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Grinding tools with incorporated marking device

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Industry

  • CPC
  • B24D2205/00
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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24DTOOLS FOR GRINDING, BUFFING, OR SHARPENING

Current Industry

B24D2205/00Grinding tools with incorporated marking device
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Abrasive tool and use of such an abrasive tool
    • Patent number 11,850,706
    • Issue date Dec 26, 2023
    • Lukas-Erzett Vereinigte Schleif-und Fräswerkzeugfabriken GmbH & Co. KG
    • Gerd Fischer
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Method and system for monitoring polishing pad
    • Patent number 11,407,082
    • Issue date Aug 9, 2022
    • Semiconductor Manufacturing International (Beijing) Corporation
    • Chao Shi
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer polishing pad and using method thereof
    • Patent number 10,722,998
    • Issue date Jul 28, 2020
    • United Microelectronics Corp.
    • Li-Chieh Hsu
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Printed abrasive article
    • Patent number 10,245,705
    • Issue date Apr 2, 2019
    • 3M Innovative Properties Company
    • Paul D. Graham
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Polishing pad
    • Patent number 10,155,296
    • Issue date Dec 18, 2018
    • Semiconductor Manufacturing International (Beijing) Corporation
    • Chao Shi
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Printed abrasive article
    • Patent number 10,155,300
    • Issue date Dec 18, 2018
    • 3M Innovative Properties Company
    • Paul D. Graham
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Knuckle deburring cutter and machining method of knuckle
    • Patent number 10,118,235
    • Issue date Nov 6, 2018
    • BWI (Shanghai) Co., Ltd.
    • Xiaoye Qian
    • B24 - GRINDING POLISHING

Patents Applicationslast 30 patents