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Multilayer coil component
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Patent number 12,159,750
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Issue date Dec 3, 2024
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Murata Manufacturing Co., Ltd.
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Ryouji Mizobata
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H01 - BASIC ELECTRIC ELEMENTS
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Surface-mount passive component
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Patent number 12,154,709
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Issue date Nov 26, 2024
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Murata Manufacturing Co., Ltd.
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Yoshimasa Yoshioka
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H01 - BASIC ELECTRIC ELEMENTS
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Integrated magnetic assembly
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Patent number 12,148,556
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Issue date Nov 19, 2024
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Texas Instruments Incorporated
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Yiqi Tang
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H01 - BASIC ELECTRIC ELEMENTS
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Coil electronic component
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Patent number 12,148,561
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Issue date Nov 19, 2024
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SAMSUNG ELECTRO-MECHANICS CO., LTD.
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Jung Hyuk Jung
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H01 - BASIC ELECTRIC ELEMENTS
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Wireless charging coil
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Patent number 12,142,418
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Issue date Nov 12, 2024
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A.K. Stamping Company, Inc.
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Arthur Kurz
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H01 - BASIC ELECTRIC ELEMENTS
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Blank for a conduit arrangement
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Patent number 12,134,130
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Issue date Nov 5, 2024
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GKN Driveline International GmbH
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Rolf Cremerius
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B22 - CASTING POWDER METALLURGY
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Package
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Patent number 12,132,074
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Issue date Oct 29, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd
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Wen-Shiang Liao
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H01 - BASIC ELECTRIC ELEMENTS
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Inductor built-in substrate
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Patent number 12,125,626
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Issue date Oct 22, 2024
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Ibiden Co., Ltd.
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Satoru Kawai
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H01 - BASIC ELECTRIC ELEMENTS
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Coil component
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Patent number 12,119,160
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Issue date Oct 15, 2024
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Taiyo Yuden Co., Ltd.
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Natsuko Sato
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H01 - BASIC ELECTRIC ELEMENTS
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Coil component
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Patent number 12,112,879
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Issue date Oct 8, 2024
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SAMSUNG ELECTRO-MECHANICS CO., LTD.
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Chan Yoon
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H01 - BASIC ELECTRIC ELEMENTS
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Coil component
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Patent number 12,112,880
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Issue date Oct 8, 2024
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SAMSUNG ELECTRO-MECHANICS CO., LTD.
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Sung Sik Shin
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H01 - BASIC ELECTRIC ELEMENTS
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Active shield structure
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Patent number 12,114,471
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Issue date Oct 8, 2024
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ARM Limited
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Narayan Prasad Ramachandran
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G06 - COMPUTING CALCULATING COUNTING
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Coil component
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Patent number 12,106,885
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Issue date Oct 1, 2024
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SAMSUNG ELECTRO-MECHANICS CO., LTD.
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Seung Mo Lim
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H01 - BASIC ELECTRIC ELEMENTS
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