from cyanide baths

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CPC
C25D3/40

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D3/00Electroplating: Baths therefor

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C25D3/40from cyanide baths

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Patents Grantslast 30 patents

Information Patent Grant
Reactor for electrochemical deposition
- Patent number 12,049,704
- Issue date Jul 30, 2024
- FABRIC8LABS, INC.
- David Forrest Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Transformer helix winding production
- Patent number 11,935,693
- Issue date Mar 19, 2024
- Enphase Energy, Inc.
- Michael J. Harrison
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Transformer helix winding production
- Patent number 11,657,963
- Issue date May 23, 2023
- Enphase Energy, Inc.
- Michael J. Harrison
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical layer deposition
- Patent number 11,591,705
- Issue date Feb 28, 2023
- FABRIC8LABS, INC.
- David Forrest Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Reactor for layer deposition by controllable anode array
- Patent number 11,396,710
- Issue date Jul 26, 2022
- FABRIC8 LABS, INC.
- David Forrest Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical layer deposition by controllable anode array
- Patent number 10,975,485
- Issue date Apr 13, 2021
- Fabric8Labs, Inc.
- David Forrest Pain
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Washing assembly for sheet metals for producing double-layered copp...
- Patent number 10,954,599
- Issue date Mar 23, 2021
- NET BORU SANAYI VE DIS TICARET KOLLEKTIF SIRKETI BORA SAMAN VE ORTAGI
- Bora Saman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for copper plating through silicon vias using wet wafer back...
- Patent number 10,879,116
- Issue date Dec 29, 2020
- Applied Materials, Inc.
- Roman Gouk
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal deposition methods for forming bimetallic structures, batteri...
- Patent number 10,714,756
- Issue date Jul 14, 2020
- GM Global Technology Operations LLC
- Fang Dai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plated material and connecting terminal using same
- Patent number 10,640,880
- Issue date May 5, 2020
- Oriental Electro Plating Corporation
- Hiroyoshi Takahashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for electrochemical additive manufacturing
- Patent number 10,465,307
- Issue date Nov 5, 2019
- Fabric8Labs, Inc.
- David Forrest Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Stainless-steel foil for separator of polymer electrolyte fuel cell
- Patent number 10,431,832
- Issue date Oct 1, 2019
- JFE Steel Corporation
- Takayoshi Yano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing plated material, and plated material
- Patent number 10,351,965
- Issue date Jul 16, 2019
- Oriental Electro Plating Corporation
- Hiroyoshi Takahashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Carrier-attached copper foil, laminate, printed-wiring board and me...
- Patent number 10,201,092
- Issue date Feb 5, 2019
- JX Nippon Mining & Metals Corporation
- Tomota Nagaura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Three dimensional additive manufacturing of metal objects by stereo...
- Patent number 9,777,385
- Issue date Oct 3, 2017
- Fabric8Labs, Inc.
- David Morgan Wirth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for metal plating comprising suppressing agent for void...
- Patent number 9,617,647
- Issue date Apr 11, 2017
- BASF SE
- Cornelia Roeger-Goepfert
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Additives for producing copper electrodeposits having low oxygen co...
- Patent number 9,243,339
- Issue date Jan 26, 2016
- Trevor Pearson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leveler compounds
- Patent number 8,506,788
- Issue date Aug 13, 2013
- Rohm and Haas Electronic Materials LLC
- Deyan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leveler compounds
- Patent number 8,262,891
- Issue date Sep 11, 2012
- Rohm and Haas Electronic Materials LLC
- Deyan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of chrome plating magnesium and magnesium alloys
- Patent number 8,152,985
- Issue date Apr 10, 2012
- Arlington Plating Company
- Richard Lee Macary
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sn-plated copper or Sn-plated copper alloy having excellent heat re...
- Patent number 8,142,906
- Issue date Mar 27, 2012
- Kobe Steel, Ltd.
- Kouichi Taira
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of preparing copper plating layer having high adhesion to ma...
- Patent number 7,368,047
- Issue date May 6, 2008
- Byung Chul Park
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3928148
- Patent number 3,928,148
- Issue date Dec 23, 1975
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3790451
- Patent number 3,790,451
- Issue date Feb 5, 1974
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3532610
- Patent number 3,532,610
- Issue date Oct 6, 1970
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3518168
- Patent number 3,518,168
- Issue date Jun 30, 1970
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3497530
- Patent number 3,497,530
- Issue date Feb 24, 1970
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3480524
- Patent number 3,480,524
- Issue date Nov 25, 1969
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3455014
- Patent number 3,455,014
- Issue date Jul 15, 1969
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3351656
- Patent number 3,351,656
- Issue date Nov 7, 1967
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Method for Filing at least One Hole formed in a Printed Circuit Boa...
- Publication number 20230403797
- Publication date Dec 14, 2023
- ITC Intercircuit Electronic GmbH
- Hubertus Hein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reactor for Electrochemical Deposition
- Publication number 20230304179
- Publication date Sep 28, 2023
- FABRIC8LABS, INC.
- David Forrest Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TRANSFORMER HELIX WINDING PRODUCTION
- Publication number 20230215626
- Publication date Jul 6, 2023
- Enphase Energy, Inc.
- Michael J. HARRISON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON-NANOTUBES COPPER COMPOSITE CONDUCTORS
- Publication number 20220223314
- Publication date Jul 14, 2022
- Technion Research & Development Foundation Limited
- Yair EIN-ELI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REACTOR FOR LAYER DEPOSITION BY CONTROLLABLE ANODE ARRAY
- Publication number 20220081792
- Publication date Mar 17, 2022
- FABRIC8LABS, INC.
- David Forrest Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TRANSFORMER HELIX WINDING PRODUCTION
- Publication number 20220084747
- Publication date Mar 17, 2022
- Enphase Energy, Inc.
- Michael J. HARRISON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCHEMICAL LAYER DEPOSITION
- Publication number 20210301414
- Publication date Sep 30, 2021
- Fabric8Labs, Inc.
- David Forrest Pain
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
ELECTROCHEMICAL LAYER DEPOSITION BY CONTROLLABLE ANODE ARRAY
- Publication number 20190301034
- Publication date Oct 3, 2019
- Fabric8Labs, Inc.
- David Forrest Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATED MATERIAL AND CONNECTING TERMINAL USING SAME
- Publication number 20180112322
- Publication date Apr 26, 2018
- Oriental Electro Plating Corporation
- Hiroyoshi TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THREE DIMENSIONAL ADDITIVE MANUFACTURING OF METAL OBJECTS BY STEREO...
- Publication number 20170145584
- Publication date May 25, 2017
- Fabric8Labs, Inc.,
- David Morgan Wirth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metallic Materials with Embedded Luminescent Particles
- Publication number 20170106627
- Publication date Apr 20, 2017
- The Royal Mint Limited
- Jeffrey L. Conroy
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metallic Materials with Embedded Luminescent Particles
- Publication number 20170107637
- Publication date Apr 20, 2017
- The Royal Mint Limited
- Jeffrey L. Conroy
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STAINLESS-STEEL FOIL FOR SEPARATOR OF POLYMER ELECTROLYTE FUEL CELL
- Publication number 20170033372
- Publication date Feb 2, 2017
- JFE STEEL CORPORATION
- Takayoshi YANO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Carrier-Attached Copper Foil, Laminate, Printed-Wiring Board And Me...
- Publication number 20160353581
- Publication date Dec 1, 2016
- JX NIPPON MINING & METALS CORPORATION
- Tomota Nagaura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING PLATED MATERIAL AND PLATED MATERIAL
- Publication number 20160348260
- Publication date Dec 1, 2016
- ORIENTAL ELECTRO PLATING CORPORATION
- Hiroyoshi TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Hybrid Corrosion Inhibiting and Bio-Functional Coatings for Magnesi...
- Publication number 20160271301
- Publication date Sep 22, 2016
- Wichita State University
- Anil Mahapatro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTE, METHOD OF FORMING A COPPER LAYER AND METHOD OF FORMING...
- Publication number 20160168739
- Publication date Jun 16, 2016
- INFINEON TECHNOLOGIES AG
- Werner ROBL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Plating Fine Grain Copper Deposit on Metal Substrate
- Publication number 20150197870
- Publication date Jul 16, 2015
- Ali A. Farvid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Additives for Producing Copper Electrodeposits Having Low Oxygen Co...
- Publication number 20130313119
- Publication date Nov 28, 2013
- Trevor Pearson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR FABRICATING THIN FILM SOLAR CELLS
- Publication number 20130230933
- Publication date Sep 5, 2013
- Delin Li
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELER COMPOUNDS
- Publication number 20130001088
- Publication date Jan 3, 2013
- Rohm and Haas Electronic Materials L.L.C.
- Deyan Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID...
- Publication number 20120118750
- Publication date May 17, 2012
- BASF SE
- Cornelia Roeger-Goepfert
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SN-PLATED COPPER OR SN-PLATED COPPER ALLOY HAVING EXCELLENT HEAT RE...
- Publication number 20100247959
- Publication date Sep 30, 2010
- Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- Kouichi TAIRA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE-ACTIVE CONDITIONAL INHIBITORS FOR THE ELECTROPLATING OF COP...
- Publication number 20100243467
- Publication date Sep 30, 2010
- Daniel Michelet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of Chrome Plating Magnesium and Magnesium Alloys
- Publication number 20090317556
- Publication date Dec 24, 2009
- Arlington Plating Company
- Richard Lee Macary
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of preparing copper plating layer having high adhesion to ma...
- Publication number 20070108060
- Publication date May 17, 2007
- PangRim Co., Ltd.
- Byung Chul Park
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Leveler compounds
- Publication number 20070084732
- Publication date Apr 19, 2007
- Rohm and Haas Electronic Materials L.L.C.
- Deyan Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Preferred copper plated finish and method of making same
- Publication number 20070071998
- Publication date Mar 29, 2007
- Vinay Gupta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper strike plating bath
- Publication number 20060027462
- Publication date Feb 9, 2006
- Shinko Electric Industries Co., Ltd.
- Yoko Ogihara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

from cyanide baths

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reactor for electrochemical deposition

Transformer helix winding production

Transformer helix winding production

Electrochemical layer deposition

Reactor for layer deposition by controllable anode array

Electrochemical layer deposition by controllable anode array

Washing assembly for sheet metals for producing double-layered copp...

Method for copper plating through silicon vias using wet wafer back...

Metal deposition methods for forming bimetallic structures, batteri...

Plated material and connecting terminal using same

Apparatus for electrochemical additive manufacturing

Stainless-steel foil for separator of polymer electrolyte fuel cell

Method for producing plated material, and plated material

Carrier-attached copper foil, laminate, printed-wiring board and me...

Three dimensional additive manufacturing of metal objects by stereo...

Composition for metal plating comprising suppressing agent for void...

Additives for producing copper electrodeposits having low oxygen co...

Leveler compounds

Leveler compounds

Method of chrome plating magnesium and magnesium alloys

Sn-plated copper or Sn-plated copper alloy having excellent heat re...

Method of preparing copper plating layer having high adhesion to ma...

3928148

3790451

3532610

3518168

3497530

3480524

3455014

3351656

Patents Applicationslast 30 patents

Method for Filing at least One Hole formed in a Printed Circuit Boa...

Reactor for Electrochemical Deposition

TRANSFORMER HELIX WINDING PRODUCTION

CARBON-NANOTUBES COPPER COMPOSITE CONDUCTORS

REACTOR FOR LAYER DEPOSITION BY CONTROLLABLE ANODE ARRAY

TRANSFORMER HELIX WINDING PRODUCTION

ELECTROCHEMICAL LAYER DEPOSITION

ELECTROCHEMICAL LAYER DEPOSITION BY CONTROLLABLE ANODE ARRAY

PLATED MATERIAL AND CONNECTING TERMINAL USING SAME

THREE DIMENSIONAL ADDITIVE MANUFACTURING OF METAL OBJECTS BY STEREO...

Metallic Materials with Embedded Luminescent Particles

Metallic Materials with Embedded Luminescent Particles

STAINLESS-STEEL FOIL FOR SEPARATOR OF POLYMER ELECTROLYTE FUEL CELL

Carrier-Attached Copper Foil, Laminate, Printed-Wiring Board And Me...

METHOD FOR MANUFACTURING PLATED MATERIAL AND PLATED MATERIAL

Hybrid Corrosion Inhibiting and Bio-Functional Coatings for Magnesi...

ELECTROLYTE, METHOD OF FORMING A COPPER LAYER AND METHOD OF FORMING...

Method for Plating Fine Grain Copper Deposit on Metal Substrate

Additives for Producing Copper Electrodeposits Having Low Oxygen Co...

METHODS FOR FABRICATING THIN FILM SOLAR CELLS

LEVELER COMPOUNDS

COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID...

SN-PLATED COPPER OR SN-PLATED COPPER ALLOY HAVING EXCELLENT HEAT RE...

SURFACE-ACTIVE CONDITIONAL INHIBITORS FOR THE ELECTROPLATING OF COP...

Method of Chrome Plating Magnesium and Magnesium Alloys

Method of preparing copper plating layer having high adhesion to ma...

Leveler compounds

Preferred copper plated finish and method of making same

Copper strike plating bath