structure

Patents Applicationslast 30 patents

ETCHING COMPOSITIONS

AN AQUEOUS BASIC ETCHING COMPOSITION FOR THE TREATMENT OF SURFACES...

ECO-FRIENDLY HYDROPHOBIC OR ULTRAHYDROPHOBIC COATING METHOD

CONTINUOUS ETCHING SYSTEM

CHEMICAL LIQUID AND METHOD FOR TREATING OBJECT TO BE TREATED

HIGH-EFFICIENCY AND ENVIRONMENTAL FRIENDLY ALKALINE COPPER CHLORIDE...

MANUFACTURE METHOD OF ARRAY SUBSTRATE AND ARRAY SUBSTRATE MANUFACTU...

METHOD OF IMPROVING LIFETIME OF ETCHING LIQUID AND YIELD IN CU-INTE...

REMOVAL COMPOSITION FOR SELECTIVELY REMOVING HARD MASK AND METHODS...

SUPERHYDROPHOBIC SURFACE ARRANGEMENT, ARTICLE COMPRISING SAME, AND...

ETCHED SILICON STRUCTURES, METHOD OF FORMING ETCHED SILICON STRUCTU...

Selective etching of copper and copper-barrier materials by an aque...

ETCHING AGENT FOR COPPER OR COPPER ALLOY

REDUCED ISOTROPIC ETCHANT MATERIAL CONSUMPTION AND WASTE GENERATION

METHOD FOR PROCESSING A SURFACE

WET ETCHING METHODS FOR COPPER REMOVAL AND PLANARIZATION IN SEMICON...

ETCHING COMPOSITION, METHOD OF FORMING A METAL PATTERN AND METHOD O...

ETCHING LIQUID FOR FILM OF MULTILAYER STRUCTURE CONTAINING COPPER L...

METHOD FOR PROCESSING A SURFACE

THIN FILM SUPPORT SUBSTRATE FOR USE IN HYDROGEN PRODUCTION FILTER A...

FABRICATION OF SEMICONDUCTOR INTERCONNECT STRUCTURE

THIN FILM SUPPORT SUBSTRATE FOR USE IN HYDROGEN PRODUCTION FILTER A...

REDUCED ISOTROPIC ETCHANT MATERIAL CONSUMPTION AND WASTE GENERATION

COPPER CHELATING AGENT, COMPOSITION INCLUDING THE AGENT, AND METHOD...

METHOD OF CLEANING FIREARMS AND ORDNANCE

Modulated metal removal using localized wet etching

Wet Etching Methods for Copper Removal and Planarization in Semicon...

Fabrication of semiconductor interconnect structure

METHOD FOR KINETICALLY CONTROLLED ETCHING OF COPPER

METHOD FOR PROCESSING A SURFACE