for supporting, holding, feeding, conveying or discharging work

Industry

CPC
B28D5/0082

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/0082for supporting, holding, feeding, conveying or discharging work

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Workplate for Y-axis compensation of ingot and Y-axis compensation...
- Patent number 12,275,165
- Issue date Apr 15, 2025
- SK SILTRON CO., LTD.
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for slicing ingot and wire saw
- Patent number 12,186,939
- Issue date Jan 7, 2025
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Kanbayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Edge alignment method
- Patent number 12,151,401
- Issue date Nov 26, 2024
- Disco Corporation
- Atsushi Komatsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for producing semiconductor wafers using a wire saw, wire sa...
- Patent number 12,083,705
- Issue date Sep 10, 2024
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diamond rotors for MAS-NMR
- Patent number 11,999,006
- Issue date Jun 4, 2024
- Massachusetts Institute of Technology
- Prashant Patil
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of silicon carbide wafer, silicon carbide wafe...
- Patent number 11,969,917
- Issue date Apr 30, 2024
- SENIC INC.
- Jung-Gyu Kim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Protective member forming apparatus
- Patent number 11,915,963
- Issue date Feb 27, 2024
- Disco Corporation
- Yoshinori Kakinuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated gemstone feeding
- Patent number 11,731,841
- Issue date Aug 22, 2023
- Sahajanand Technologies Private Limited
- Chirag Oza
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Transfer jig and cutting blade changing method
- Patent number 11,318,573
- Issue date May 3, 2022
- Disco Corporation
- Kazuki Terada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dividing apparatus
- Patent number 11,254,029
- Issue date Feb 22, 2022
- Disco Corporation
- Takayuki Masada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece processing method
- Patent number 11,167,446
- Issue date Nov 9, 2021
- Disco Corporation
- Naoko Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
System and method of cleaving of buried defects
- Patent number 11,137,356
- Issue date Oct 5, 2021
- SELA SEMICONDUCTOR ENGINEERING LABORATORIES LTD.
- Vladimir Zheleznyak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Diamond wire cutting method for crystal boules
- Patent number 10,994,443
- Issue date May 4, 2021
- Comadur S.A.
- Naser Berisha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting apparatus
- Patent number 10,974,356
- Issue date Apr 13, 2021
- Disco Corporation
- Kazuki Terada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Incident radiation induced subsurface damage for controlled crack p...
- Patent number 10,940,611
- Issue date Mar 9, 2021
- Halo Industries, Inc.
- Andrei Teodor Iancu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Blade mounting and dismounting jig, blade mounting and dismounting...
- Patent number 10,933,500
- Issue date Mar 2, 2021
- Disco Corporation
- Hayato Kiuchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ingot clamping device and wire sawing apparatus for slicing ingot h...
- Patent number 10,882,214
- Issue date Jan 5, 2021
- SKSILTRON CO., LTD.
- Woo Tae Kim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Chuck table correction method and cutting apparatus
- Patent number 10,847,398
- Issue date Nov 24, 2020
- Disco Corporation
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer producing apparatus
- Patent number 10,840,116
- Issue date Nov 17, 2020
- Disco Corporation
- Kentaro Iizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for dividing workpiece
- Patent number 10,818,523
- Issue date Oct 27, 2020
- Disco Corporation
- Chris Mihai
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting blade mounting method
- Patent number 10,759,088
- Issue date Sep 1, 2020
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor sawing method and system
- Patent number 10,703,016
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Chi-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for slicing workpiece and wire saw
- Patent number 10,518,380
- Issue date Dec 31, 2019
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting system and method for a cutting system
- Patent number 10,507,593
- Issue date Dec 17, 2019
- D. SWAROVSKI KG
- Johannes Schweigl
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Ingot pressing apparatus and ingot slicing apparatus including the...
- Patent number 10,486,333
- Issue date Nov 26, 2019
- SK SILTRON CO., LTD.
- Su In Jeon
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus for laminating a tape film on a substrate and a system of...
- Patent number 10,418,259
- Issue date Sep 17, 2019
- Samsung Electronics Co., Ltd.
- Youngmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire saw device and workpiece cutting method
- Patent number 10,399,249
- Issue date Sep 3, 2019
- Sumco Corporation
- Masaki Fukuda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire sawing apparatus
- Patent number 10,391,673
- Issue date Aug 27, 2019
- SK SILTRON CO., LTD.
- Ji Won Jeon
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for slicing workpiece and workpiece holder
- Patent number 10,350,788
- Issue date Jul 16, 2019
- Shin-Etsu Handotai Co., Ltd.
- Atsuo Uchiyama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Gemstone positioning fixture
- Patent number 10,040,161
- Issue date Aug 7, 2018
- GemEx Systems, Inc.
- Randall M. Wagner
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE CUTTING SYSTEM AND METHOD
- Publication number 20250083359
- Publication date Mar 13, 2025
- SEMES CO., LTD.
- Changhoon OK
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
HOLDING MECHANISM OF SLICER, CRYSTAL BAR CONVEYING STRUCTURE AND SL...
- Publication number 20250073956
- Publication date Mar 6, 2025
- ZHEJIANG JINGSHENG M & E CO., LTD
- Jianwei CAO
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
DIAMOND WIRE MULTI-WIRE CUTTING MACHINE AND CUTTING DEVICE THEREOF,...
- Publication number 20250058499
- Publication date Feb 20, 2025
- Hunan Yiyuan New Material Technology Co., Ltd
- Jiawei YANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CUTTING DEVICE AND MULTI-WIRE CUTTING MACHINE INCLUDING CUTTING DEVICE
- Publication number 20250058500
- Publication date Feb 20, 2025
- Hunan Yiyuan New Material Technology Co., Ltd
- Jiawei YANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CUTTING MONOCRYSTALLINE SILICON SQUARE ROD
- Publication number 20250033247
- Publication date Jan 30, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Jianhua ZHANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
LOWER JACKING MEMBER, WIRE WITHDRAWAL METHOD, AND SQUARING MACHINE
- Publication number 20250026041
- Publication date Jan 23, 2025
- FUZHOU SKYWIRETECH CO.,LTD.
- Haiwei LI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHODS FOR CONTROLLING WAFER BREAKAGE DURING INGOT SLICING OPERATIONS
- Publication number 20250026042
- Publication date Jan 23, 2025
- GLOBALWAFERS CO., LTD.
- Jung-Chiang Liao
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
GROUP III NITRIDE SINGLE CRYSTAL SUBSTRATE PRODUCING METHOD, AND AL...
- Publication number 20250011971
- Publication date Jan 9, 2025
- Tokuyama Corporation
- Masayuki FUKUDA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF MANUFACTURING WAFER AND SEPARATING APPARATUS
- Publication number 20250010519
- Publication date Jan 9, 2025
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cutting Device of Silicon Rod Cutting System, and Silicon Rod Cutti...
- Publication number 20240416557
- Publication date Dec 19, 2024
- QINGDAO GAOCE TECHNOLOGY CO., LTD
- Shengen HOU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CUTTING APPARATUS AND ITS HOLDING DEVICE
- Publication number 20240293948
- Publication date Sep 5, 2024
- National Central University
- YUN-CHI CHUNG
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
METAL WIRE AND SAW WIRE
- Publication number 20240286314
- Publication date Aug 29, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tomohiro KANAZAWA
- G01 - MEASURING TESTING
Information Patent Application
BRICK LOADING/UNLOADING APPARATUS AND METHOD
- Publication number 20240269893
- Publication date Aug 15, 2024
- Hanwha Corporation
- Jong Won LEE
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SYSTEM AND METHOD FOR SQUARING INGOT
- Publication number 20240253271
- Publication date Aug 1, 2024
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Xiaopeng WANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...
- Publication number 20240246260
- Publication date Jul 25, 2024
- Siltronic AG
- Axel BEYER
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR FIXING A MATERIAL BLOCK FOR MECHANICAL MACHINING
- Publication number 20240198559
- Publication date Jun 20, 2024
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Hartmut SCHWABE
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR CUTTING SUBSTRATE ELEMENTS
- Publication number 20230302683
- Publication date Sep 28, 2023
- STMicroelectronics (Grenoble 2) SAS
- Melodie CHAPERON
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
ASC PROCESS AUTOMATION DEVICE
- Publication number 20230154767
- Publication date May 18, 2023
- SK SILTRON CO., LTD.
- Ho Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEX PHOTONICS CIRCUIT FABRICATION
- Publication number 20230042659
- Publication date Feb 9, 2023
- META PLATFORMS, INC.
- Pradip Sairam Pichumani
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
MANUFACTURING METHOD OF SILICON CARBIDE WAFER, SILICON CARBIDE WAFE...
- Publication number 20220219354
- Publication date Jul 14, 2022
- SENIC Inc.
- Jung-Gyu KIM
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
EDGE TRIMMING METHOD
- Publication number 20220184768
- Publication date Jun 16, 2022
- Disco Corporation
- Takashi OKAMURA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR CUTTING SUBSTRATE WAFER FROM INDIUM PHOSPHIDE CRYSTAL BAR
- Publication number 20220072660
- Publication date Mar 10, 2022
- THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
- Yanlei SHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE MEMBER FORMING APPARATUS
- Publication number 20220059390
- Publication date Feb 24, 2022
- Disco Corporation
- Yoshinori KAKINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...
- Publication number 20220040882
- Publication date Feb 10, 2022
- Siltronic AG
- Axel BEYER
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFERS BY MEANS OF A WIRE SAW
- Publication number 20220040883
- Publication date Feb 10, 2022
- Siltronic AG
- Axel BEYER
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CRYSTAL INGOT CUTTING DEVICE AND CRYSTAL INGOT CUTTING METHOD
- Publication number 20220024073
- Publication date Jan 27, 2022
- GLOBALWAFERS CO., LTD.
- Ching-Shan Lin
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SLICING WORKPIECE AND WIRE SAW
- Publication number 20220016802
- Publication date Jan 20, 2022
- Shin-Etsu Handotai Co., Ltd.
- Kenji Kobayashi
- B24 - GRINDING POLISHING
Information Patent Application
MULTI-LINE CUTTING METHOD, MULTI-LINE CUTTING APPARATUS AND USE THE...
- Publication number 20220009126
- Publication date Jan 13, 2022
- FUJIAN NORSTEL MATERIAL TECHNOLOGIES CO., LTD
- Bofan LAI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
FEEDING UNIT FOR A GEMSTONE MACHINE
- Publication number 20210387378
- Publication date Dec 16, 2021
- Sahajanand Technologies Private Limited
- Chirag OZA
- B24 - GRINDING POLISHING
Information Patent Application
AUTOMATED GEMSTONE FEEDING
- Publication number 20210387811
- Publication date Dec 16, 2021
- Sahajanand Technologies Private Limited
- Chirag Oza
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

for supporting, holding, feeding, conveying or discharging work

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Workplate for Y-axis compensation of ingot and Y-axis compensation...

Method for slicing ingot and wire saw

Edge alignment method

Method for producing semiconductor wafers using a wire saw, wire sa...

Diamond rotors for MAS-NMR

Manufacturing method of silicon carbide wafer, silicon carbide wafe...

Protective member forming apparatus

Automated gemstone feeding

Transfer jig and cutting blade changing method

Wafer dividing apparatus

Workpiece processing method

System and method of cleaving of buried defects

Diamond wire cutting method for crystal boules

Cutting apparatus

Incident radiation induced subsurface damage for controlled crack p...

Blade mounting and dismounting jig, blade mounting and dismounting...

Ingot clamping device and wire sawing apparatus for slicing ingot h...

Chuck table correction method and cutting apparatus

Wafer producing apparatus

Apparatus for dividing workpiece

Cutting blade mounting method

Semiconductor sawing method and system

Method for slicing workpiece and wire saw

Cutting system and method for a cutting system

Ingot pressing apparatus and ingot slicing apparatus including the...

Apparatus for laminating a tape film on a substrate and a system of...

Wire saw device and workpiece cutting method

Wire sawing apparatus

Method for slicing workpiece and workpiece holder

Gemstone positioning fixture

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE CUTTING SYSTEM AND METHOD

HOLDING MECHANISM OF SLICER, CRYSTAL BAR CONVEYING STRUCTURE AND SL...

DIAMOND WIRE MULTI-WIRE CUTTING MACHINE AND CUTTING DEVICE THEREOF,...

CUTTING DEVICE AND MULTI-WIRE CUTTING MACHINE INCLUDING CUTTING DEVICE

CUTTING MONOCRYSTALLINE SILICON SQUARE ROD

LOWER JACKING MEMBER, WIRE WITHDRAWAL METHOD, AND SQUARING MACHINE

METHODS FOR CONTROLLING WAFER BREAKAGE DURING INGOT SLICING OPERATIONS

GROUP III NITRIDE SINGLE CRYSTAL SUBSTRATE PRODUCING METHOD, AND AL...

METHOD OF MANUFACTURING WAFER AND SEPARATING APPARATUS

Cutting Device of Silicon Rod Cutting System, and Silicon Rod Cutti...

CUTTING APPARATUS AND ITS HOLDING DEVICE

METAL WIRE AND SAW WIRE

BRICK LOADING/UNLOADING APPARATUS AND METHOD

SYSTEM AND METHOD FOR SQUARING INGOT

METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...

METHOD FOR FIXING A MATERIAL BLOCK FOR MECHANICAL MACHINING

METHOD FOR CUTTING SUBSTRATE ELEMENTS

ASC PROCESS AUTOMATION DEVICE

COMPLEX PHOTONICS CIRCUIT FABRICATION

MANUFACTURING METHOD OF SILICON CARBIDE WAFER, SILICON CARBIDE WAFE...

EDGE TRIMMING METHOD

METHOD FOR CUTTING SUBSTRATE WAFER FROM INDIUM PHOSPHIDE CRYSTAL BAR

PROTECTIVE MEMBER FORMING APPARATUS

METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...

METHOD FOR PRODUCING SEMICONDUCTOR WAFERS BY MEANS OF A WIRE SAW

CRYSTAL INGOT CUTTING DEVICE AND CRYSTAL INGOT CUTTING METHOD

METHOD FOR SLICING WORKPIECE AND WIRE SAW

MULTI-LINE CUTTING METHOD, MULTI-LINE CUTTING APPARATUS AND USE THE...

FEEDING UNIT FOR A GEMSTONE MACHINE

AUTOMATED GEMSTONE FEEDING